20160328113633738

APX7387
High Side and Low Side Driver
Features
General Description
•
The APX7387 is a high voltage, high speed, power
MOSFET and IGBT gate drivers with independent high
and low side referenced output channels. The high voltage process and common mode noise canceling technique provide stable operation of high-side driver under
high dv/dt noise circumstances. The IC built-in UVLO circuits to prevent malfunction when VCC and VBS are lower
than the specified threshold voltage. The APX7387 is available in SOP-8 and DIP-8 packages (see Pin Configuration).
•
•
•
•
•
Floating Channel designed for Bootstrap Operation
to +600V
Built-in Bootstrap Diode and Resistor
Typically 200mA/350mA Sourcing/Sinking Current
Driving Capability
Matched Propagation Delay Time: 200ns(max.)
3.3V and 5V Input Logic Compatible
Built-in Short-Through Prevention Circuit with 1µs
(min.) Dead Time
• Undervoltage Lockout(UVLO) for Vcc and VBS
• Built-in Common Mode dv/dt Noise Canceling Cir-
Pin Configuration
cuit
VCC 1
HIN 2
•
Motor Drive
•
Ballast
•
Power Audio Amplifier
SOP-8
LIN 3
GND 4
Applications
VCC
HIN
LIN
GND
8
7
6
5
1
2
3
4
8
7
6
5
DIP-8
VB
HO
VS
LO
VB
HO
VS
LO
Ordering and Marking Information
P ackage Code
J: D IP -8
K : S O P -8
O perating A m bient Tem perature R ange
I : -40 to 125 o C
Handling C ode
T U : Tube T R : T ape & R eel
A ssem bly M aterial
G : H alogen and Lead Free Device
A P X 7387
A ssem bly M aterial
Handling C ode
Tem perature R ange
P ackage Code
A P X 7387 J :
A P X 7387 K :
X X X X X - Date Code
A P X 7387
XXXXX
A P X 7387
XXXXX
X X X X X - D ate C ode
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)
and halogen free (Br or Cl does not exceed 900ppm by weight inhomogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
S
ANPEC reserves the right to make changes to improve reliability or manufacturability
without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Sep., 2015
1
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APX7387
Absolute Maximum Ratings (Note 2)
Symbol
Parameter
Ratings
Unit
VB
High-side Floating Supply Voltage
-0.3 to 625
V
VS
Hugh-side Floating Supply Offset Voltage
VB-20 to VB +0.3
V
VHO
High-side Floating Output Voltage
VS-0.3 to VB+0.3
V
VCC
Low-side and Logic-fixed Supply Voltage
-0.3 to 20
V
VLO
Low-side Output Voltage
VI N
Logic Input Voltage (all of HIN and LIN Pin)
dVS/dt
TJ
TSTG
TSDR
-0.3 to V CC+0.3
V
-0.3 to 20
V
Offset Voltage Slew Rate
50
V/ns
Maximum Junction Temperature
150
o
C
-65 to 150
o
C
260
o
C
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
Note 2: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
R TH,JA
Parameter
Thermal Resistance-Junction to Ambient
SOP-8
DIP-8
Typical Value
Unit
(Note 3)
156.25
125
o
C/W
Power Dissipation, TA=25℃
PD
SOP-8
DIP-8
W
0.8
1
Note 3: Mounted on a board (76x115x1.6t mm, Glass epoxy).
Recommended Operating Conditions
Symbol
Parameter
(Note 4)
Range
Unit
VS+10 to VS+15
V
11-VCC to 600
V
Supply Voltage
10 to 15
V
High-side Output Voltage
VS to VB
V
VLO
Low-side Output Voltage
0 to VCC
V
VIN
Logic Input Voltage (HIN and LIN Pin)
TA
Ambient Temperature
VB
High-side Floating Supply Voltage
VS
Hugh-side Floating Supply Offset Voltage
VCC
VHO
0 to VCC
V
-40 to 125
o
C
Note 4: Refer to the typical application circuit
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Sep., 2015
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APX7387
Electrical Characteristics
VCC, VBS = 15V, TA = 25°C, unless otherwise specified. The VIN and IIN parameters are referenced to GND. The VO and IO parameters are referenced to GND and VS and are applicable to the respective outputs LO and HO.
