APX9268 Single-Phase Full-Wave Motor Driver for Silent Fan Motor Features General Description • • Silent Driver The APX9268 is a single phase full wave motor driver for DC fan motor. The output signal of this IC is the • Low Supply Current • Single Phase Full Wave Fan Driver amplified hall input signal. It is suitable for both game machine and CPU cooler that need silent drivers. The Built-in Lock Protection and Auto Restart Function device is built-in lock protection. When fan is locked, the device will enter the lockup protection mode. It is (External Capacitor Unnecessary) • FG Output • Include Hall Bias Circuit • Built-in Thermal Protection Circuit • Lead Free and Green Devices Available also with thermal shutdown function. In normal operation, the supply current is less than 5mA. The APX9268 is available in MSOP-8 package. (RoHS Compliant) Pin Configuration Applications • Motor Drivers For Silent Fan Motors OUT2 1 8 GND IN+ 2 7 OUT1 HB 3 6 VCC IN- 4 5 FG MSOP-8 Ordering and Marking Information Package Code X : MSOP - 8 Temperature Range I : -40 to 105 °C Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device APX9268 Assembly Material Handling Code Temperature Range Package Code APX9268 X : A9268 XXX XX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 1 www.anpec.com.tw APX9268 Absolute Maximum Ratings (Note 2) Symbol Parameter Rating Unit VCC VCC Pin Maximum Supply Voltage 7 V IOUT Output Pin Maximum Output Current 1 A VOUT Output Pin Output Supply Voltage 7 V IHB HB Pin Maximum Output Current 10 mA VFG FG Pin Maximum Output Voltage 7 V IFG FG Pin Maximum Output Current 10 mA Thermal Resistance-Junction to Ambient MSOP8 225 °C/W 0.585 W RTH, JA (Note1) PD Power Dissipation TJ Junction Temperature -40 to 150 °C TSTG Storage Temperature -65 to 150 °C TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 °C Note1: Mounted on a board (60x38x1.6t mm, Glass epoxy) Note2: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Symbol Parameter Ratings Unit VCC VCC Pin Supply Voltage 2 to 5.5 V VHall Hall Input Voltage Range 0.4 to Vcc-1.1 V -40 to 105 °C TA Ambient Temperature Electrical Characteristics (VCC=5V, TA=25°C) Symbol VHB ICC1 ICC2 Parameter Hall Bias Voltage Supply Current Test Conditions APX9268 Unit Min. Typ. Max. IHB = 0 ~ 5mA 1.1 1.3 1.5 V Rotation Mode - 3.5 5 mA Lock Protection Mode - 3.5 5 mA VHOFS Input Offset Voltage - - ±6 mV GIO Input – Output Gain 45 48 51 dB TON Lock Detection On Time 0.35 0.5 0.65 sec TOFF Lock Detection Off Time 3.5 5 6.5 sec VOL Output Lower Side Voltage IOUT = 250mA - 0.15 0.22 V VOH Output Upper Side Voltage IOUT = 250mA - 0.15 0.22 V VFG FG Pin Low Voltage IFG = 3mA - 0.2 0.3 V IFG FG Pin Leak Current VFG = 5V - - 1 µA Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 2 www.anpec.com.tw APX9268 Electrical Characteristics (Cont.) Symbol VHYS Parameter (VCC=5V, TA=25°C) APX9268 Test Conditions Input Hysteresis Voltage Over Temperature Shutdown Over Temperature Shutdown Hysteresis Min. Typ. Max. ±5 ±10 ±15 - 175 - - 25 - Unit mV °C Truth Table Input Output IN- IN+ OUT1 OUT2 FG Mode L H H L L H L L H OFF H L L L OFF L H L L L Operation Mode Lock Protection Mode Typical Operating Characteristics FG Pin Current vs. Low Voltage 4.5 10 4 9 Operation mode 3.5 FG Pin Current (mA) VCC Supply Current (mA) VCC Supply Current vs. VCC Supply Voltage 3 2.5 2 Lock Protection Mode 1.5 8 7 6 5 4 3 1 2 0.5 1 0 0 0 1 2 3 4 5 6 0 0.4 0.6 0.8 FG Pin Low Voltage (V) VCC Supply Voltage (V) Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 0.2 3 www.anpec.com.tw APX9268 Typical Operating Characteristics (Cont.) Offset Voltage vs. Ambient Temperature Output Voltage vs. Output Current 1.4 1 Output Voltage (V) Offset Voltage (mV) 1.2 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 