SCI-103

(3) WLAN 802.11b/g Band Balun (SCI-103 W/F)
FEATURES
• Passive integration on silicon substrate
• Low insertion loss in pass band
• Small size: 0.8 mm x 1.0 mm (wirebond)
1.2 mm x 1.1 mm (flip chip)
• Pb-free solder bump
• Low profile: 0.25 mm height (wirebond)
0.40 mm height (flip chip)
• Directly attachable on PCB or flipped on PCB
• Operating temperature: -40℃ to +85℃
• Storage temperature: -40℃ to +85℃
DESCRIPTION
STATS ChipPAC’s SCI-103W/F is a balun for WLAN
802.11b/g band applications. The balun has low pass–
band insertion loss and small size. It is composed of
thick copper inductors and Metal-Insulator-Metal
capacitors which are fabricated on a silicon substrate
using STATS ChipPAC’s IPD (Integrated Passive
Device) process. The pad or bump size and pitch of the
balun are selected so that the device can be mounted
directly on a PCB or laminate substrate using
conventional wirebonding or surface mount techniques.
The low profile and small form-factor of the device
make it especially suitable for SiP applications.
SCI-103W (Wirebond)
SCI-103F (Flip Chip)
ELECTRICAL SPECIFICATIONS
Specification
Pass Band
Unit
Min.
MHz
2400
Insertion Loss
dB
Return Loss
dB
Typical
2500
0.5
15
20
Ohm
100
Amplitude Imbalance
dB
0.5
Phase Imbalance
deg
5.0
Size
mm
Differential Impedance
Max.
0.8 x 1.0 (WB)
1.2 x 1.1 (FC)
DIMENSIONS
STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given or that the use of such information will not infringe on the intellectual rights of third parties. Under no
circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of or inability to use the materials in this document. STATS ChipPAC reserves the right to change the
information at any time and without notice.
TYPICAL CHARACTERISTICS
1
Amplitude Imbalance (dB)
Insertion Loss (dB)
0
-10
-20
-30
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
-1
2.3
4.0
2.4
0
2.6
190
Phase Imbalance (deg)
Return Loss (dB)
2.5
Frequency (GHz)
Frequency (GHz)
-10
-20
-30
180
170
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.3
2.4
Frequency (GHz)
2.5
2.6
Frequency (GHz)
ASSEMBLY DRAWING / MECHANICAL OUTLINE
SCI-103W (Wirebond)
SCI-103F (Flip Chip)
Pad
SCI-103W Signal
1
Ground
SCI-103F Signal
Bias
2
Unbalanced
Unbalanced
3
Bias
Ground
4
Balanced (-)
Balanced (+)
5
Balanced (+)
Balanced (-)
NOTES
All dimension measurement units are in millimeters (mm). Electrical performance and typical values are measured at room
temperature. For best results, ground plane directly beneath the device should be in the top metal layer.
Refer to “Appendix A” for:
• Pad sizes and typical wirebond length used in the wirebonded IPD products.
• Recommended solder thermal profile, landing pattern recommendation and bump specifications used in the flip chip IPD
products.
www.statschippac.com
8
All rights reserved. Rev 02/2009