STB0FS12A

Product Data Sheet
STB0FS12A - Mid-Power LED
Achieving the best system cost in Mid/High Power
Mid Power LED – 2525 series
STB0FS12A
RoHS
Product Brief
Description
Features and Benefits
•
The package has a substrate made up
of a flexible film and Cu material
•
It incorporates state of the art SMD
design and low thermal resistant
material
•
•
•
•
•
•
The package design coupled with
careful selection of component
materials allow these products to
perform with high reliability
High flux output and high luminance
Mid to High Power package
Compact size package
SMT solderable
RoHS compliant
Key Applications
•
•
•
•
General lighting
Replacement lamps
Architectural
Commercial
Table 1. Product Selection Table
Dominant Wavelength [nm]
Part Number
STB0FS12A
Rev1.3, Dec 21, 2015
Color
Min.
Typ.
Max.
Blue
450
-
460
1
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Product Data Sheet
STB0FS12A - Mid-Power LED
Table of Contents
Index
•
Product Brief
1
•
Performance Characteristics
3
•
Characteristics Graph
4
•
Color Bin Structure
9
•
Mechanical Dimensions
10
•
Recommended Solder Pad
11
•
Reflow Soldering Characteristics
12
•
Emitter Tape & Reel Packaging
13
•
Product Nomenclature
15
•
Handling of Silicone Resin for LEDs
16
•
Precaution For Use
17
•
Company Information
20
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Product Data Sheet
STB0FS12A - Mid-Power LED
Performance Characteristics
Table 2. Characteristics, IF=150mA, Tj= 25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Forward Current
IF
-
150
-
mA
Forward Voltage
VF
-
3.2
-
V
Radiant Power
-
-
278
-
mW
Dominant Wavelength
λdom
450
-
460
nm
2Θ1/2
-
140
-
Deg.
RθJ-S
-
17
-
℃/W
Viewing Angle
[1]
Thermal resistance (J to S)
[2]
ESD Sensitivity(HBM)
-
Class 3A JESD22-A114-E
Table 3. Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Forward Current
IF
300
mA
Power Dissipation
PD
1.1
W
Junction Temperature
Tj
125
ºC
Operating Temperature
Topr
-40 ~ + 85
ºC
Storage Temperature
Tstg
-40 ~ + 100
ºC
Notes :
(1) Seoul Semiconductor maintains a tolerance of 7% on Intensity and power measurements.
(2) 2Θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
(3) Thermal resistance is junction to TS point (Refer to page 12).
•
LED’s properties might be different from suggested values like above and below tables if operation condition
will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the
absolute maximum rating of the product.
•
Thermal resistance can be increased substantially depending on the heat sink design/operating condition,
and the maximum possible driving current will decrease accordingly.
•
All measurements were made under the standardized environment of Seoul Semiconductor
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Product Data Sheet
STB0FS12A - Mid-Power LED
Characteristics Graph
Relative Emission Intensity (a.u.)