Symbol
Parameter
APX7387
Test Conditions
Unit
Min
Typ
Max
LOW SIDE POWER SUPPLY
VCC Quiescent Supply Current
VLIN= 0V or 5V
-
150
300
μA
VCCUV+
VCC Supply Under-Voltage Positive-going
Threshold
VBS=15V, VDD Rising
8
8.9
9.8
V
VCCUV-
VCC Supply Under-Voltage Negative-going
Threshold
VBS=15V, VDD Falling
7.4
8.2
9
V
VDDHYS
VCC Supply Under-Voltage Lockout Hysteresis
VBS=15V
-
0.7
-
V
IQCC
BOOTSTRAPPED POWER SUPPLY
IQBS
VBS Quiescent Supply Current
VHIN= 0V or 5V
I BS
Bootstrap Current
VB=0V
VBSUV+
VBS Supply Under-Voltage Positive-going
Threshold
VBSUVVBSHYS
I LK
-
150
300
μA
-30
-20
-10
mA
VDD=15V, VBS Rising
8
8.9
9.8
V
VBS Supply Under-Voltage Negative-going
Threshold
VDD=15V, VBS Falling
7.4
8.2
9
V
VBS Supply Under-Voltage Lockout Hysteresis
VDD=15V
-
0.7
-
V
Offset Supply Leakage Current
VB=VS=600V
-
-
50
μA
GATE DRIVER OUTPUT
VOH
Output High-level Voltage, VBIAS-VO
I O=20mA
-
-
1
V
VOL
Output Low-level Voltage, VO
I O=20mA
-
-
0.6
V
VO=0V, VIN=5V with PW<10μs
120
200
-
mA
VO=15V, VIN=0V with PW<10μs
250
350
-
mA
2.5
-
-
V
(note5)
IO+
Output High Short-circuit Pulsed Current
IO-
Output Low Short-circuit Pulsed Current (note5)
INPUT LOGIC
VIH
Logic “1” Input Voltage
VIL
Logic “0” Input Voltage
-
-
1
V
I IN+
Logic “1” Input Current
VIN=5V
-
25
50
μA
I IN-
Logic “0” Input Current
VIN=0V
-
-
2
μA
100
200
300
KΩ
RIN
Input Pull-down Resistance
Note 5: The parameters are guaranteed by design.
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APX7387
Dynamic Electrical Characteristics
TA = 25°C, VBIAS(VCC, VBS)=15V, VS=GND, Cload=1000pF unless otherwise specified.
Sym bol
t ON
tOFF
Pa ra mete r
AP X73 87
Te st Condit ions
Unit
Min
Typ
Max
Turn-o n Propa gation Delay Time
V S= 0V
-
30 0
600
ns
Turn-o ff Propag ation De lay Tim e
V S= 0V
-
30 0
600
ns
tR
Turn-o n Rise Time
-
10 0
170
ns
tF
Turn-o ff Fal l Time
-
80
150
ns
MT1
Turn-o n De lay Matching |t ON(H)-t ON (L)|
-
-
200
ns
MT2
Turn-o ff Del ay Matching |t OFF(H)-tOFF(L )|
-
-
100
ns
Dead Time
1
-
-
μs
DT
Pin Descriptions
PIN
FUNCTION
NO.
NAME
1
VCC
Logic and all low-side gate drivers power supply voltage.
2
HIN
Logic input for high-side gate driver.
3
LIN
Logic input for low-side gate driver.
4
GND
5
LO
Low-side gate driver output.
6
VS
High-side driver floating supply offset voltage.
7
HO
High-side gate driver output.
8
VB
High-side driver floating supply voltage.
Ground of the IC.
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APX7387
Typical Operating Characteristics
IQBS vs. Ambient Temperature
500
400
400
300
IQBS(μA)
IQDD(μA)
IQDD vs. Ambient Temperature
500
200
100
300
200
100
0
0
-40
-20
0
20
40
60
80
100
120
-40
-20
Ambient Temperature(°C)
20
40
60
80
100
120
VDDU- vs. Ambient Temperature
10
10
9.5
9.5
9
9
VDDU-(V)
VDDU+(V)
VDDU+ vs. Ambient Temperature
8.5
8.5
8
8
7.5
7.5
7
7
-40 -20
0 20 40 60 80 100 120 140
Ambient Temperature(°C)
-40 -20
VBSU+ vs. Ambient Temperature
0 20 40 60 80 100 120 140
Ambient Temperature(°C)
VBSU- vs. Ambient Temperature
15
15
13
13
11
11
VBSU-(V)
VBSU+(V)
0
Ambient Temperature(°C)
9
7
9
7
5
5
-40 -20
-40
0 20 40 60 80 100 120 140
Ambient Temperature(°C)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Sep., 2015
-20
0
20
40
60
80
100 120 140
Ambient Temperature(°C)
5
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APX7387
Typical Operating Characteristics
VOL vs. IO
0.3
0.5
0.25
0.4
0.2
VOL(V)
VOH(V)
VOH vs. IO
0.6
0.3
0.15
0.2
0.1
0.1
0.05
0
0
0 1 2 3 4 5 6 7 8 9 1011121314151617181920
0 1 2 3 4 5 6 7 8 9 1011121314151617181920
IO(mA)
IO(mA)
VIL vs. Ambient Temperature
4
4
3
3
VIL(V)
VIH(V)
VIH vs. Ambient Temperature
2
1
2
1
0
0
-40
-20
0
20
40
60
80
100 120 140
-40 -20
Ambient Temperature(°C)
RIN vs. Ambient Temperature
IIN+ vs. Ambient Temperature
400
50
40
300
RIN (kΩ)
IIN+(μA)
0 20 40 60 80 100 120 140
Ambient Temperature(°C)
30
200
20
100
10
0
0
-40
-20
0
20
40
60
80
-40
100 120 140
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Sep., 2015
-20
0
20
40
60
80
100 120 140
Ambient Temperature(°C)
Ambient Temperature(°C)
6
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APX7387
Typical Operating Characteristics
tOFF vs. Ambient Temperature
500
400
400
300
300
tOFF(ns)
tON(ns)
tON vs. Ambient Temperature
500
200
200
100
100
0
0
-40
-20
0
20
40
60
80
100
120
140
-40
-20
20
40
60
80
100 120 140
tF vs. Ambient Temperature
tR vs. Ambient Temperature
200
