http://datasheet.sii-ic.com/en/battery_protection/S8259A_E.pdf

S-8259A Series
www.sii-ic.com
BATTERY MONITORING IC FOR 1-CELL PACK
© SII Semiconductor Corporation, 2015
Rev.1.0_02
The S-8259A Series is an IC including high-accuracy voltage detection circuits and delay circuits.
The S-8259A Series is suitable for monitoring overcharge and overdischarge for 1-cell lithium-ion / lithium polymer rechargeable
battery packs.
 Features
• High-accuracy voltage detection circuit
Overcharge detection voltage
3.5 V to 4.6 V (5 mV step)
Accuracy ±20 mV
Overcharge release voltage
3.1 V to 4.6 V*1
Accuracy ±50 mV
Overdischarge detection voltage
2.0 V to 3.4 V (10 mV step)
Accuracy ±50 mV
Accuracy ±100 mV
Overdischarge release voltage
2.0 V to 3.4 V*2
• Detection delay times are generated only by an internal circuit (external capacitors are unnecessary).
• Wide operation temperature range:
Ta = −40°C to +85°C
• Low current consumption
During operation:
1.5 μA typ., 3.0 μA max. (Ta = +25°C)
During overdischarge:
2.0 μA max. (Ta = +25°C)
• Lead-free (Sn 100%), halogen-free
*1. Overcharge release voltage = Overcharge detection voltage − Overcharge hysteresis voltage
(Overcharge hysteresis voltage can be selected from a range of 0 V to 0.4 V in 50 mV step.)
*2. Overdischarge release voltage = Overdischarge detection voltage + Overdischarge hysteresis voltage
(Overdischarge hysteresis voltage can be selected from a range of 0.1 V to 0.7 V in 100 mV step.)
 Applications
• Lithium-ion rechargeable battery pack
• Lithium polymer rechargeable battery pack
 Package
• SOT-23-6
1
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Block Diagram
VDD
Overdischarge
detection comparator
DO
Overcharge
detection comparator
Control logic
VSS
Delay circuit
Oscillator
CO
VM
Figure 1
2
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Product Name Structure
1. Product name
S-8259A xx
-
M6T1
U
Environmental code
U:
Lead-free (Sn 100%), halogen-free
Package abbreviation and IC packing specifications*1
M6T1: SOT-23-6, Tape
Serial code*2
Sequentially set from AA to ZZ
*1. Refer to the tape drawing.
*2. Refer to "3. Product name list".
2. Package
Table 1 Package Drawing Codes
Package Name
SOT-23-6
Dimension
Tape
Reel
MP006-A-P-SD
MP006-A-C-SD
MP006-A-R-SD
3. Product name list
Table 2
Product Name
Overcharge
Detection
Voltage
[VCU]
S-8259AAA-M6T1U
S-8259AAB-M6T1U
S-8259AAC-M6T1U
S-8259AAD-M6T1U
S-8259AAE-M6T1U
4.275 V
4.250 V
3.900 V
4.200 V
4.200 V
Overcharge Overdischarge Overdischarge Overcharge Overcharge Overdischarge
Detection
Release
Detection
Release
Release
Detection
Delay
Time Delay Time
Voltage
Voltage
Voltage
Delay Time
[tCU]
[VCL]
[VDL]
[VDU]
[tDL]
[tCL]
4.175 V
4.100 V
3.800 V
4.100 V
4.200 V
2.300 V
2.500 V
2.000 V
2.500 V
2.800 V
2.600 V
3.000 V
2.300 V
3.000 V
3.000 V
1.0 s
1.0 s
1.0 s
256 ms
1.0 s
32 ms
128 ms
32 ms
2.0 s
4.0 s
128 ms
256 ms
128 ms
32 ms
256 ms
Remark 1. Please contact our sales office for the products with detection voltage value other than those specified above.
2. The delay times can be changed within the range listed in Table 3. For details, please contact our sales office.
Table 3
Delay Time
Overcharge detection
delay time
Overcharge release
delay time
overdischarge detection
delay time
Symbol
Selection Range
Remark
tCU
128 ms
256 ms
512 ms
1.0 s
2.0 s
4.0 s
tCL
32 ms
64 ms
128 ms
1.0 s
2.0 s
4.0 s
tDL
32 ms
64 ms
128 ms
256 ms
−
−
Select a value
from the left.
Select a value
from the left.
Select a value
from the left.
