SCI-106

(6) GSM Band Balun (SCI-106 W/F)
FEATURES
• Passive integration on silicon substrate
• Low insertion loss in pass band
• Small size: 1.4 mm x 1.2 mm (wirebond)
1.6 mm x 1.2 mm (flip chip)
• Pb-free solder bump
• Low profile: 0.25 mm height (wirebond)
0.40 mm height (flip chip)
• Directly attachable on PCB or flipped on PCB
• Operating temperature: -40℃ to +85℃
• Storage temperature: -40℃ to +85℃
SCI-106F (Flip Chip)
SCI-106W (Wirebond)
DESCRIPTION
ELECTRICAL SPECIFICATIONS
STATS ChipPAC’s SCI-106W/F is a balun for GSM
band applications. The balun has low pass-band
insertion loss and small size. It is composed of thick
copper inductors and Metal-Insulator-Metal capacitors
which are fabricated on a silicon substrate using
STATS ChipPAC’s IPD (Integrated Passive Device)
process. The pad or bump size and pitch of the balun
are selected so that the device can be mounted directly
on a PCB or laminate substrate using conventional
wirebonding or surface mount techniques. The low
profile and small form-factor of the device make it
especially suitable for SiP applications.
(Test board loss 0.04 dB included)
Specification
Pass Band
Insertion Loss
Return Loss
Unit
Min.
MHz
824
dB
Typical
915
1.2
dB
15
Ohm
200
Amplitude Imbalance
dB
0.6
Phase Imbalance
deg
2.0
Size
mm
Differential Impedance
Max.
1.4 x 1.2 (WB)
1.6 x 1.2 (FC)
DIMENSIONS
STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no
circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the
information at any time and without notice.
Amplitude Imbalance (dB)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Phase Imbalance (deg)
Return Loss (dB)
freq, GHz
0
-10
-20
-30
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Insertion Loss (dB)
TYPICAL CHARACTERISTICS
0
-10
-20
-30
0.0
-0.5
-1.0
0.8
0.9
freq, GHz
1.0
0.9
freq, GHz
1.0
190
180
170
0.8
freq, GHz
TEST BOARD DRAWING
SCI-106W (Wirebond)
SCI-106F (Flip Chip)
Pad
SCI-106W Signal
1
Balanced (+)
SCI-106F Signal
Bias
2
Balanced (-)
GND
3
Unbalanced
Unbalanced
4
GND
Balanced (+)
5
Bias
Balanced (-)
NOTES
All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room
temperature. For best results, ground plane directly beneath the device should be in the top metal layer.
Refer to “Appendix A” for:
• Pad sizes and typical wirebond length used in the wirebonded IPD products.
• Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD
products.
www.statschippac.com
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All rights reserved. Rev 02/ 2009