SecondEdi t i on STATS ChipPAC IPD Products Databook 2nd Edition Copyright 2009 www.statschippac.com i All rights reserved. Rev 02/2009 Table of Contents Introduction 1) SCI-101 W/F 2) SCI-102 W/F 3) SCI-103 W/F 4) SCI-104 W/F 5) SCI-105 W/F 6) SCI-106 W/F 7) SCI-107 W/F 8) SCI-108 W/F 9) SCI-109 W/F 10) SCI-110 W/F 11) SCI-111 W/F 12) SCI-112 W/F 13) SCI-113 W/F 14) SCI-114 W/F 15) SCI-201 W/F 16) SCI-202 W/F 17) SCI-203 W/F 18) SCI-301 W/F 19) SCI-302 W/F 20) SCI-303 W/F 21) SCI-304 W/F 22) SCI-305 W/F 23) SCI-306 W/F 24) SCI-307 F1/F2 25) SCI-401 W/F 26) SCI-402 W/F 27) SCI-501 W/F 28) SCI-502 W/F 29) SCI-503 W/F 30) SCI-601 W/F 31) SCI-602 W/F 32) SCI-701 W/F 33) SCI-702 W/F 34) SCI-801 W/F 35) SCI-802 W/F 36) SCI-901 W/F 37) SCI-902 W/F Appendix A www.statschippac.com GSM BAND BALUN DCS BAND BALUN WLAN 802.11B/G BAND BALUN WLAN 802.11A BAND BALUN GSM BAND BALUN GSM BAND BALUN DCS BAND BALUN DCS BAND BALUN 802.11b BAND BALUN 802.11b BAND BALUN 802.11a BAND BALUN 802.11a BAND BALUN UWB BAND BALUN UWB BAND BALUN GSM BAND LOW PASS FILTER DCS BAND LOW PASS FILTER GSM BAND LOW PASS FILTER 802.11B/G BAND PASS FILTER 802.11B/G BAND PASS FILTER 802.11B/G BAND PASS FILTER 802.11B/G BAND PASS FILTER 802.11B/G BAND PASS FILTER UWB BAND PASS FILTER UWB BAND PASS FILTER 802.11A BAND PASS FILTER 802.11A BAND PASS FILTER GSM-DCS DIPLEXER WLAN DIPLEXER WLAN DIPLEXER WiMAX BAND BALANCED FILTER WiMAX BAND BALANCED FILTER GSM BAND LOSS PASS FILTER WITH COUPLER DCS BAND LOSS PASS FILTER WITH COUPLER 802.11b BAND POWER DIVIDER 802.11a BAND POWER DIVIDER GSM BAND BALUN WITH COUPLER DCS BAND BALUN WITH COUPLER ii 2 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 73 75 77 All rights reserved. Rev 02/2009 www.statschippac.com 1 All rights reserved. Rev 02/2009 Introduction In the wireless market where there is intense pressure to optimize size, performance and cost, passive integration technology offers significant advantages for applications such as GSM/DCS and CDMA cellular phones, Wireless LAN 802.11 a/b/g and WiMax systems, primarily in RF power amplifiers and front-end modules (FEM) which make up the critical parts of those radio systems. Individual passive devices, produced using conventional ceramic technology, are often limited in terms of height profiles and form-factors. However, by integrating and fabricating passive devices at the silicon wafer level, STATS ChipPAC is able to achieve Integrated Passive Devices (IPD), which are significantly smaller, thinner and with higher performance than standard discrete passive devices. STATS ChipPAC has implemented copper metallization to achieve superior performance in terms of insertion loss and miniaturization. STATS ChipPAC’s process is capable of depositing 8 microns or more of copper on a silicon wafer. This reduces the loss in the RF signal transmission path, thereby improving battery performance of the wireless system and increasing coverage. STATS ChipPAC has established a library of standard IPDs, which can be very efficiently used in RF SiP products, along with ICs made from other technologies. Both wirebonding and flip chip version IPDs are available from our process. Custom designs can also be made to optimize performance for specific packages, such as QFN, LFBGA and FLGA. Library elements are now available for low pass filters (LPF), band pass filters (BPF), baluns and diplexers at various frequencies, as shown in this databook. STATS ChipPAC provides the highest level integration of wireless systems. With leading edge technology in Chip Scale Module Package (CSMP), IPD, 3D packaging and a comprehensive RF solutions portfolio, including wafer sort, design, assembly, RF test and supply chain management, STATS ChipPAC offers RF semiconductor companies a complete turnkey solution and distinct competitive advantage in their markets. www.statschippac.com 2 All rights reserved. Rev 02/2009 (1) GSM Band Balun (SCI-101 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.1 mm x 1.3 mm (wirebond) 1.2 mm x 1.5 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-101W/F is a balun for GSM band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-101W (Wirebond) SCI-101F (Flip Chip) ELECTRICAL SPECIFICATIONS Specification Pass Band Unit Min. MHz 824 Insertion Loss dB Return Loss dB Differential Impedance Typical Max. 915 1.0 15 Ohm 20 100 Amplitude Imbalance dB Phase Imbalance deg 5.0 0.4 10.0 Size mm 1.1 x 1.3 (WB) 1.2 x 1.5 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS Amplitude Imbalance (dB) Insertion Loss (dB) 0 -5 -10 -15 -20 -25 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 1 0 -1 0.8 0.9 Frequency (GHz) 1.1 Frequency (GHz) Phase Imbalance (deg) 0 Return Loss (dB) 1.0 -10 -20 190 180 170 -30 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.8 2.2 0.9 1.0 1.1 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-101W (Wirebond) SCI-101F (Flip Chip) Pad SCI-101W Signal 1 Ground SCI-101F Signal Bias 2 Unbalanced Unbalanced 3 Bias Ground 4 Balanced (-) Balanced (+) 5 Balanced (+) Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 4 All rights reserved. Rev 02/ 2009 (2) DCS Band Balun (SCI-102 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 0.8 mm x 1.1 mm (wirebond) 1.2 mm x 1.1 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-102W/F is a balun for DCS band applications. The balun has low pass–band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wire-bonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-102F (Flip Chip) SCI-102W (Wirebond) ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Return Loss Differential Impedance Unit Min. MHz 1710 dB dB dB Phase Imbalance deg Size mm Max. 1980 0.8 10 Ohm Amplitude Imbalance Typical 15 100 0.2 0.65 5.0 0.8 x 1.1 (WB) 1.2 x 1.1 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 1 Amplitude Imbalance (dB) Insertion Loss (dB) 0 -10 -20 0 -1 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 1.6 4.0 1.7 Frequency (GHz) 1.9 2.0 1.9 2.0 190 Phase Imbalance (deg) 0 Return Loss (deg) 1.8 Frequency (GHz) -10 -20 -30 -40 180 170 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1.6 1.7 Frequency (GHz) 1.8 Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-102W (Wirebond) SCI-102F (Flip Chip) Pad SCI-102W Signal 1 Ground SCI-102F Signal Bias 2 Unbalanced Unbalanced 3 Bias Ground 4 Balanced (-) Balanced (+) 5 Balanced (+) Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 6 All rights reserved. Rev 02/2009 (3) WLAN 802.11b/g