Perfection in HDI Optimal use of the HDI technology (PDF)

Webinar: HDI 2 –Perfection in HDI
Optimal use of the HDI technology
Würth Elektronik Circuit Board Technology
www.we-online.de
Seite 1
04.09.2013
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de
Seite 2
04.09.2013
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de
Seite 3
04.09.2013
Overview
HDI
• High Density Interconnection
Microvia
• Smallest, laser drilled holes
Buried Via
• Buried drills on the inner layers
Pitch
• Middle of a pad to the middle of a pad
www.we-online.de
Seite 4
04.09.2013
Overview - Why Microvia technology?
TCT
i.d.R -45° / + 125° C
Solder process
Aspect Ratio
AR= h / 
IPC-2221/2122
Copper thickness t
t

CTEz
h
Expand!
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h

Standard-FR4 Z-Achse
Expand Z-axis
[µm]
Basic material
70
60
50
40
30
20
10
0
25
Seite 5
50
75
Cu
100 125 150 175 200 225 250
T [°C]
04.09.2013
Overview - Technologys
Standard
Microvia
www.we-online.de
Staggered
Microvias
Stacked
Microvias
Seite 6
Microvia
on Buried
Via
04.09.2013
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de
Seite 7
04.09.2013
Rout out BGA – 0,650 mm Pitch
Intel Atom
Pitch 0.593 diagonal
Pad 325 µm / Trace 89 µm / Spacing 90 µm
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Seite 8
11.06.2013
Route out BGA – 0,500 mm Pitch
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Seite 9
11.06.2013
Route out BGA – 0,500 mm Pitch
+
Large solderpads
No routing on the
outer layers
No fine line
structures on the
outer layers
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Seite 10
11.06.2013
Route out BGA – 0,500 mm Pitch
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Seite 11
11.06.2013
Route out BGA – 0,500 mm Pitch
+
Planar surface
Small solderpads
No routing on the
outer layer
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Seite 12
11.06.2013
Route out BGA – 0,500 mm Pitch
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Seite 13
11.06.2013
Route out BGA – 0,500 mm Pitch
+
-
Routing on the
outer layers
Normally one µVia
layer could be
saved
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Seite 14
Fine line structures
on the outer layer,
small soldermask
clearence
High production
effort
11.06.2013
Route out BGA – 0,400 mm Pitch
BGA Pad:
275 µm
µVia Pad inner layer:
300 µm
Trace width / spacing
Outer layer :
 100 µm
Inner layer:
 100 µm
Soldermask clearence:
35 µm
NSMD!!
- No trace between
the pads
- Each row in the
BGA needs an extra
µVia layer.
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Seite 15
11.06.2013
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de
Seite 16
04.09.2013
Costs


Pcb dimensions
Amount of layers
> could be essential if a product is succesful!
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Seite 17
04.09.2013
We will have a…
Why no plated through hole vias should be used,
if a complex HDI stackup is given?
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Page 18
04.09.2013
Costs
How many signal layers are needed?
PTH
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Microvia
Seite 19
04.09.2013
Costs
175 %
1 x pressed
3 x pressed
2 x pressed
150 %
extra
buried
Microvias
142 %
buried Vias
120 %
115 %
Costs
Laser drilling
1 to 3
1.
2+4+2
Microvias
Microvias
1.
2.
1.
1+6+1
ML08
ohne
µ-Vías
1.
Microvias 1 to 2
8 to 7
PTH
1 to 8
1 x pressed
1 x electroplated
1 x laserdrilled
1 x mech. drilled
2.
Microvias 1 to 2
+ 1 to 3
8 to 6
8 to 7
PTH
1 to 8
2 x pressed
1 x electroplated
1 x laserdrilled
1 x mech. drilled
Microvia Filling?
Microvias 1 to 2
2 to 3
7 to 6
8 to 7
PTH
1 to 8
2 x pressed
2 x electroplated
2 x laserdrilled
1 x mech. drilled
1 to 2
8 to 7
1 to 8
2 to 7
PTH
Buried Via
2 x pressed
2 x electroplated
1 x laserdrilled
2 x mech. drilled
Microvias
2.
1.
2.
2+4+2
100 %
90 %
Microvias
1. 2.
2 + 4(6b) + 2
1 + 6b + 1
Staggered
2 + 4b + 2
1 to 2
2 to 3
7 to 6
8 to 7
1 to 8
2 to 7
PTH
Buried Via
2 x pressed
2 x electroplated
2 x laserdrilled
2 x mech. drilled
1 to 2
2 to 3
7 to 6
8 to 7
1 to 8
3 to 6
PTH
Buried Via
3 x pressed
3 x electroplated
2 x laserdrilled
2 x mech. drilled
Complexity
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Seite 20
11.06.2013
3.
Kosten
Microvias stacked
Microvias
0,40 mm BGA Pitch
Costs
staggered
Filling ?
Complexity
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Seite 21
04.09.2013
We will have a…
Why is it cheaper, to have Buried Vias from the first to the last Microvia layer?
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Page 22
04.09.2013
Survey
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Page 23
04.09.2013
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de
Seite 24
04.09.2013
Roadmap
HDI 2.0
[µm]
2013
2014
2015
Trace width / spacing
75
50
Padsize Microvia
275
220
Dril ldiameter Microvia
100
90
Drill diameter Buried Via (mech.)
250
200
Forecast
75
150
Forecast:
•
•
•
•
BGA Pitch 0.30 mm
ELIC
HDI…5+x+5
High frequency – High Speed
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Seite 25
04.09.2013
Agenda
Overview Webinar HDI 1
Route out a BGA
Costs
Roadmap – HDI 2.0
Lasercavity
www.we-online.de
Seite 26
04.09.2013
Lasercavity?

With a laser prudced cavity

Exposing of layout on the inner layes

Embedding of components

Miniaturization

Better thermal management
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Seite 27
04.09.2013
Lasercavity
LASERCAVITY® – with sidewall matalization
HDI08_3+2(4b)+3
Querschnitt
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Seite 28
04.09.2013
Lasercavity
Two step Lasercavity with different electrical potentials
Micorvias for the thermal connection
to the aluminum
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Seite 29
04.09.2013
Lasercavity
LASERCAVITY® - Two levels for wire bonding
65 µm
step depth
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Seite 30
04.09.2013
Lasercavity
LASERCAVITY®
1.4 mm deep
250 µm
Stackup: 1+6b+1
• Lasercavity on layer 6
• Lasercavity surface for AL wire bonding
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Seite 31
LC
1400 µm
04.09.2013
Thank you for your attention!
Dominic Büch
WÜRTH ELEKTRONIK GmbH & Co. KG
Product Management
Lasercavity
Circuit Board Technology
P.: +49 7622 397 223
M.:+49 151 7270 9888
E. [email protected]
W. www.we-online.de
www.we-online.de
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04.09.2013