(27) GSM-DCS Diplexer (SCI-501 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 2.1 mm x 1.0 mm (wirebond) 2.0 mm x 1.3 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-501F (Flip Chip) SCI-501W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-501W/F is a diplexer for GSM/DCS band applications. The diplexer has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the diplexer are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS Specification Unit Min. Typical Max. Pass Band 1 MHz 824 915 Pass Band 2 MHz 1710 1980 Insertion Loss, Band 1 dB 0.5 Insertion Loss, Band 2 dB 0.8 Return Loss, Band 1 dB 20 Return Loss, Band 2 dB 15 Isolation, Band 1 at Band 2 dB 20 Isolation, Band 2 at Band 1 dB Size mm 25 2.1 x 1.0 (WB) 2.0 x 1.3 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 Return Loss (dB) Insertion Loss (dB) 0 -10 -20 -30 -10 -20 -30 -40 -40 0 1 2 3 4 5 0 6 1 2 3 4 5 6 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-501W (Wirebond) SCI-501F (Flip Chip) Pad SCI-501W Signal SCI-501F Signal 1 Output-1 (Pass Band 1) Ground 2 Ground Input 3 Input Ground 4 Ground Output-1 (Pass Band 1) 5 Output-2 (Pass Band 2) Output-2 6 - Output-2 (Pass Band 2) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 56 All rights reserved. Rev 02/2009