3
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Pin Configuration
1. SOT-23-6
Table 4
Top view
6 5 4
1 2 3
Figure 2
Pin No.
Symbol
Description
1
DO
2
VM
3
CO
4
NC*1
Output pin for overdischarge detection
(CMOS output)
Negative power supply input pin for CO pin
Output pin for overcharge detection
(CMOS output)
No connection
5
VDD
Input pin for positive power supply
6
VSS
Input pin for negative power supply
*1. The NC pin is electrically open.
The NC pin can be connected to VDD pin or VSS pin.
4
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Absolute Maximum Ratings
Table 5
(Ta = +25°C unless otherwise specified)
Item
Symbol
Input voltage between VDD pin and VSS pin
VM pin input voltage
DO pin output voltage
CO pin output voltage
Power dissipation
Operation ambient temperature
VDS
VVM
VDO
VCO
PD
Topr
Storage temperature
Tstg
Applied Pin
Absolute Maximum Rating
Unit
V
V
V
V
−
−
VSS − 0.3 to VSS + 6
VDD − 28 to VDD + 0.3
VSS − 0.3 to VDD + 0.3
VVM − 0.3 to VDD + 0.3
650*1
−40 to +85
mW
°C
−
−55 to +125
°C
VDD
VM
DO
CO
*1. When mounted on board
[Mounted board]
(1) Board size: 114.3 mm × 76.2 mm × t1.6 mm
(2) Board name: JEDEC STANDARD51-7
The absolute maximum ratings are rated values exceeding which the product could suffer physical
damage. These values must therefore not be exceeded under any conditions.
700
Power Dissipation (PD) [mW]
Caution
600
500
400
300
200
100
0
0
50
100
150
Ambient Temperature (Ta) [°C]
Figure 3 Power Dissipation of Package (When Mounted on Board)
5
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Electrical Characteristics
1. Ta = +25°C
Item
Table 6
Symbol
(Ta = +25°C unless otherwise specified)
Test
Min.
Typ.
Max.
Unit
Circuit
Condition
Detection Voltage
Overcharge detection voltage
VCU
Overcharge release voltage
VCL
Overdischarge detection voltage
Overdischarge release voltage
Input Voltage
Operation voltage between VDD pin and
VSS pin
Input Current
VDL
VDU
Current consumption during operation
Current consumption during overdischarge
Output Resistance
CO pin resistance "H" 1
CO pin resistance "L"
DO pin resistance "H"
DO pin resistance "L"
CO pin resistance "H" 2
Delay Time
Overcharge detection delay time
Overcharge release delay time
Overdischarge detection delay time
IOPE
IOPED
VDSOP
−
*1
Ta = −10°C ~ +60°C
VCL ≠ VCU
VCL = VCU
−
VDL ≠ VDU
−
VDD = 3.4 V, VVM = 0 V
VDD = 1.5 V, VVM = 0 V
VCU − 0.020
VCU
VCU + 0.020
VCU − 0.025
VCU
VCL − 0.050
VCL − 0.025
VDL − 0.050
VDU − 0.100
VCL
VCL
VDL
VDU
1.5
V
1
VCU + 0.025
V
1
VCL + 0.050
VCL + 0.020
VDL + 0.050
VDU + 0.100
V
V
V
V
1
1
2
2
−
6.0
V
−
−
−
1.5
−
3.0
2.0
μA
μA
3
3
RCOH1
RCOL
RDOH
RDOL
RCOH2
−
−
−
−
−
5
5
5
5
1
10
10
10
10
4
20
20
20
20
−
kΩ
kΩ
kΩ
kΩ
MΩ
4
4
4
4
4
tCU
tCL
tDL
−
−
−
tCU × 0.7
tCL × 0.7
tDL × 0.7
tCU
tCL
tCU × 1.3
tCL × 1.3
tDL × 1.3
−
−
−
5
5
5
tDL
*1. Since products are not screened at high and low temperature, the specification for this temperature range is guaranteed by
design, not tested in production.
6
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
2. Ta = −40°C to +85°C*1
Table 7
(Ta = −40°C to +85°C*1 unless otherwise specified)
Item
Detection Voltage
Overcharge detection voltage
Symbol
Condition
Min.
Typ.
Max.