Fig 1. Color Spectrum, Tj = 25ºC , IF=150mA
1.0
0.5
0.0
400
500
600
700
Wavelength [nm]
Fig 2. Radiant Pattern, Tj = 25ºC , IF=150mA
Relative Intensity (%)
100
80
60
40
20
0
-80
-60
-40
-20
0
20
40
60
80
Angle [Degree]
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Product Data Sheet
STB0FS12A - Mid-Power LED
Characteristics Graph
Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC
0.30
Forward Current [A]
0.25
0.20
0.15
0.10
0.05
0.00
0
1
2
3
4
5
Forward Voltage [V]
Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC
Relative Luminous Intensity [a.u.]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.00
0.05
0.10
0.15
0.20
0.25
0.30
Forward Current [A]
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Product Data Sheet
STB0FS12A - Mid-Power LED
Characteristics Graph
Fig 5. Junction Temperature vs. Relative Radiant Power, IF=150mA
Relative Radiant Power
1.0
0.8
0.6
0.4
0.2
0.0
25
45
65
85
105
125
O
Junction Temperature Tj( C)
Fig 6. Junction Temperature vs. Relative Forward Voltage, IF=150mA
Relative Forward Voltage
1.0
0.8
0.6
0.4
0.2
0.0
25
45
65
85
105
125
O
Junction Temperature Tj( C)
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Product Data Sheet
STB0FS12A - Mid-Power LED
Characteristics Graph
Fig 7. Junction Temperature vs. Peak Wavelength Shift, IF=150mA
Peak Wavelength Shift (nm)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
25
45
65
85
105
125
O
Junction Temperature Tj( C)
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Product Data Sheet
STB0FS12A - Mid-Power LED
Characteristics Graph
Fig 8. Ambient Temperature vs. Maximum Forward Current, Tj_max = 125℃
0.35
Forward Current [A]
0.30
0.25
0.20
0.15
Rth j-a = 40K/W
0.10
Rth j-a = 50K/W
Rth j-a = 60K/W
0.05
0.00
0
20
40
60
80
100
O
Ambient Temperature Ta [ C]
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Product Data Sheet
STB0FS12A - Mid-Power LED
Color Bin Structure
Table 4. Bin Code description, Tj=25℃, IF=150mA
Radiant Power
(mW)
Dominant Wavelength
(nm)
Typical Forward Voltage
(V)
Part Number
STB0FS12A
Rev1.3, Dec 21, 2015
Bin
Code
Min.
Max.
Bin
Code
Min.
Max.
Bin
Code
Min.
Max.
C
240
260
B1
450.0
452.5
Z1
3.0
3.1
D
260
280
B2
452.5
455.0
Z2
3.1
3.2
E
280
300
B3
455.0
457.5
Z3
3.2
3.3
-
-
-
B4
457.5
460.0
A1
3.3
3.4
-
-
-
-
-
-
A2
3.4
3.5
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Product Data Sheet
STB0FS12A - Mid-Power LED
Mechanical Dimensions
< Top View >
< Bottom View >
Cathode
Anode
< Side View >
Circuit
Cathode
Anode
1
2
ESD Protection Device
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none.
(3) Undefined tolerance is ±0.1mm.
(4) The appearance and specifications of the product may be changed for improvement without notice.
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Product Data Sheet
STB0FS12A - Mid-Power LED
Recommended Solder Pad
< Solder Pad >
TS
point
Notes :
(1) All dimensions are in millimeters.
(2) Scale : none.
(3) Undefined tolerance is ±0.1mm .
(4) The appearance and specifications of the product may be changed for improvement without notice.
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Product Data Sheet
STB0FS12A - Mid-Power LED
Reflow Soldering Characteristics
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate (Ts_max to Tp)
3° C/second max.
3° C/second max.
Preheat
- Temperature Min (Ts_min)
- Temperature Max (Ts_max)
- Time (Ts_min to Ts_max) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃
260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds
20-40 seconds
Ramp-down Rate
6 °C/second max.
6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Caution :
(1) Reflow soldering is recommended not to be done more than two times
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered
When repair is unavoidable, suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
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Product Data Sheet
STB0FS12A - Mid-Power LED
Emitter Tape & Reel Packaging
( Tolerance: ±0.2, Unit: mm )
Notes :
(1) Quantity : Max. 3,000pcs/reel.
(2) Cumulative tolerance : Cumulative tolerance/10 pitches to be ±0.2mm.
(3) Adhesion strength of cover tape : Adhesion strength to be 0.1~0.7N when the cover tape is
turned off from the carrier tape at the angle of 10º to the carrier tape.
(4) Package : P/N, Manufacturing data code No. and Quantity to be indicated
on a damp proof package.