200
150
150
tF (ns)
tR(ns)
0
Ambient Temperature(°C)
Ambient Temperature(°C)
100
100
50
50
0
0
-40
-20
0
20
40
60
80
100 120 140
-40
-20
Ambient Temperature(°C)
0
20
40
60
80
100
120
140
Ambient Temperature(°C)
MT2 vs. Ambient Temperature
MT1 vs. Ambient Temperature
250
200
200
MT1(ns)
MT2(ns)
250
150
150
100
100
50
50
0
0
-40
-20
0
20
40
60
80
100 120 140
-40
Ambient Temperature(°C)
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Sep., 2015
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-20
0
20
40
60
80
100 120 140
Ambient Temperature(°C)
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APX7387
Typical Operating Characteristics
DT vs. Ambient Temperature
1900
1700
DT(ns)
1500
1300
1100
900
700
500
-40
-20
0
20
40
60
80
100 120 140
Ambient Temperature(°C)
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APX7387
Block Diagram
VB
UVLO
Noise
Canceller
Driver
Pulse
Generator
HIN
Schmitt Trigger
Input
R R
S
HO
Q
VS
LIN
Short Through
Prevention
VCC
UVLO
Delay
Driver
Control Logic
LO
GND
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APX7387
Typical Application Circuit
APX7387
Up to 600V
VCC
VCC
VB
HIN
HIN
HO
LIN
LIN
VS
GND
LO
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To
Load
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APX7387
Function Description
Switching Time Definition
Under Voltage Lockout(UVLO)
The APX7387 has under-voltage lockout protection
circuitry that monitors the supply voltage (VCC) and
bootstrap capacitor voltage (VBS) independently. When
HIN/LIN
50%
VCC and VBS are lower than the specified threshold
voltage the IC will enable the UVLO function. The UVLO
50%
tON(H)
tOFF(H)
tR
90%
hysteresis prevents chattering during power supply
tF
90%
HO
transitions.
10%
Short-Through Prevention
10%
MT1
The APX7387 has short-through prevention circuitry moni-
MT2
90%
toring the high-side and low-side control inputs. It can be
designed to prevent output when the high and low side
LO
tON(L)
tOFF(L)
10%
control inputs turning on at same time (see Figure1,2)
90%
10%
Figure 3. Switching Time Definition
HIN/LIN
Short-Through Prevent
LIN/HIN
HO/LO
DT
LO/HO
DT
Figure 1. Short-Through Prevention Waveform 1
HIN/LIN
LIN/HIN
Short-Through Prevent
HO/LO
DT
LO/HO
DT
Figure 2. Short-Through Prevention Waveform 2
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APX7387
Package Information
SOP-8
-T-
SEATING PLANE < 4 mils
D
E
E1
SEE VIEW A
h X 45
°
c
A
0.25
b
GAUGE PLANE
SEATING PLANE
A1
A2
e
L
VIEW A
S
Y
M
B
O
L
SOP-8
INCHES
MILLIMETERS
MIN.
MAX.
A
MIN.
MAX.
1.75
A1
0.10
A2
1.25
b
0.31
0.069
0.010
0.004
0.25
0.049
0.51
0.012
0.020
0.010
c
0.17
0.25
0.007
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
1.27 BSC
0.050 BSC
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
0
0°
8°
0°
8°
Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
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APX7387
Package Information
DIP-8
E1
D
A
L
0.38
A2
A1
E
D1
c
e
b
eA
eB
b2
S
Y
M
B
O
L
DIP-8
MILLIMETERS
MIN.
INCHES
MIN.
MAX.
A
MAX.
5.33
0.210
0.015
A1
0.38
A2
2.92
4.95
0.115
0.195
b
0.36
0.56
0.014
0.022
b2
1.14
1.78
0.045
0.070
0.014
0.400
c
0.20
0.35
0.008
D
9.01
10.16
0.355
D1
0.13
E
7.62
8.26
0.300
0.325
E1
6.10
7.11
0.240
0.280
0.005
e
2.54 BSC
0.100 BSC
eA
7.62 BSC
0.300 BSC
eB
L
0.430
10.92
2.92
0.115
3.81
0.150
Note : 1. Followed from JEDEC MS-001 BA
2. Dimension D, D1 and E1 do not include mold flash or
protrusions. Mold flash or protrusions shall not exceed
10 mil.
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APX7387
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
T1
C
d
D
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
SOP-8
W
E1
12.0±0.30 1.75±0.10
F
5.5±0.05
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOP-8
Tape & Reel
2500
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APX7387
Taping Direction Information
SOP-8
USER DIRECTION OF FEED
Classification Profile
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APX7387
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Copyright  ANPEC Electronics Corp.
Rev. A.1 - Sep., 2015
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
16
Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
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APX7387
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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