80 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Upper Side Voltage Low Side Voltage 0 100 200 300 400 500 600 700 800 900 1000 Ambient Temperature (°C) Output Current (mA) HB Voltage vs. VCC Supply Voltage 700 1.4 600 1.2 500 1 HB Voltage (V) Maximum Power Dissipation (mW) Maximum Power Dissipation vs. Ambient Temperature 400 300 200 100 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 IHB =5mA 0 150 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Ambient Temperature (°C) Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 IHB =0mA VCC Supply Voltage (V) 4 www.anpec.com.tw APX9268 Operating Waveforms Rotation Mode Waveform1 Rotation Mode Waveform2 VIN-(50mV/div) VOUT1(2V/div) VIN+(50mV/div) VOUT2(2V/div) VOUT1(2V/div) VFG(5V/div) VOUT2(2V/div) IOUT (0.5A/div) Time (1ms/div) Time (1ms/div) Lock Protection Waveform2 Lock Protection Waveform1 TON Lock TOFF VOUT1(2V/div) VOUT1(2V/div) VOUT2(2V/div) VOUT2(2V/div) VFG(5V/div) IOUT (0.5A/div) IOUT (0.5A/div) Time (1s/div) Time (0.1s/div) Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 5 www.anpec.com.tw APX9268 Operating Waveforms (Cont.) Lock Protection Waveform3 Release VOUT1(2V/div) VOUT2(2V/div) VFG(5V/div) IOUT (0.5A/div) Time (50ms/div) Pin Description PIN Description No. Name 1 OUT2 2 IN+ Hall Input + 3 HB Hall Bias 4 IN- Hall Input - 5 FG FG signal output terminal 6 VCC Supply Voltage 7 OUT1 H-bridge output connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. 8 GND Power GND. H-bridge output connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 6 www.anpec.com.tw APX9268 Block Diagram 150kΩ OSC VCC GND 500Ω + OUT1 Lock Detection TSD IN+ + - IN - OUT2 500Ω Hall HB 150kΩ Bias FG _ + Typical Application Circuit OUT2 GND 1 8 IN+ OUT1 2 7 HB 3 Hall D2 Zener VCC D1 VIN 6 6V IN- FG 4 5 C1 RFG = 10kΩ R1 Pull High Voltage Note 3: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot by adding an input zener diode between the VCC and GND to clamp the overshoot. In normal operation, the zener diode isn’t stressed because output current doesn’t reverse to VCC. Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 7 www.anpec.com.tw APX9268 Function Description Lockup Protection and Automatic Restart The linear output architecture is used as output driver. The APX9268 provides the lockup protection and automatic restart functions for preventing the coil burn- Frequency Generator Function out in the fan is locked. This IC has an internal counter to determine the shutdown time (TOFF) and restart time The FG pin is an open collector output, connecting a pull up resistor to a high level voltage for the frequency (TON). During shutdown time, the output drivers keep turning off for 5 seconds and then enter the restart time. Dur- generator function. When IN- is larger than IN+, FG is high (switch off); when IN- is smaller than IN+, FG is low (switch on). Open the ing the restart time, one output is high and the other is low, which makes a torque for fan rotation. The restart terminal when not in using. time has 0.5 second. Thermal Protection If the locked condition is not removed, the shutdown/ restart process will be recurred until the locked condi- The APX9268 has thermal protection. When internal tion is released (See Figure 1 Lockup/Auto Restart junction temperature reaches 175°C, the output devices will be switched off. When the IC’s junction temperature cools Waveform). by 25°C, the thermal sensor will turn the output devices on again, resulting in a pulsed output during continuous Output Drivers thermal protection. All four drivers in the bridge output are designed for single phase full wave motor driver for fan motor. ININ+ TOFF TOFF OUT1 TON OUT2 FG Lock Lock Detection Release Reset Figure 1 Lockup /Auto