SCI-402

(26) 802.11a Band Pass Filter (SCI-402 W/F)
FEATURES
• Passive integration on silicon substrate
• Low insertion loss in pass band
• Small size: 1.4 mm x 1.1 mm (wirebond)
1.5 mm x 1.2 mm (flip chip)
• Pb-free solder bump
• Low profile: 0.25 mm height (wirebond)
0.40 mm height (flip chip)
• Directly attachable on PCB or flipped on PCB
• Operating temperature: -40℃ to +85℃
• Storage temperature: -40℃ to +85℃
SCI-402F (Flip Chip)
SCI-402W (Wirebond)
DESCRIPTION
STATS ChipPAC’s SCI-402W/F is a band pass filter
(BPF) for 802.11a band applications. The BPF has low
pass–band insertion loss and small size. It is
composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a
silicon substrate using STATS ChipPAC’s IPD
(Integrated Passive Device) process. The pad or bump
size and pitch of the BPF are selected so that the
device can be mounted directly on a PCB or laminate
substrate using conventional wirebonding or surface
mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP
applications.
ELECTRICAL SPECIFICATIONS
Specification
Pass Band
Insertion Loss
Unit
Min.
MHz
5115
dB
Typical
5825
1.0
Return Loss
dB
15
Attenuation, 2450 MHz
dB
40
Attenuation, 1100 MHz
dB
Size
mm
Max.
40
1.4 x 1.1 (WB)
1.5 x 1.2 (FC)
DIMENSIONS
STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no
circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the
information at any time and without notice.
0
0
-10
-10
Return Loss (dB)
Insertion Loss (dB)
TYPICAL CHARACTERISTICS
-20
-30
-40
-20
-30
-40
-50
-50
0
2
4
6
8
10
12
0
14
2
4
6
8
10
12
14
Frequency (GHz)
Frequency (GHz)
ASSEMBLY DRAWING / MECHANICAL OUTLINE
SCI-402W (Wirebond)
SCI-402F (Flip Chip)
Pad
SCI-402W Signal
SCI-402F Signal
1
Input
Ground
2
Ground
Output
3
Output
Ground
4
Ground
Input
NOTES
All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room
temperature. For best results, ground plane directly beneath the device should be in the top metal layer.
Refer to “Appendix A” for:
• Pad sizes and typical wirebond length used in the wirebonded IPD products.
• Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD
products.
www.statschippac.com
54
All rights reserved. Rev 02/2009