Band Balun (SCI-103 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 0.8 mm x 1.0 mm (wirebond) 1.2 mm x 1.1 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-103W/F is a balun for WLAN 802.11b/g band applications. The balun has low pass– band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-103W (Wirebond) SCI-103F (Flip Chip) ELECTRICAL SPECIFICATIONS Specification Pass Band Unit Min. MHz 2400 Insertion Loss dB Return Loss dB Differential Impedance Typical 2500 0.5 15 20 100 Ohm dB 0.5 Phase Imbalance deg 5.0 Size mm Amplitude Imbalance Max. 0.8 x 1.0 (WB) 1.2 x 1.1 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 1 Amplitude Imbalance (dB) Insertion Loss (dB) 0 -10 -20 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 -1 2.3 4.0 2.4 0 2.6 190 Phase Imbalance (deg) Return Loss (dB) 2.5 Frequency (GHz) Frequency (GHz) -10 -20 -30 180 170 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 2.3 2.4 Frequency (GHz) 2.5 2.6 Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-103W (Wirebond) SCI-103F (Flip Chip) Pad SCI-103W Signal 1 Ground SCI-103F Signal Bias 2 Unbalanced Unbalanced 3 Bias Ground 4 Balanced (-) Balanced (+) 5 Balanced (+) Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 8 All rights reserved. Rev 02/2009 (4) WLAN 802.11a Band Balun (SCI-104 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 0.8 mm x 1.1 mm (wirebond) 1.2 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height wirebond 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-104W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-104W/F is a balun for WLAN 802.11a band applications. The balun has low pass– band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-104F (Flip Chip) ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Unit Min. MHz 5115 dB 0.7 Typical 5825 1.0 dB 10 Ohm 100 Amplitude Imbalance dB 0.5 Phase Imbalance deg Return Loss Differential Impedance Size mm Max. 5 0.8 x 1.1 (WB) 1.2 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS Amplitude Imbalance (dB) Insertion Loss (dB) 0 -10 -20 -30 -40 0 2 4 6 8 1 0 -1 10 4.5 5.0 Frequency (GHz) 6.0 6.5 6.0 6.5 Frequency (GHz) 190 Phase Imbalance (deg) 0 Return Loss (dB) 5.5 -10 -20 -30 -40 180 170 -50 0 2 4 6 8 4.5 10 5.0 5.5 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-104W (Wirebond) SCI-104F (Flip Chip) Pad SCI-104W Signal 1 Ground SCI-104F Signal Bias 2 Unbalanced Unbalanced 3 Bias Ground 4 Balanced (-) Balanced (+) 5 Ground Ground 6 Balanced (+) Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 10 All rights reserved. Rev 02/2009 (5) GSM Band Balun (SCI-105 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.2 mm (wirebond) 1.4 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ SCI-105F (Flip Chip) SCI-105W (Wirebond) • Storage temperature: -40℃ to +85℃ DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-105W/F is a balun for GSM band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.04 dB included) Specification Pass Band Insertion Loss Return Loss Unit Min. MHz 824 Typical 915 dB 1.1 dB 15 Ohm 50 Amplitude Imbalance dB 0.5 Phase Imbalance deg Size mm Differential Impedance Max. 6.0 1.4 x 1.2 (WB) 1.4 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Amplitude Imbalance (dB) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Phase Imbalance (deg) Return Loss (dB) freq, GHz 0 -10 -20 -30 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Insertion Loss (dB) TYPICAL CHARACTERISTICS 0 -10 -20 -30 0.0 -0.5 -1.0 0.8 0.9 freq, GHz 1.0 0.9 freq, GHz 1.0 Pad SCI-105W Signal SCI-105F Signal 1 Balanced (+) Bias 2 Balanced (-) GND 3 Unbalanced Unbalanced 4 GND Balanced (+) 5 Bias Balanced (-) 190 180 170 0.8 freq, GHz TEST BOARD DRAWING SCI-105W (Wirebond) SCI-105F (Flip Chip) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 12 All rights reserved. Rev 02/ 2009 (6) GSM Band Balun (SCI-106 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.2 mm (wirebond) 1.6 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-106F (Flip Chip) SCI-106W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-106W/F is a balun for GSM band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.04 dB included) Specification Pass Band Insertion Loss Return Loss Unit Min. MHz 824 dB Typical 915 1.2 dB 15 Ohm 200 Amplitude Imbalance dB 0.6 Phase Imbalance deg 2.0 Size mm Differential Impedance Max. 1.4 x 1.2 (WB) 1.6 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Amplitude Imbalance (dB) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Phase Imbalance (deg) Return Loss (dB) freq, GHz 0 -10 -20 -30 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Insertion Loss (dB) TYPICAL CHARACTERISTICS 0 -10 -20 -30 0.0 -0.5 -1.0 0.8 0.9 freq, GHz 1.0 0.9 freq, GHz 1.0 190 180 170 0.8 freq, GHz TEST BOARD DRAWING SCI-106W (Wirebond) SCI-106F (Flip Chip) Pad SCI-106W Signal 1 Balanced (+) SCI-106F Signal Bias 2 Balanced (-) GND 3 Unbalanced Unbalanced 4 GND Balanced (+) 5 Bias Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 14 All rights reserved. Rev 02/ 2009 (7) DCS Band Balun (SCI-107 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.2 mm x 1.2 mm (wirebond) 1.4 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-107W/F is a balun for DCS band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-107F (Flip Chip) SCI-107W (Wirebond) ELECTRICAL SPECIFICATIONS (Test board loss 0.07 dB included) Specification Pass Band Insertion Loss Return Loss Unit Min. MHz 1710 dB Typical 1980 1.0 dB 15 Ohm 50 Amplitude Imbalance dB 0.5 Phase Imbalance deg 4.0 Size mm Differential Impedance Max. 1.2 x 1.2 (WB) 1.4 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. -20 -40 -60 0 1 2 3 4 freq, GHz 5 6 0 -10 -20 -30 0 1 2 3 4 freq, GHz 5 6 Amplitude Imbalance (dB) 0 Phase Imbalance (deg) Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS 0.5 0.0 -0.5 1.71 1.81 1.91 freq, GHz 1.98 1.81 1.91 freq, GHz 1.98 190 180 170 1.71 TEST BOARD DRAWING SCI-107W (Wirebond) SCI-107F (Flip Chip) Pad SCI-107W Signal 1 Balanced (+) SCI-107F Signal Bias 2 Unbalanced GND 3 GND Unbalanced 4 Bias Balanced (+) 5 Balanced (-) Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 16 All rights reserved. Rev 02/2009 (8) DCS Band Balun (SCI-108 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.4 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-108W/F is a balun for DCS band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-108F (Flip Chip) SCI-108W (Wirebond) ELECTRICAL SPECIFICATIONS (Test board loss 0.07dB included) Specification Pass Band Unit Min. MHz 1710 Insertion Loss dB Return Loss dB Differential Impedance Typical Max. 1980 0.9 15 Ohm 200 Amplitude Imbalance dB 0.5 Phase Imbalance deg Size mm 5.0 1.0 x 1.2 (WB) 1.4 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. -20 -40 -60 0 1 2 3 4 freq, GHz 5 6 0 -10 -20 -30 0 1 2 3 4 freq, GHz 5 6 Amplitude Imbalance (dB 0 Phase Imbalance (deg Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS 0.5 0.0 -0.5 1.71 1.81 1.91 1.98 freq, GHz 190 180 170 1.71 1.81 1.91 1.98 freq, GHz TEST BOARD DRAWING SCI-108W (Wirebond) SCI-108F (Flip Chip) Pad SCI-108W Signal 1 Bias SCI-108F Signal Bias 2 Balanced (+) GND 3 Balanced (-) Unbalanced 4 Unbalanced Balanced (+) 5 GND Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 18 All rights reserved. Rev 02/2009 (9) 802.11b Band Balun (SCI-109 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.0 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-109F (Flip Chip) SCI-109W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-109W/F is a balun for 802.11b band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.1dB included) Specification Pass Band Insertion Loss Return Loss Differential Impedance Unit Min. MHz 2400 dB Typical 2500 1.0 dB 20 Ohm 50 Amplitude Imbalance dB Phase Imbalance deg Size mm Max. 0.3 4.0 1.0 x 1.2 (WB) 1.0 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Amplitude Imbalance (dB) 10 9 8 7 6 5 4 3 2 1 0 Phase Imbalance (deg Return Loss (dB) freq, GHz 0 -20 -40 -60 10 9 8 7 6 5 4 3 2 1 0 Insertion Loss (dB) TYPICAL CHARACTERISTICS 0 -10 -20 -30 0.5 0.0 -0.5 2.4 2.5 freq, GHz 190 180 170 2.4 2.5 freq, GHz freq, GHz TEST BOARD DRAWING SCI-109W (Wirebond) SCI-109F (Flip Chip) Pad SCI-109W Signal 1 Balanced (+) SCI-109F Signal Bias 2 Balanced (-) GND 3 Unbalanced Unbalanced 4 GND Balanced (+) 5 Bias Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 20 All rights reserved. Rev 02/2009 (10) 802.11b Band Balun (SCI-110 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.2 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-110F (Flip Chip) SCI-110W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-110W/F is a balun for 802.11b band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.1 dB included) Specification Pass Band Unit Min. MHz 2400 Insertion Loss dB Return Loss dB Differential Impedance Typical Max. 2500 0.8 20 Ohm 200 Amplitude Imbalance dB 0.3 Phase Imbalance deg Size mm 1.0 1.0 x 1.2 (WB) 1.2 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Amplitude Imbalance (dB) 10 9 8 7 6 5 4 3 2 1 0 Phase Imbalance (deg) Return Loss (dB) freq, GHz 0 -20 -40 -60 10 9 8 7 6 5 4 3 2 1 0 Insertion Loss (dB) TYPICAL CHARACTERISTICS 0 -10 -20 -30 0.5 0.0 -0.5 2.4 2.5 freq, GHz 190 180 170 2.4 2.5 freq, GHz freq, GHz TEST BOARD DRAWING SCI-110W (Wirebond) SCI-110F (Flip Chip) Pad SCI-110W Signal SCI-110F Signal 1 Balanced (+) Balanced (+) 2 Unbalanced Bias 3 GND GND 4 Bias Unbalanced 5 Balanced (-) Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 22 All rights reserved. Rev 02/2009 (11) 802.11a Band Balun (SCI-111 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.4 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-111F (Flip Chip) SCI-111W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-111W/F is a balun for 802.11a band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.25 dB included) Specification Pass Band Unit Min. MHz 4900 Insertion Loss dB Return Loss dB Differential Impedance dB Phase Imbalance deg Size mm Max. 5900 1.2 11 Ohm Amplitude Imbalance Typical 50 0.5 2.0 1.0 x 1.2 (WB) 1.4 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. -40 -60 0 -10 -20 -30 10 9 8 7 6 5 4 3 2 1 0 Return Loss (dB) freq, GHz freq, GHz Amplitude Imbalance (dB) -20 Phase Imbalance (deg) 0 10 9 8 7 6 5 4 3 2 1 0 Insertion Loss (dB) TYPICAL CHARACTERISTICS 0.5 0.0 4.9 5.9 freq, GHz 185 180 175 4.9 5.9 freq, GHz TEST BOARD DRAWING SCI-111W (Wirebond) SCI-111F (Flip Chip) Pad SCI-111W Signal 1 Balanced (+) SCI-111F Signal Bias 2 Unbalanced GND 3 GND Unbalanced 4 Bias Balanced (+) 5 Balanced (-) GND 6 GND Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 24 All rights reserved. Rev 02/2009 (12) 802.11a Band Balun (SCI-112 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.2 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-112W (Wirebond) SCI-112F (Flip Chip) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-112W/F is a balun for 802.11a band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.25 dB included) Specification Pass Band Unit Min. Typical Max. MHz 4900 5900 Insertion Loss dB 1.0 1.4 Return Loss dB 12 Differential Impedance Ohm Amplitude Imbalance dB Phase Imbalance deg Size mm 200 0.5 3.0 1.0 x 1.2 (WB) 1.2 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Amplitude Imbalance (dB) 0 -20 -40 -60 10 9 8 7 6 5 4 3 2 1 0 Insertion Loss (dB) TYPICAL CHARACTERISTICS Phase Imbalance (deg) 0 -10 -20 -30 10 9 8 7 6 5 4 3 2 1 0 Return Loss (dB) freq, GHz 1.0 0.5 0.0 4.9 5.9 freq, GHz 185 180 175 4.9 5.9 freq, GHz freq, GHz TEST BOARD DRAWING SCI-112W (Wirebond) SCI-112F (Flip Chip) Pad SCI-112W Signal SCI-112F Signal 1 Balanced (+) Balanced (+) 2 Unbalanced Bias 3 GND GND 4 Bias Unbalanced 5 Balanced (-) Balanced (-) 6 GND NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 26 All rights reserved. Rev 02/2009 (13) UWB Band Balun (SCI-113 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.4 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-113F (Flip Chip) SCI-113W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-113W/F is a balun for UWB band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.2 dB included) Specification Pass Band Unit Min. MHz 3000 Insertion Loss dB Return Loss dB Differential Impedance Typical Max. 5000 1.3 10 Ohm 100 Amplitude Imbalance dB 0.8 Phase Imbalance deg 8.0 Size mm 1.0 x 1.2 (WB) 1.4 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. -40 -60 -80 0 2 4 6 8 10 12 14 16 freq, GHz 0 -5 -10 -15 -20 -25 0 2 4 6 8 10 12 14 16 freq, GHz Amplitude Imbalance (dB 0 -20 Phase Imbalance (deg) Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS 1 0 -1 3 4 freq, GHz 5 3 4 freq, GHz 5 180 170 TEST BOARD DRAWING SCI-113W (Wirebond) SCI-113F (Flip Chip) Pad SCI-113W Signal SCI-113F Signal 1 2 3 4 5 6 Bias Balanced (+) GND Balanced (-) Unbalanced GND Balanced (+) GND Balanced (-) Bias GND Unbalanced NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 28 All rights