Webinar: Design recommendations HDI – HDI Design Guide Würth Elektronik Circuit Board Technology www.we-online.de Seite 1 02.07.2013 Agenda Nomenclature and definition Why Microvia technology? Possibilities Costs Route out a BGA www.we-online.de Seite 2 02.07.2013 Nomenclature and definition HDI • High Density Interconnection Microvia • Smallest, laser drilled holes Buried Via • Buried drills on the inner layers Pitch • Middle of a pad to the middle of a pad www.we-online.de Seite 3 02.07.2013 Nomenclature and definition Number of microvia layers Number of inner layers between the microvias Number of microvia layers Number of microvia layers Number of inner layers with buried vias Number of microvia layers www.we-online.de Seite 4 02.07.2013 Nomenclature and definition Number of microvia layers Number of microvia layers Number of inner layers with buried vias Number of inner layers between the microvias www.we-online.de Seite 5 02.07.2013 Why Microvia technology? Route out the smallest BGA pitch www.we-online.de High reliability Seite 6 02.07.2013 Why Microvia technology? TCT i.d.R -45° / + 125° C Solder process Aspect Ratio AR= h / IPC-2221/2122 Copper thickness t t CTEz h Expand! www.we-online.de h Standard-FR4 Z-Achse Expand Z-axis [µm] Basic material 70 60 50 40 30 20 10 0 25 Seite 7 50 75 Cu 100 125 150 175 200 225 250 T [°C] 02.07.2013 Why Microvia technology? Route out the smallest BGA pitch www.we-online.de High reliability Miniaturisation with ‘Via in Pad’ technology Seite 8 Cost-effective generation of high wiring density Future-proof technology – components are getting smaller all the time 02.07.2013 We will have a… What's the reason that plated through holes / vias can not be reduced to any small size? www.we-online.de Page 9 02.07.2013 Possibilities – Standard Microvias Standard - Microvia FinalØ 100µm Pad Ø 300µm With 60-70µm dielectric www.we-online.de Seite 10 02.07.2013 Possibilities –Microvias with impedance Standard - Microvia FinalØ 125µm Pad Ø 325µm With 85-110µm dielectric - 1 x pressed - 1 x electroplated www.we-online.de Seite 11 02.07.2013 Possibilities – Staggered Microvias www.we-online.de Seite 12 02.07.2013 Possibilities – Staggered Microvias - 2 x pressed - 2 x electroplated - Filling of the microvias and buried vias with epoxy www.we-online.de Seite 13 02.07.2013 Via Filling Process Copper FR4 Hardening Copper Drilling Polish Metallization Vacuum filling process www.we-online.de Seite 14 02.07.2013 Possibilities – Staggered Microvias Staggered Microvias Pitch ≥ 300µm www.we-online.de Seite 15 02.07.2013 Possibilities – Staggered Microvias - 3 x pressed - 3 x electroplated - Filling of the Micro- and buriedvias with epoxy www.we-online.de Seite 16 02.07.2013 Possibilities – Staggered Microvias and Buried Vias Pitch ≥ 400µm PadØ 550µm www.we-online.de Seite 17 02.07.2013 Possibilities – Staggered Microvias und Buried Vias - 3 x pressed - 3 x electroplated - Filling of the buried vias with epoxy www.we-online.de Seite 18 02.07.2013 Possibilities – Stacked Microvias Stacked microvia Copper filled www.we-online.de Seite 19 02.07.2013 Possibilities – Stacked Microvias - 3 x pressed - Filling of Buried Vias with epoxy - Filling of Microvias with epoxy - 4 x electroplated, metallization of µVias have to be done seperated to the buried vias www.we-online.de Seite 20 02.07.2013 Possibilities – Stacked Microvias on Buried Vias Stacked Microvia on Buried Via Buried Via filled and capped www.we-online.de Seite 21 02.07.2013 We will have a… With respect to the manufacturing costs, why is it preferable to use staggered microvias in comparision with the stacked option? www.we-online.de Page 22 02.07.2013 Via Filling Process Copper FR4 Hardening Copper Drilling Polish Metallization Metallization Vacuum filling process www.we-online.de Seite 23 02.07.2013 Possibilities – Stacked Microvias on Buried Vias - 3 x pressed - Filling of Buried Vias with epoxy and capping - Filling of Microvias with epoxy - 4 x electroplated www.we-online.de Seite 24 02.07.2013 Costs 175 % 1 x pressed 3 x pressed 2 x pressed 150 % extra buried Microvias 142 % buried Vias 120 % 115 % Costs Laser drilling 1 to 3 1. 2+4+2 Microvias Microvias 1. 2. 1. 1+6+1 ML08 ohne µ-Vías 1. Microvias 1 to 2 8 to 7 PTH 1 to 8 1 x pressed 1 x electroplated 1 x laserdrilled 1 x mech. drilled 2. Microvias 1 to 2 + 1 to 3 8 to 6 8 to 7 PTH 1 to 8 2 x pressed 1 x electroplated 1 x laserdrilled 1 x mech. drilled Microvia Filling? Microvias 1 to 2 2 to 3 7 to 6 8 to 7 PTH 1 to 8 2 x pressed 2 x electroplated 2 x laserdrilled 1 x mech. drilled 1 to 2 8 to 7 1 to 8 2 to 7 PTH Buried Via 2 x pressed 2 x electroplated 1 x laserdrilled 2 x mech. drilled Microvias 2. 1. 2. 2+4+2 100 % 90 % Microvias 1. 2. 2 + 4(6b) + 2 1 + 6b + 1 Staggered 2 + 4b + 2 1 to 2 2 to 3 7 to 6 8 to 7 1 to 8 2 to 7 PTH Buried Via 2 x pressed 2 x electroplated 2 x laserdrilled 2 x mech. drilled 1 to 2 2 to 3 7 to 6 8 to 7 1 to 8 3 to 6 PTH Buried Via 3 x pressed 3 x electroplated 2 x laserdrilled 2 x mech. drilled Complexity www.we-online.de Seite 25 11.06.2013 3. Route out BGA Pitch 0,8mm Route out with mech. vias www.we-online.de Seite 26 02.07.2013 Route out BGA Pitch 0,8mm Route out with Microvias, Dog bone www.we-online.de Seite 27 02.07.2013 Route out BGA Pitch 0,8mm Route out with Via in Pad www.we-online.de Seite 28 02.07.2013 Route out www.we-online.de Page 29 02.07.2013 Thank you for your attention! Dominic Büch WÜRTH ELEKTRONIK GmbH & Co. KG Product Management Lasercavity Circuit Board Technology P.: +49 7622 397 223 M.:+49 151 7270 9888 E. [email protected] W. www.we-online.de www.we-online.de Page 30 02.07.2013