Embossed Tape and Reel Data for Surface Mounted Mold Diodes Carrier Tape Specifications 10 Pitches Cumulative Tolerance on Tape ±0.2mm(±0.008") P0 K D A0 P2 E T F D1 For Components 2.0mmx1.2mm and Larger B0 B1 k0 See Note 1 Embossment For Machine Reference Only Including Draft And RADLL Concentric Around Bo Center Lines of Cavity P User Direction of Feed H C Bar Code Label Top Cover *Tape Thickness(t1) R Min Tape and Components Shall Pass Around Radius"R"Without Damage 0.10mm (0.004")Max. E T M E Bending Radius W Top Cover Tape Embossed Carrier 100mm (3.937") Maximum Component Rotation 1mm Max Typical Component Cavity Center Line 1mm (0.39") Max Embossment Tape 250mm (9.843") Typical Component Cavity Center Line Camber (Top View) Allowable Camber To Lmm/100mm Nonaccumualtive Over 250mm S Dimensions Tape Size B1 Max. D D1 E F K P0 P2 R Min. T Max. W Max. 4 ± 0.1 mm (0.157 ± 0.004") 2 ± 0.1 mm (0.079 ± 0.002") 25 mm (0.98") 0.6 mm (0.024") 8.3 mm (0.327") 8 mm 4.55mm 1.5 +0.1mm (0.179") -0.0 1.0 Min (0.039") 1.75± 0.1 mm (0.069± 0.004) 3.5 ± 0.05 mm (0.138 ± 0.002") 2.4 mm Max (0.094") 12 mm 8.2mm (0.323") (0.059 + 0.004"-0.0) 1.5 mm Min (0.060") - 5.5 ± 0.05 mm (0.217 ± 0.002") 6.4 mm Max (0.252") - - 30 mm (1.18") - 12 ± 0.30 mm (0.47±0.012") 16 mm 12.1mm (0.476") - - - 7.5 ± 0.10 mm (0.295 ± 0.004") 7.9 mm Max (0.311") - - - - 16.3 mm (0.642") 24 mm 20.1mm (0.791") - - - 11.5 ± 0.10 mm (0.453 ± 0.004") 11.9 mm Max (0.468") - - - - 24.3 mm (0.957") Metric dimensions govern-English are in parentheses for reference only. Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be o within 0.05 mm min. to 0.5 mm max. The component cannot rotate more than 10 within the determined cavity. Note 2: If B1 exceeds 4.2 mm(0.165") for 8 mm embossed tape, the tape may not feed through all tape feeders. SEMTECH ELECTRONICS LTD. Subsidiary of Sino-Tech International (BVI) Limited ® Dated : 24/02/2009