reserved. Rev 02/2009 (14) UWB Band Balun (SCI-114 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.4 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-114F (Flip Chip) SCI-114W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-114W/F is a balun for UWB band applications. The balun has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the balun are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.5 dB included) Specification Pass Band Insertion Loss Return Loss Differential Impedance Unit Min. MHz 7000 dB dB dB Phase Imbalance deg Size mm Max. 9000 1.0 15 Ohm Amplitude Imbalance Typical 100 0.6 7.0 1.0 x 1.2 (WB) 1.4 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Amplitude Imbalance (d 0 -20 -40 -60 20 18 16 14 12 10 8 6 4 2 0 Insertion Loss (dB TYPICAL CHARACTERISTICS -10 -15 -20 Phase Imbalance (de 0 -5 20 18 16 14 12 10 8 6 4 2 0 Return Loss (dB freq, GHz 1 0 -1 7 8 freq, GHz 9 8 freq, GHz 9 180 170 7 freq, GHz TEST BOARD DRAWING SCI-114W (Wirebond) SCI-114F (Flip Chip) Pad SCI-114W Signal SCI-114F Signal 1 Bias Balanced (+) 2 Balanced (+) GND 3 GND Balanced (-) 4 Balanced (-) Bias 5 Unbalanced GND 6 GND Unbalanced NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 30 All rights reserved. Rev 02/2009 (15) GSM Band Low Pass Filter (SCI-201 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.7 mm x 0.8 mm (wirebond) 1.8 mm x 1.1 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-201W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-201W/F is a low pass filter (LPF) for GSM band applications. The LPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the LPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. SCI-201F (Flip Chip) ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Unit Min. MHz 824 dB Return Loss dB Attenuation, 2f0 dB Attenuation, 3f0 dB Size mm Typical Max. 915 0.5 20 20 30 25 1.7 x 0.8 (WB) 1.8 x 1.1 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 Return Loss (dB) Insertion Loss (dB) 0 -10 -20 -30 -40 -10 -20 -30 -40 -50 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 4.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-201W (Wirebond) SCI-201F (Flip Chip) Pad SCI-201W Signal SCI-201F Signal 1 Ground Ground 2 Ground Ground 3 Ground Ground 4 Input Output 5 Output Input NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 32 All rights reserved. Rev 02/2009 (16) DCS Band Low Pass Filter (SCI-202 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.5 mm x 0.8 mm (wirebond) 1.6 mm x 1.0 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-202W/F is a low pass filter (LPF) for DCS band applications. The LPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the LPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wire-bonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. SCI-202W (Wirebond) SCI-202F (Flip Chip) ELECTRICAL SPECIFICATIONS Specification Unit Min. Pass Band MHz 1710 Insertion Loss dB Return Loss dB Attenuation, 2f0 dB Attenuation, 3f0 dB Size mm Typical Max. 1980 0.4 15 20 30 30 1.5 x 0.8 (WB) 1.6 x 1.0 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 -10 Return Loss (dB) Insertion Loss (dB) 0 -20 -30 -40 -10 -20 -30 -40 -50 -50 0 1 2 3 4 5 6 7 0 Frequency (GHz) 1 2 3 4 5 6 7 Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-202W (Wirebond) SCI-202F (Flip Chip) Pad SCI-202W Signal SCI-202F Signal 1 Ground Ground 2 Ground Ground 3 Ground Ground 4 Input Output 5 Output Input NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 34 All rights reserved. Rev 02/2009 (17) GSM Band Low Pass Filter (SCI-203W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.0 mm x 1.2 mm (flip chip) • • • • Eutectic Sn/Pb or lead-free solder bump Low profile, 0.40 mm height Directly attachable on PCB or flipped on PCB Operating temperature: -40 to +85 ℃ • Storage temperature: -40 to +85 ℃ SCI-203W (Wirebond) SCI-203F (Flip Chip) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-203W/F is a low pass filter (LPF) for GSM band applications. The LPF has low pass-band insertion loss and small size. It is composed of 8.0 um Cu-plated inductors and Metal-InsulatorMetal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the LPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wire-bonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.04 dB included) Specification Pass Band Unit MHz Insertion Loss dB Return Loss dB Attenuation, 2f0 dB Attenuation, 3f0 dB Size mm Minimum Typical 824 Maximum 915 0.6 20 20 20 1.0 x 1.2 (WB) 1.0 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. 0 -10 -20 -30 -40 0 1 2 3 freq, GHz 4 Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS 0 -10 -20 -30 -40 0 1 2 3 freq, GHz 4 TEST BOARD DRAWING SCI-203W (Wirebond) SCI-203F (Flip Chip) Pad SCI-203W Signal 1 Input SCI-203F Signal GND 2 GND GND 3 Output Input 4 GND GND 5 GND Output NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 36 All rights reserved. Rev 02/2009 (18) 802.11b/g Band Pass Filter (SCI-301 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.5 mm x 0.9 mm (wirebond) 1.5 mm x 0.9 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-301W/F is a band pass filter (BPF) for 802.11b/g band applications. The BPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. SCI-301W (Wirebond) SCI-301F (Flip Chip) ELECTRICAL SPECIFICATIONS Specification Unit Min. Pass Band MHz 2400 Insertion Loss dB 2.0 Return Loss dB 10 Attenuation, 900 MHz dB 50 Attenuation, 1900 MHz dB 30 Attenuation, 4800 MHz dB 60 Size mm 1.5 x 0.9 (WB) Typical Max. 2500 2.2 2.4 15 1.5 x 0.90 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 -10 Return Loss (dB) Insertion Loss (dB) 0 -20 -30 -40 -10 -20 -50 -30 -60 0 1 2 3 4 5 0 6 1 2 3 4 5 6 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-301W (Wirebond) SCI-301F (Flip Chip) Pad SCI-301W Signal SCI-301F Signal 1 Ground Ground 2 Input Output 3 Output Input 4 Ground Ground NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 38 All rights reserved. Rev 02/2009 (19) 802.11b/g Band Pass Filter (SCI-302 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.5 mm x 1.1 mm (wirebond) 1.7 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-302W/F is a band pass filter (BPF) for 802.11b/g band applications. The BPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. SCI-302F (Flip Chip) SCI-302W (Wirebond) ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Unit Min. Typical MHz 2400 2500 dB 1.5 1.7 Return Loss dB 20 Attenuation, 900 MHz dB 45 Attenuation, 1900 