Unit
Test
Circuit
−
VCU − 0.045
VCL − 0.080
VCU
VCL
VCU + 0.030
VCL + 0.060
V
V
1
1
−
VCL − 0.050
VDL − 0.080
VDU − 0.130
VCL
VDL
VDU
VCL + 0.030
VDL + 0.060
VDU + 0.110
V
V
V
1
2
2
−
1.5
−
6.0
V
−
−
−
1.5
−
4.0
3.0
μA
μA
3
3
kΩ
kΩ
kΩ
VCU
Overcharge release voltage
VCL
Overdischarge detection voltage
Overdischarge release voltage
Input Voltage
Operation voltage between VDD pin and
VSS pin
Input Current
Current consumption during operation
Current consumption during overdischarge
Output Resistance
CO pin resistance "H" 1
CO pin resistance "L"
DO pin resistance "H"
DO pin resistance "L"
CO pin resistance "H" 2
Delay Time
Overcharge detection delay time
Overcharge release delay time
Overdischarge detection delay time
VDL
VDU
VDSOP
IOPE
IOPED
VCL ≠ VCU
VCL = VCU
VDL ≠ VDU
VDD = 3.4 V, VVM = 0 V
VDD = VVM = 1.5 V
RCOH1
RCOL
RDOH
RDOL
RCOH2
−
−
−
−
−
2.5
2.5
2.5
2.5
0.5
10
10
10
10
4
30
30
30
30
−
kΩ
MΩ
4
4
4
4
4
tCU
tCL
tDL
−
−
−
tCU × 0.5
tCL × 0.5
tDL × 0.5
tCU
tCL
tDL
tCU × 2.5
tCL × 2.5
tDL × 2.5
−
−
−
5
5
5
*1. Since products are not screened at high and low temperature, the specification for this temperature range is guaranteed by
design, not tested in production.
7
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Test Circuits
Caution Unless otherwise specified, the output voltage levels "H" and "L" at CO pin (VCO) are judged by VVM +
1.0 V, and the output voltage levels "H" and "L" at DO pin (VDO) are judged by VSS + 1.0 V. Judge the CO
pin level with respect to VVM and the DO pin level with respect to VSS.
1. Overcharge detection voltage, overcharge release voltage
(Test circuit 1)
Overcharge detection voltage (VCU) is defined as the voltage V1 at which VCO goes from "H" to "L" when the voltage V1
is gradually increased from the starting condition of V1 = 3.4 V. Overcharge release voltage (VCL) is defined as the
voltage V1 at which VCO goes from "L" to "H" when the voltage V1 is then gradually decreased. Overcharge hysteresis
voltage (VHC) is defined as the difference between VCU and VCL.
2. Overdischarge detection voltage, overdischarge release voltage
(Test circuit 2)
Overdischarge detection voltage (VDL) is defined as the voltage V1 at which VDO goes from "H" to "L" when the voltage
V1 is gradually decreased from the starting condition of V1 = 3.4 V. Overdischarge release voltage (VDU) is defined as
the voltage V1 at which VDO goes from "L" to "H" when the voltage V1 is then gradually increased. Overdischarge
hysteresis voltage (VHD) is defined as the difference between VDU and VDL.
3. Current consumption during operation
(Test circuit 3)
The current consumption during operation (IOPE) is the current that flows through VDD pin (IDD) under the set condition
of V1 = 3.4 V.
4. Current consumption during overdischarge
(Test circuit 3)
The current consumption during overdischarge (IOPED) is IDD under the set condition of V1 = 1.5 V.
5.
CO pin resistance "H" 1
(Test circuit 4)
The CO pin resistance "H" 1 (RCOH1) is the resistance between VDD pin and CO pin under the set conditions of V1 = 3.4 V,
V3 = 3.0 V.
6.
CO pin resistance "L"
(Test circuit 4)
The CO pin resistance "L" (RCOL) is the resistance between VM pin and CO pin under the set conditions of V1 = 4.7 V,
V3 = 0.4 V.
7.
DO pin resistance "H"
(Test circuit 4)
The DO pin resistance "H" (RDOH) is the resistance between VDD pin and DO pin under the set conditions of V1 = 3.4 V,
V4 = 3.0 V.
8.
DO pin resistance "L"
(Test circuit 4)
The DO pin resistance "L" (RDOL) is the resistance between VSS pin and DO pin under the set conditions of V1 = 1.8 V,
V4 = 0.4 V.
9.
CO pin resistance "H" 2
(Test circuit 4)
The CO pin resistance "H" 2 (RCOH2) is the resistance between VDD pin and CO pin under the set conditions of V1 = 4.7 V,
V3 = 0 V.
