SEMTECH ELECTRONICS LTD.

Embossed Tape and Reel Data for Surface Mounted Mold Diodes Carrier Tape Specifications
10 Pitches Cumulative
Tolerance on Tape
±0.2mm(±0.008")
P0
K
D
A0
P2
E
T
F
D1
For Components
2.0mmx1.2mm
and Larger
B0
B1
k0
See
Note 1
Embossment
For Machine Reference
Only
Including Draft And
RADLL
Concentric Around Bo
Center Lines
of Cavity
P
User Direction of Feed
H
C
Bar Code Label
Top Cover
*Tape
Thickness(t1)
R Min
Tape and
Components Shall
Pass Around
Radius"R"Without
Damage
0.10mm
(0.004")Max.
E
T
M
E
Bending Radius
W
Top
Cover Tape
Embossed Carrier
100mm
(3.937")
Maximum Component
Rotation
1mm Max
Typical
Component Cavity Center Line
1mm
(0.39") Max
Embossment
Tape
250mm
(9.843")
Typical
Component Cavity Center Line
Camber (Top View)
Allowable Camber To Lmm/100mm Nonaccumualtive Over 250mm
S
Dimensions
Tape Size
B1 Max.
D
D1
E
F
K
P0
P2
R Min.
T Max.
W Max.
4 ± 0.1 mm
(0.157 ± 0.004")
2 ± 0.1 mm
(0.079 ±
0.002")
25 mm
(0.98")
0.6 mm
(0.024")
8.3 mm
(0.327")
8 mm
4.55mm 1.5 +0.1mm
(0.179")
-0.0
1.0 Min
(0.039")
1.75± 0.1 mm
(0.069± 0.004)
3.5 ± 0.05 mm
(0.138 ± 0.002")
2.4 mm
Max
(0.094")
12 mm
8.2mm
(0.323")
(0.059 +
0.004"-0.0)
1.5 mm
Min
(0.060")
-
5.5 ± 0.05 mm
(0.217 ± 0.002")
6.4 mm
Max
(0.252")
-
-
30 mm
(1.18")
-
12 ± 0.30 mm
(0.47±0.012")
16 mm
12.1mm
(0.476")
-
-
-
7.5 ± 0.10 mm
(0.295 ± 0.004")
7.9 mm
Max
(0.311")
-
-
-
-
16.3 mm
(0.642")
24 mm
20.1mm
(0.791")
-
-
-
11.5 ± 0.10 mm
(0.453 ± 0.004")
11.9 mm
Max
(0.468")
-
-
-
-
24.3 mm
(0.957")
Metric dimensions govern-English are in parentheses for reference only.
Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
o
within 0.05 mm min. to 0.5 mm max. The component cannot rotate more than 10 within the determined cavity.
Note 2: If B1 exceeds 4.2 mm(0.165") for 8 mm embossed tape, the tape may not feed through all tape feeders.
SEMTECH ELECTRONICS LTD.
Subsidiary of Sino-Tech International (BVI) Limited
®
Dated : 24/02/2009