MHz dB 30 Attenuation, 4800 MHz dB 18 Size mm 1.5 x 1.1 (WB) Max. 1.7 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 -10 Return Loss (dB) Insertion Loss (dB) 0 -20 -30 -40 -50 -10 -20 -30 -40 -60 0 1 2 3 4 5 6 0 1 Frequency (GHz) 2 3 4 5 6 Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-302W (Wirebond) SCI-302F (Flip Chip) Pad SCI-302W Signal 1 Input SCI-302F Signal Output 2 Ground Ground 3 Ground Ground 4 Output Input NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 40 All rights reserved. Rev 02/2009 (20) 802.11b/g Band Pass Filter (SCI-303 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.3 mm x 0.9 mm (wirebond) 1.4 mm x 1.1 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85 ℃ DESCRIPTION STATS ChipPAC’s SCI-303W/F is a band pass filter (BPF) for 802.11b/g band applications. The BPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. SCI-303W (Wirebond) SCI-303F (Flip Chip) ELECTRICAL SPECIFICATIONS Specification Unit Min. Pass Band MHz 2400 2500 Insertion Loss dB 1.9 2.3 Return Loss dB 15 Attenuation, 900 MHz dB 50 Attenuation, 1900 MHz dB 35 Attenuation, 4800 MHz dB 30 Size mm 1.3 x 0.9 (WB) Typical Max. 20 1.4 x 1.1 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 -10 Return Loss (dB) Insertion Loss (dB) 0 -20 -30 -40 -10 -20 -50 -30 -60 0 1 2 3 4 5 6 0 1 2 3 4 5 6 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-303W (Wirebond) SCI-303F (Flip Chip) Pad SCI-303W SCI-303F 1 Ground Ground 2 Ground Ground 3 Ground Ground 4 Input Output 5 Output Input NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 42 All rights reserved. Rev 02/2009 (21) 802.11b/g Band Pass Filter (SCI-304 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.5 mm x 1.0 mm (wirebond) 1.6 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-304W/F is a band pass filter (BPF) for 802.11b/g band applications. The BPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. SCI-304F (Flip Chip) SCI-304W (Wirebond) ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Unit Min. MHz 2400 dB 1.8 Typical Max. 2500 2.0 Return Loss dB Attenuation, 900 MHz dB 35 Attenuation, 1900 MHz dB 30 Attenuation, 4800 MHz dB 30 Size mm 2.3 10 1.5 x 1.0 (WB) 1.6 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 -10 Return Loss (dB) Insertion Loss (dB) 0 -20 -30 -40 -10 -20 -50 -30 -60 0 2 4 6 8 0 10 2 4 6 8 10 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-304W (Wirebond) SCI-304F (Flip Chip) Pad SCI-304W Signal SCI-304F Signal 1 Ground Ground 2 Input Output 3 Output Input 4 Ground Ground NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 44 All rights reserved. Rev 02/2009 (22) 802.11b/g Band Pass Filter (SCI-305 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.5 mm x 1.1 mm (wirebond) 1.7 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-305F (Flip Chip) SCI-305W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-305W/F is a band pass filter (BPF) for 802.11b/g band applications. The BPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Unit Min. Typical MHz 2400 2500 dB 1.2 1.4 Return Loss dB 20 Attenuation, 900 MHz dB 60 Attenuation, 1900 MHz dB 20 Attenuation, 4800 MHz dB 20 Size mm 1.5 x 1.1 (WB) Max. 1.7 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 -10 Return Loss (dB) Insertion Loss (dB) 0 -20 -30 -40 -10 -20 -30 -50 -60 -40 0 1 2 3 4 5 0 6 1 2 3 4 5 6 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-305W (Wirebond) SCI-305F (Flip Chip) Pad SCI-305W Signal 1 Input SCI-305F Signal Output 2 Ground Ground 3 Ground Ground 4 Output Input NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 46 All rights reserved. Rev 02/2009 (23) UWB Band Pass Filter (SCI-306W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.2 mm (wirebond) 1.6 mm x 1.2 mm (flip chip) • • • • Eutectic Sn/Pb or lead-free solder bump Low profile, 0.40 mm height Directly attachable on PCB or flipped on PCB Operating temperature: -40 to +85 ℃ • Storage temperature: -40 to +85 ℃ SCI-306F (Flip Chip) SCI-306W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-306W/F is a band pass filter (BPF) for UWB band applications. The BPF has low pass–band insertion loss and small size. It is composed of 8.0 um Cu-plated inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS (Test board loss 0.2 dB included) Specification Unit Minimum Pass Band MHz 3000 Wirebonding Typical (Bumped Typical) Maximum 5000 Insertion Loss dB Return Loss dB 2.5 (2.0) 10 (12) Attenuation, 900 MHz dB 55 (45) Attenuation, 1900 MHz dB 25 (23) Attenuation, 8000 20000 MHz dB 10 (30) 50 Size mm 1.4 x 1.2 (WB) 1.6 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. -20 -40 -60 Wire-bondable 0 -10 -20 20 18 16 14 12 10 8 6 4 2 0 Return Loss (dB) Wire-bondable 0 20 18 16 14 12 10 8 6 4 2 0 Insertion Loss (dB) TYPICAL CHARACTERISTICS -20 -40 Bumped 0 -10 -20 -30 -40 20 18 16 14 12 10 8 6 4 2 0 -60 freq, GHz Return Loss (dB) Bumped 0 20 18 16 14 12 10 8 6 4 2 0 Insertion Loss (dB) freq, GHz freq, GHz freq, GHz TEST BOARD DRAWING SCI-306W (Wirebond) SCI-306F (Flip Chip) Pad SCI-306W Signal SCI-306F Signal 1 GND GND 2 Input Input 3 GND GND 4 GND NC 5 Output Output 6 GND GND NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 48 All rights reserved. Rev 02/2009 (24) UWB Band Pass Filter (SCI-307F1/F2) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.2 mm (wirebond) 1.6 mm x 1.2 mm (flip chip) • • • • Eutectic Sn/Pb or lead-free solder bump Low profile, 0.40 mm height Directly attachable on PCB or flipped on PCB Operating temperature: -40 to +85 ℃ • Storage temperature: -40 to +85 ℃ SCI-307F2 (Flip Chip) SCI-307F1 (Flip Chip) DESCRIPTION STATS ChipPAC’s SCI-307F1/F2 is a band pass filter (BPF) for UWB band applications. The BPF has low pass–band insertion loss and small size. It is composed of 8.0 um Cu-plated inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS (Test board loss 0.5 dB included) Specification Unit Min. Design #1 (Design #2) Max. MHz 7000 9000 dB 1.7 (2.0) 2.4 (2.8) Return Loss dB 15 (12) Attenuation, 900 MHz dB 50 (30) Attenuation, 1900 MHz dB 50 (30) Attenuation, 5500 MHz dB Pass Band Insertion Loss Attenuation, 12000-20000 MHz Size 25 (38) 22 mm 25 1.4 x 1.2 (20) (1.6 x 1.2 ) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. -20 -40 -60 Bumped Design 1 0 -10 -20 -30 -40 20 18 16 14 12 10 8 6 4 2 0 Return Loss (dB) Bumped Design 1 0 20 18 16 14 12 10 8 6 4 2 0 Insertion Loss (dB) TYPICAL CHARACTERISTICS Bumped Design 2 0 -20 -40 Bumped Design 2 0 -5 -10 -15 -20 -25 20 