Packaging Information Vishay Semiconductors SMA, SMB, SMC TAPE INFORMATION in inches (millimeters) P0 De-reeling direction 10 pitches cumulative tolerance on tape ± 0.2 P2 T2 D0 T E Top cover tape A0 (2) F W K0 B1 (1) E2 B0 S1 T1 D1 for components 2.0 mm x 1.2 mm and larger P1 Notes (1) For machine reference only, including draft and radii concenctric around B 0 (2) See Note 1 and table CASE TYPE FSMA FSMB FSMC TAPE SIZE W 0.472 (12) E 0.1 (1.8) 0.63 (16) F 0.2 (5.5) D0 P0 0.1 (1.5) 0.2 (4) P1 P2 A0, B0, C0 0.1 (2) See Note 1 0.2 (4) 0.3 (8) 0.3 (7.5) B1 MAX. D1 MIN. 0.3 (8.2) 0.1 (1.5) 0.5 (12) E2 MIN. 0.4 (10) 0.6 (14) T2 MAX. 0.1 (2.5) 0.1 (2.7) 0.1 (2.5) Notes (1) A , B , and K are determined by the maximum dimensions of the component size. The clearance between the component and the cavity 0 0 0 must be within 0.05 mm (0.002") min. to 0.5 mm (0.02") max. for 8 mm tape and 12 mm tape, 0.15 mm (0.066") min. to 0.90 mm (0.035") max. for 16 mm tape and 0.15 mm (0.006") min. to 1.0 mm (0.59") max. for 24 mm tape. (2) All surface mount components are packed in accordance with EIA standard 481-C. REEL INFORMATION in inches (millimeters) G N A B D T C CASE TYPE FSMC FSMA, FSMB A B 13 (330) Document Number: 95404 Revision: 11-May-10 0.1 (2.5) C 0.51 (13) D 0.86 (21.8) N 3.11 (79) G T 0.72 (18.4) 0.92 (23.4) 0.57 (14.4) 0.76 (19.4) For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] www.vishay.com 1