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Product Data Sheet
STB0FS12A - Mid-Power LED
Emitter Tape & Reel Packaging
Reel
Aluminum Bag
Outer Box
Rev1.3, Dec 21, 2015
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Product Data Sheet
STB0FS12A - Mid-Power LED
Product Nomenclature
Table 5. Part Numbering System : X1X2X3X4X5X6X7X8
Part Number Code
Description
Part Number
Value
X1
Company
S
X2
Top View LED series
T
X3
Color Specification
B0
Blue
X4
Package series
FS
FS series
X5X6
Characteristic code
12
X7
Revision
A
Table 6. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17
Lot Number Code
Description
Y1Y2
Year
Y3
Month
Y4Y5
Day
Y6
Top View LED series
Y7Y8Y9Y10
Mass order
Y11Y12Y13Y14Y15Y16Y17
Internal Number
Rev1.3, Dec 21, 2015
Lot Number
15
Value
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Product Data Sheet
STB0FS12A - Mid-Power LED
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These
conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust.
As mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.
(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.
product with acid or sulfur material in sealed space.
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Product Data Sheet
STB0FS12A - Mid-Power LED
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing LEDs in a dry box with a desiccant.
The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of
RH50%.
(2) Use Precaution after Opening the Packaging
Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may
affect the light output efficiency.
Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 30℃ Humidity : less than RH60%
b. If the package has been opened more than 1 year (MSL 2) or the color of the desiccant
changes, components should be dried for 10-24hr at 65±5℃
(3) Do not apply mechanical force or excess vibration during the cooling process to normal
temperature after soldering.
(4) Do not rapidly cool device after soldering.
(5) Components should not be mounted on warped (non coplanar) portion of PCB.
(6) Radioactive exposure is not considered for the products listed here in.
(7) Gallium arsenide is used in some of the products listed in this publication.
These products are dangerous if they are burned or shredded in the process of disposal.
It is also dangerous to drink the liquid or inhale the gas generated by such products when
chemically disposed of.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(9) When the LEDs are in operation the maximum current should be decided after measuring
the package temperature.
(10) LEDs must be stored in a clean environment. We recommend LEDs store in nitrogen-filled
container.
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Product Data Sheet
STB0FS12A - Mid-Power LED
Precaution for Use
(11) The appearance and specifications of the product may be modified for improvement without
notice.
(12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
(13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues.
(14) Attaching LEDs, do not use adhesives that outgas organic vapor.
(15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF.
If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(16) Similar to most Solid state devices;
LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS).
Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come
into contact. While most ESD events are considered harmless, it can be an expensive problem in
many industrial environments during production and storage. The damage from ESD to an LEDs may
cause the product to demonstrate unusual characteristics such as:
- Increase in reverse leakage current lowered turn-on voltage
- Abnormal emissions from the LED at low current
The following recommendations are suggested to help minimize the potential for an ESD event.
One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
One or more personnel suggestion options:
- Antistatic wrist-strap
- Antistatic material shoes
- Antistatic clothes
Environmental controls:
- Humidity control (ESD gets worse in a dry environment)
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Product Data Sheet
STB0FS12A - Mid-Power LED
Precaution for Use
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
- Changes to the performance of the LED package
(If the damage is around the bond pad area and since the package is completely encapsulated
the package may turn on but flicker show severe performance degradation.)
- Changes to the light output of the luminaire from component failure
- Components on the board not operating at determined drive power
Failure of performance from entire fixture due to changes in circuit voltage and current across total
circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed
to electrical overstress as the failure modes have been investigated to vary, but there are some
common signs that will indicate an EOS event has occurred:
- Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
- Damage to the bond pads located on the emission surface of the LED package
(shadowing can be noticed around the bond pads while viewing through a microscope)
- Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
- A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device
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Product Data Sheet
STB0FS12A - Mid-Power LED
Company Information
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of
light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage
and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than
10,000 patents globally, while offering a wide range of LED technology and production capacity in
areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT Multi-Junction Technology" a proprietary family of high-voltage LEDs.
The company’s broad product portfolio includes a wide array of package and device choices such as
Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type
LEDs as well as custom modules, displays, and sensors.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
property rights of any third party. The appearance and specifications of the product can be changed
to improve the quality and/or performance without notice.
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