18 16 14 12 10 8 6 4 2 0 -60 Return Loss (dB) freq, GHz 20 18 16 14 12 10 8 6 4 2 0 Insertion Loss (dB) freq, GHz freq, GHz freq, GHz TEST BOARD DRAWING SCI-307F1 (Flip Chip) Pad SCI-307F1 Signal SCI-307F2 (Flip Chip) SCI-307F2 Signal 1 GND GND 2 Input Input 3 GND NC 4 GND GND 5 Output Output NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 50 All rights reserved. Rev 02/2009 (25) 802.11a Band Pass Filter (SCI-401 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 0.8 mm (wirebond) 1.4 mm x 1.0 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-401F (Flip Chip) SCI-401W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-401W/F is a band pass filter (BPF) for 802.11a band applications. The BPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Unit Min. Typical MHz 5115 5825 dB 1.4 2.0 Return Loss dB 10.0 Attenuation, 2450 MHz dB 35 Attenuation, 1100 MHz dB Size mm Max. 40 1.4 x 0.8 (WB) 1.4 x 1.0 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 -10 Return Loss (dB) Insertion Loss (dB) 0 -20 -30 -40 -10 -20 -30 -50 0 2 4 6 8 10 12 0 14 2 4 6 8 10 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-401W (Wirebond) SCI-401F (Flip Chip) Pad SCI-401W Signal SCI-401F Signal 1 Ground Ground 2 Input Output 3 Output Input 4 Ground Ground NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 52 All rights reserved. Rev 02/2009 (26) 802.11a Band Pass Filter (SCI-402 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.1 mm (wirebond) 1.5 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-402F (Flip Chip) SCI-402W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-402W/F is a band pass filter (BPF) for 802.11a band applications. The BPF has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the BPF are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS Specification Pass Band Insertion Loss Unit Min. MHz 5115 dB Typical 5825 1.0 Return Loss dB 15 Attenuation, 2450 MHz dB 40 Attenuation, 1100 MHz dB Size mm Max. 40 1.4 x 1.1 (WB) 1.5 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. 0 0 -10 -10 Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS -20 -30 -40 -20 -30 -40 -50 -50 0 2 4 6 8 10 12 0 14 2 4 6 8 10 12 14 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-402W (Wirebond) SCI-402F (Flip Chip) Pad SCI-402W Signal SCI-402F Signal 1 Input Ground 2 Ground Output 3 Output Ground 4 Ground Input NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 54 All rights reserved. Rev 02/2009 (27) GSM-DCS Diplexer (SCI-501 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 2.1 mm x 1.0 mm (wirebond) 2.0 mm x 1.3 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-501F (Flip Chip) SCI-501W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-501W/F is a diplexer for GSM/DCS band applications. The diplexer has low pass–band insertion loss and small size. It is composed of thick copper inductors and MetalInsulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the diplexer are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small formfactor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS Specification Unit Min. Typical Max. Pass Band 1 MHz 824 915 Pass Band 2 MHz 1710 1980 Insertion Loss, Band 1 dB 0.5 Insertion Loss, Band 2 dB 0.8 Return Loss, Band 1 dB 20 Return Loss, Band 2 dB 15 Isolation, Band 1 at Band 2 dB 20 Isolation, Band 2 at Band 1 dB Size mm 25 2.1 x 1.0 (WB) 2.0 x 1.3 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 Return Loss (dB) Insertion Loss (dB) 0 -10 -20 -30 -10 -20 -30 -40 -40 0 1 2 3 4 5 0 6 1 2 3 4 5 6 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-501W (Wirebond) SCI-501F (Flip Chip) Pad SCI-501W Signal SCI-501F Signal 1 Output-1 (Pass Band 1) Ground 2 Ground Input 3 Input Ground 4 Ground Output-1 (Pass Band 1) 5 Output-2 (Pass Band 2) Output-2 6 - Output-2 (Pass Band 2) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 56 All rights reserved. Rev 02/2009 (28) WLAN Diplexer (SCI-502W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.2 mm x 1.0 mm (wirebond) 1.2 mm x 1.3 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-502F (Flip Chip) SCI-502W (Wirebond) DESCRIPTION STATS ChipPAC’s SCI-502W/F is a diplexer for WiFi band applications. The diplexer has low pass–band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the diplexer are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. ELECTRICAL SPECIFICATIONS Specification Unit Min. Typical Max. Pass Band 1 MHz 2400 2500 Pass Band 2 MHz 5115 5825 Insertion Loss, Band 1 dB 0.5 Insertion Loss, Band 2 dB 0.5 Return Loss, Band 1 dB Return Loss, Band 2 dB 15 Isolation, Band 1 at Band 2 dB 18 Isolation, Band 2 at Band 1 dB 25 Size mm 1.2 x 1.0 (WB) 15 20 1.2 x 1.3 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. TYPICAL CHARACTERISTICS 0 Return Loss (dB) Insertion Loss (dB) 0 -10 -20 -30 -40 -10 -20 -30 -40 0 1 2 3 4 5 6 7 8 9 10 0 1 2 3 4 5 6 7 8 9 10 Frequency (GHz) Frequency (GHz) ASSEMBLY DRAWING / MECHANICAL OUTLINE SCI-502W (Wirebond) SCI-502F (Flip Chip) Pad SCI-502W Signal SCI-502F Signal 1 Output-2 (Pass Band 2) Output-1 (Pass Band 1) 2 Ground Ground 3 Output-1 (Pass Band 1) Output-2 (Pass Band 2) 4 Input Ground 5 Ground Input 6 - Ground NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 58 All rights reserved. Rev 02/2009 (29) WLAN Diplexer (SCI-503W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.2 mm (wirebond) 1.6 mm x 1.2 mm (flip chip) • • • • Eutectic Sn/Pb or lead-free solder bump Low profile, 0.40 mm height Directly attachable on PCB or flipped on PCB Operating temperature: -40 to +85 ℃ • Storage temperature: -40 to +85 ℃ SCI-503F (Flip Chip) SCI-503W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS (Test board loss 0.1 dB and 0.25 dB included) STATS ChipPAC’s SCI-503W/F is a diplexer for WiFi band applications. The diplexer has low pass–band insertion loss and small size. It is composed of 8.0 um Cu-plated inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the diplexer are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. Specification Unit Minimum Pass Band 1 MHz 2400 Pass Band 2 MHz 5115 Typical Maximum 2500 5825 Insertion Loss, Band 1 dB 2.1 Insertion Loss, Band 2 dB 1.9 Return Loss, Band 1 dB 15 Return Loss, Band 2 dB 15 Isolation, Band 1 at Band 2 dB 35 Isolation, DC-1.7 GHz dB Isolation, Band 2 at Band 1 dB Isolation, 6.9-10.0 GHz dB 12 Size mm 1.4 x 1.2 (WB) 15 50 1.6 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS 0 -10 -20 -30 -40 -50 -60 0 2 4 6 8 10 0 -10 -20 -30 -40 0 freq, GHz 2 4 6 8 10 freq, GHz TEST BOARD DRAWING SCI-503W (WIrebond) SCI-503F (Flip Chip) Pad SCI-503W Signal 1 GND SCI-503F Signal GND 2 2G Output GND 3 GND 5G Output 4 GND GND 5 5G Output 2G Output 6 GND GND 7 GND GND 8 Common Input Common Input NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 60 All rights reserved. Rev 02/2009 (30) WiMax Band Balanced Filter (SCI-601 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 2.0 mm x 1.2 mm (wirebond) 2.0 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-601W/F is a balanced filter for WiMax band applications. The IPD has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the IPD are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-601F (Flip Chip) SCI-601W (Wirebond) ELECTRICAL SPECIFICATIONS (Test board loss 0.1 dB included) Specification Unit Min. MHz 2300 Insertion Loss dB 2.3 Return Loss dB 15 Ohm 100 Pass Band Differential Impedance Amplitude Imbalance dB Phase Imbalance deg Attenuation, DC-1700 MHz dB Typical Max. 2700 2.6 1.0 8.0 29 Attenuation, 4000-10000 MHz dB 19 Size mm 2.0 x 1.2 (WB) 2.0 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Amplitude Imbalance (dB 0 -10 -20 -30 -40 -50 -60 0 2 4 6 freq, GHz 8 10 0 -10 -20 -30 0 2 4 6 freq, GHz 8 10 Phase Imbalance (deg) Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS 1 0 -1 2.3 2.4 2.5 2.6 freq, GHz 2.7 2.4 2.5 2.6 freq, GHz 2.7 190 180 2.3 TEST BOARD DRAWING SCI-601W (Wirebond) SCI-601F (Flip Chip) Pad SCI-601W Signal SCI-601F Signal 1 GND Balanced (+) 2 Unbalanced GND 3 GND Balanced (-) 4 Balanced (+) GND 5 GND Unbalanced 6 Balanced (-) GND NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 62 All rights reserved. Rev 02/2009 (31) WiMax Band Balanced Filter (SCI-602 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.6 mm x 1.2 mm (wirebond) 2.0 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-602W/F is a balanced filter for WiMax band applications. The IPD has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the IPD are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-602W (Wirebond) SCI-602F (Flip Chip) ELECTRICAL SPECIFICATIONS (Test board loss 0.2 dB included) Specification Pass Band Unit Min. MHz 3300 Typical 3900 Insertion Loss dB Return Loss dB 15 Ohm 100 Differential Impedance Amplitude Imbalance dB Phase Imbalance deg Attenuation, DC-2450 MHz dB Max. 2.6 0.4 1.0 30 Attenuation, 4900-10000 MHz dB 20 Size mm 1.6 x 1.2 (WB) 2.0 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. -20 -40 -60 0 2 4 6 freq, GHz 8 10 0 -10 -20 -30 0 2 4 6 8 10 Amplitude Imbalance (dB 0 Phase Imbalance (deg Return Loss (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS freq, GHz 0.0 -0.5 3.3 3.4 3.5 3.6 3.7 3.8 3.9 freq, GHz 185 180 175 3.3 3.4 3.5 3.6 3.7 3.8 3.9 freq, GHz TEST BOARD DRAWING SCI-602W (Wirebond) SCI-602F (Flip Chip) Pad SCI-602W Signal SCI-602F Signal 1 GND Balanced (+) 2 Unbalanced Balanced (-) 3 GND GND 4 GND GND 5 Balanced (+) Unbalanced 6 Balanced (-) GND 7 GND GND NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 64 All rights reserved. Rev 02/2009 (32) GSM Band Loss Pass Filter with Coupler (SCI-701 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.2 mm (wirebond) 1.6 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-701W/F is a low pass filter with coupler for WiMax band applications. The IPD has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the IPD are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-701F (Flip Chip) SCI-701W (Wirebond) ELECTRICAL SPECIFICATIONS (Test board loss 0.04 dB included) Specification Pass Band Unit Min. MHz 824 Typical Max. 915 Insertion Loss dB Return Loss dB 1.0 Attenuation, 2f0 dB Attenuation, 3f0 dB 20 Coupling Coefficient dB -20 Directivity (S31-S32) dB 20 30 Size mm 1.4 x 1.2 (WB) 1.6 x 1.2 (FC) 20 30 DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. 0 1 2 3 freq, GHz 4 Return Loss (dB) 0 -10 -20 -30 -40 -50 -15 0 -10 -20 -30 -40 -50 Directivity (dB) Coupling Coefficient (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS -20 -25 824 915 0 1 2 3 freq, GHz 4 30 20 10 824 freq, MHz 915 freq, MHz TEST BOARD DRAWING SCI-701W (Wirebond) SCI-701F (Flip Chip) Pad SCI-701W Signal 1 GND SCI-701F Signal GND 2 Input Output 3 Coupling Coupling 4 Output NC 5 GND NC 6 Input 7 GND 8 GND NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 66 All rights reserved. Rev 02/2009 (33) DCS Band Loss Pass Filter with Coupler (SCI-702 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.4 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-702F (Flip Chip) SCI-702W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-702W/F is a low pass filter with coupler for WiMax band applications. The IPD has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the IPD are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.07 dB included) Specification Pass Band Unit Min. MHz 1710 Typical Max. 1980 Insertion Loss dB Return Loss dB 20 0.9 Attenuation, 2f0 dB 25 Attenuation, 3f0 dB 25 Coupling Coefficient dB -20 Directivity (S31-S32) dB 12 Size mm 1.0 x 1.2 (WB) 1.4 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Return Loss (dB) 0 -10 -20 -30 -40 0 1 2 3 4 freq, GHz 5 -15 -25 1.71 0 -10 -20 -30 -40 6 0 Directivity (dB) Coupling Coefficient (dB Insertion Loss (dB TYPICAL CHARACTERISTICS 1.81 1.91 1.98 freq, GHz 1 2 3 4 freq, GHz 5 6 20 10 0 1.71 1.81 1.91 freq, GHz 1.98 TEST BOARD DRAWING SCI-702W (Wirebond) SCI-702F (Flip Chip) Pad SCI-702W Signal SCI-702F Signal 1 GND Coupling 2 GND Output 3 GND GND 4 Output GND 5 Coupling NC 6 GND Input 7 GND GND 8 Input GND NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 68 All rights reserved. Rev 02/2009 (34) 802.11b Band Power Divider (SCI-801 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.2 mm (wirebond) 1.4 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-801W/F is a power divider for 802.11b band applications. The IPD has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the IPD are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-801F (Flip Chip) SCI-801W (Wirebond) ELECTRICAL SPECIFICATIONS (Test board loss 0.1 dB included) Specification Pass Band Unit Min. MHz 2400 Insertion Loss dB Return Loss dB Isolation (S23) dB Amplitude Imbalance (S21-S31) dB Size mm Typical Max. 2500 0.5 15 -30 0.1 1.4 x 1.2 (WB) 1.4 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. -10 -20 -30 -40 0 1 2 3 4 5 6 7 8 freq, GHz Return Loss (dB) 0 Imbalance (dB) Isolation (dB) Insertion Loss (dB