Restart Waveform Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 8 www.anpec.com.tw APX9268 Application Information Input Protection Diode & Zener Diode & Capacitor FG Resistor It should be added a protection diode (D1) to protect the The value of the FG resistor could be decided by the fol- damage from the power reverse connection. However, the protection diode will cause a voltage drop on the lowing equation: − RFG = V CC V FG IFG supply voltage. The current rating of the diode must be larger than the maximum output current. Connecting For example: VCC and GND with a Zener diode (D2) can avoid exceeding the absolute maximum rating voltage. For the noise VCC = 5V, IFG = 3mA, VFG = 0.2V, RFG = 1.6KΩ reduction purpose, there is a capacitor (C1) 1µF (recommended) connecting VCC and GND (See Typical The value of resistor in the range of 1kΩ to 10kΩ is recommended. Application Circuit). Thermal Consideration Hall input The IC is safe to operate below the line and it will cause The output signal of this IC is the amplified hall input signal, therefore, the output signal depends on hall input. the thermal protection if the operating area is above the When the hall input is small, the output signal becomes gentle. Oppositely, the input signal is large, the output line. For example, TA= 75°C, the maximum power dis- becomes steep (See Figure 2 Different of output signal depending on the shape of hall input signal). The vs. Ambient Temperature). Mounted on a board, there is input/output gain is 48dB(typ.). Thus, please adjust the amplitude of hall input to meet the adequate output be calculated by the following equation: sipation is about 0.35W (See Power Dissipation 60x38x1.6t mm, Glass epoxy. The power dissipation can PD = (VCC - VOH + VOL) x IOUT + VCC x ICC voltage. For example: (IN+)-(IN-) If VCC = 5V, ICC = 4mA, IOUT = 270mA, VOH = 4.83V, VOL = 0.17V, then PD = 0.111W OUT1 The GND pin provides an electrical connection to ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat into ambient air. (IN+)-(IN-) OUT1 Figure 2 Different of output signal depending on the shape Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 9 www.anpec.com.tw APX9268 Package Information MSOP-8 D b 0.25 A A1 A2 c L GAUGE PLANE SEATING PLANE 0 e E E1 SEE VIEW A VIEW A S Y M B O L MSOP-8 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.10 0.043 0.15 0.000 0.006 0.75 0.95 0.030 0.037 b 0.22 0.38 0.009 0.015 A1 A2 0.00 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.70 5.10 0.185 0.201 E1 2.90 3.10 0.114 0.122 e 0.65 BSC 0.026 BSC L 0.40 0.80 0.016 0.031 0 0° 8° 0° 8° Note: 1. Follow JEDEC MO-187 AA. 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E1”does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side. Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 10 www.anpec.com.tw APX9268 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application MSOP- 8 A H T1 C d 12.4+2.00 13.0+0.50 330.0±2.00 50 MIN. 1.5 MIN. -0.00 -0.20 P0 P1 P2 D0 D1 1.5+0.10 4.00±0.10 8.00±0.10 2.00±0.10 1.5 MIN. -0.00 D W E1 20.2 MIN. 12.0±0.30 1.75±0.10 F 5.5±0.10 T A0 B0 K0 0.6+0.00 6.70±0.20 3.30±0.20 1.40±0.20 -0.40 (mm) Devices Per Unit Package Type Unit Quantity MSOP- 8 Tape & Reel 3000 Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 11 www.anpec.com.tw APX9268 Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C, 5 sec 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 12 www.anpec.com.tw APX9268 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures 3 3 Package Thickness <2.5 mm ≥2.5 mm Volume mm ≥350 225 +0/-5°C 225 +0/-5°C Volume mm <350 240 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Package Thickness Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.7 - Mar., 2008 13 www.anpec.com.tw