TYPICAL CHARACTERISTICS 0 -10 -20 -30 -40 2.4 2.5 0 -5 -10 -15 -20 -25 0 1 2 3 4 5 6 7 8 freq, GHz 0.2 0.1 0.0 -0.1 -0.2 2.4 2.5 freq, GHz freq, GHz TEST BOARD DRAWING SCI-801W (Wirebond) SCI-801F (Flip Chip) Pad SCI-801W Signal SCI-801F Signal 1 Output 1 Output 1 2 GND GND 3 Input Input 4 GND GND 5 Output 2 Output 2 6 GND NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 70 All rights reserved. Rev 02/2009 (35) 802.11a Band Power Divider (SCI-802 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.0 mm x 1.2 mm (wirebond) 1.2 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ SCI-802F (Flip Chip) SCI-802W (Wirebond) DESCRIPTION ELECTRICAL SPECIFICATIONS STATS ChipPAC’s SCI-802W/F is a power divider for 802.11a band applications. The IPD has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the IPD are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. (Test board loss 0.25 dB included) Specification Pass Band Unit Min. MHz 4900 Insertion Loss dB Return Loss dB 12 Isolation (S23) dB 20 Amplitude Imbalance (S21S31) dB Size mm Typical Max. 5900 0.7 0.1 1.0 x 1.2 (WB) 1.2 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Return Loss (dB) 0 -10 -20 -30 10 9 8 7 6 5 4 3 2 1 0 -40 0 -5 -10 -15 -20 10 9 8 7 6 5 4 3 2 1 0 Insertion Loss (dB) TYPICAL CHARACTERISTICS 0 -10 -20 -30 -40 -50 4.9 freq, GHz Imbalance (dB) Isolation (dB) freq, GHz 5.9 0.2 0.0 -0.2 4.9 freq, GHz 5.9 freq, GHz TEST BOARD DRAWING SCI-802W (Wirebond) SCI-802F (Flip Chip) Pad SCI-802W Signal SCI-802F Signal 1 GND Output 1 2 Input GND 3 GND GND 4 GND Input 5 Output 1 GND 6 Output 2 GND 7 GND Output 2 NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 72 All rights reserved. Rev 02/2009 (36) GSM Band Balun with Coupler (SCI-901 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.6 mm x 1.2 mm (wirebond) 2.0 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-901W/F is a balun with coupler for GSM band applications. The IPD has low passband insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the IPD are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-901F (Flip Chip) SCI-901W (Wirebond) ELECTRICAL SPECIFICATIONS (Test board loss 0.04 dB included) Specification Pass Band Unit Min. MHz 824 Insertion Loss dB Return Loss dB Differential Impedance dB Phase Imbalance deg Coupling Coefficient dB Directivity dB Size mm Max. 915 1.1 15 Ohm Amplitude Imbalance Typical 100 0.3 6.0 -20 20 1.6 x 1.2 (WB) 2.0 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Return Loss (dB) 0 -10 -20 -30 -40 -50 1 2 3 freq, GHz 4 0.5 0.0 -0.5 824 915 freq, MHz Phase Imbalance (dB) 0 0 -10 -20 -30 -40 0 2 3 freq, GHz 4 170 824 915 freq, MHz -10 -20 -30 824 1 180 Directivity (dB) Coupling Coefficient (dB) Amplitude Imbalance (dB) Insertion Loss (dB) TYPICAL CHARACTERISTICS 915 30 20 10 0 824 915 freq, MHz freq, MHz TEST BOARD DRAWING SCI-901W (Wirebond) SCI-901F (Flip Chip) Pad SCI-901W Signal SCI-901F Signal 1 Coupling Balanced (+) 2 Unbalanced GND 3 GND Balanced (-) 4 GND GND 5 Balanced (+) Unbalanced 6 GND Coupling 7 Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 74 All rights reserved. Rev 02/2009 (37) DCS Band Balun with Coupler (SCI-902 W/F) FEATURES • Passive integration on silicon substrate • Low insertion loss in pass band • Small size: 1.4 mm x 1.2 mm (wirebond) 1.6 mm x 1.2 mm (flip chip) • Pb-free solder bump • Low profile: 0.25 mm height (wirebond) 0.40 mm height (flip chip) • Directly attachable on PCB or flipped on PCB • Operating temperature: -40℃ to +85℃ • Storage temperature: -40℃ to +85℃ DESCRIPTION STATS ChipPAC’s SCI-902W/F is a balun with coupler for DCS band applications. The IPD has low pass-band insertion loss and small size. It is composed of thick copper inductors and Metal-Insulator-Metal capacitors which are fabricated on a silicon substrate using STATS ChipPAC’s IPD (Integrated Passive Device) process. The pad or bump size and pitch of the IPD are selected so that the device can be mounted directly on a PCB or laminate substrate using conventional wirebonding or surface mount techniques. The low profile and small form-factor of the device make it especially suitable for SiP applications. SCI-902F (Flip Chip) SCI-902W (Wirebond) ELECTRICAL SPECIFICATIONS (Test board loss 0.07 dB included) Specification Pass Band Unit Min. MHz 1710 Typical 1980 Insertion Loss dB Return Loss dB 10 Differential Impedance Max. 1.7 Ohm 100 Amplitude Imbalance dB 0.2 Phase Imbalance deg 4.0 Coupling Coefficient dB -22 Directivity dB 12 28 Size mm 1.4 x 1.2 (WB) 1.6 x 1.2 (FC) DIMENSIONS STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. Return Loss (dB) 0 -20 -40 -60 1 2 3 freq, GHz 1 0 -1 1.71 1.81 1.91 freq, GHz -10 -15 1.98 0 1.81 1.91 1 2 3 freq, GHz 4 190 180 170 1.71 1.81 1.91 1.98 freq, GHz -20 -25 1.71 -5 4 Phase Imbalance (dB -80 0 0 Directivity (dB) Coupling Coefficient (d Amplitude Imbalance (d Insertion Loss (dB TYPICAL CHARACTERISTICS 1.98 30 20 10 0 1.71 1.81 1.91 freq, GHz freq, GHz 1.98 TEST BOARD DRAWING SCI-902W (Wirebond) SCI-902F (Flip Chip) Pad SCI-902W Signal SCI-902F Signal 1 GND Balanced (+) 2 GND GND 3 Unbalanced Balanced (-) 4 Coupling Coupling 5 Balanced (+) Unbalanced 6 GND GND 7 Balanced (-) NOTES All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room temperature. For best results, ground plane directly beneath the device should be in the top metal layer. Refer to “Appendix A” for: • Pad sizes and typical wirebond length used in the wirebonded IPD products. • Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD products. www.statschippac.com 76 All rights reserved. Rev 02/2009 APPENDIX A WIREBONDED IPD PRODUCTS Pad Type Pad Area (mm) Square 0.09 x 0.09 3 wirebond rectangular- type A 0.09 x 0.29 3 wirebond rectangular - type B 0.29 x 0.09 2 wirebond rectangular - type A ( for SCI-5xx W only) 0.16 x 0.07 2 wirebond rectangular - type B 0.19 x 0.09 Note: Typical wirebond length is 0.700 mm. FLIP CHIP IPD PRODUCTS For bumped IPD products, typical solder thermal reflow profile, landing pattern and nominal bump dimensions are listed below. Solder Reflow Thermal Profile Landing Pattern Recommendation (for bump diameter of 0.210 mm) Pad Definition SMD Copper Pad Diameter (d1) 0.280 mm Solder Mask Opening (d2) 0.180 mm Nominal Bump Dimensions Diameter 0.210 mm Bump Standoff Height 0.130 mm www.statschippac.com 77 All rights reserved. Rev 02/ 2009 Additional Notes www.statschippac.com 78 All rights reserved. Rev 02/ 2009 2nded. ,c opy r i ght2009