8
Rev.1.0_02
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
10. Overcharge detection delay time
(Test circuit 5)
The overcharge detection delay time (tCU) is the time needed for VCO to go to "L" just after the voltage V1 increases and
exceeds VCU under the set condition of V1 = 3.4 V.
11. Overcharge release delay time
(Test circuit 5)
The overcharge release delay time (tCL) is the time needed for VCO to go to "H" just after the voltage V1 decreases and
falls below VCL under the set condition of V1 = 4.7 V.
12. Overdischarge detection delay time
(Test circuit 5)
The overdischarge detection delay time (tDL) is the time needed for VDO to go to "L" after the voltage V1 decreases and
falls below VDL under the set condition of V1 = 3.4 V.
9
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
R1 = 330 Ω
Rev.1.0_02
VDD
VDD
V1
S-8259A Series
V1
C1
= 0.1 μF
VSS
VSS
VM
DO
CO
V VDO
V VCO
V VCO
COM
COM
Figure 4 Test Circuit 1
Figure 5 Test Circuit 2
VDD
VDD
V1
V1
S-8259A Series
VSS
S-8259A Series
VSS
VM
DO
VM
CO
DO
CO
A IDO
A ICO
V4
V3
COM
COM
Figure 6 Test Circuit 3
VDD
V1
S-8259A Series
VSS
VM
DO
Oscilloscope
CO
Oscilloscope
COM
Figure 8 Test Circuit 5
10
VM
DO
CO
V VDO
IDD
A
S-8259A Series
Figure 7 Test Circuit 4
V2
Rev.1.0_02
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
 Operation
Remark Refer to " Connection Example".
1. Normal status
The S-8259A Series monitors the voltage of the battery connected between VDD pin and VSS pin to control charging
and discharging. When the battery voltage is in the range from overdischarge detection voltage (VDL) to overcharge
detection voltage (VCU), CO pin and DO pin both output the VDD pin level. This condition is called the normal status.
2. Overcharge status
When the battery voltage becomes higher than VCU during charging in the normal status and the condition continues for
the overcharge detection delay time (tCU) or longer, CO pin outputs the VM pin level. This condition is called the
overcharge status.
When the battery voltage falls below the overcharge release voltage (VCL) and the condition continues for the
overcharge release delay time (tCL) or longer, the S-8259A Series releases the overcharge status.
3. Overdischarge status
When the battery voltage falls below VDL during discharging in the normal status and the condition continues for the
overdischarge detection delay time (tDL) or longer, DO pin outputs the VSS pin level. This condition is called the
overdischarge status.
When the battery voltage exceeds the overdischarge release voltage (VDU), the S-8259A Series releases the
overdischarge status.
11
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Timing Chart
1. Overcharge detection, overdischarge detection
VCU
VCL
Battery voltage
VDU
VDL
VDD
DO pin voltage
VSS
VDD
CO pin voltage
VVM
Overcharge release delay time (tCL)
Overcharge detection delay time (tCU)
Status
*1
(1)
Overdischarge detection delay time (tDL)
(2)
*1. (1): Normal status
(2): Overcharge status
(3): Overdischarge status
Figure 9
12
(1)
(3)
(1)
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Connection Example
R1
VDD
Battery
DO
C1
S-8259A Series
CO
VSS
VM
Figure 10
Table 8 Constants for External Components
Symbol
Part
R1
Resistor
C1
Capacitor
Purpose
ESD protection,
For power fluctuation
For power fluctuation
Min.
Typ.
Max.
Remark
150 Ω
330 Ω
1 kΩ
−
0.068 μF
0.1 μF
1.0 μF
−
Caution 1. The above constants may be changed without notice.
2. It has not been confirmed whether the operation is normal or not in circuits other than the above example
of connection. In addition, the example of connection shown above and the constant do not guarantee
proper operation. Perform thorough evaluation using the actual application to set the constant.
13
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Precautions
• The application conditions for the input voltage, output voltage, and load current should not exceed the package power
dissipation.
• Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic
protection circuit.
• SII Semiconductor Corporation claims no responsibility for any and all disputes arising out of or in connection with any
infringement by products including this IC of patents owned by a third party.
14
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Characteristics (Typical Data)
1. Current consumption
1. 1 IOPE vs. Ta
4.0
IOPE [A]
3.0
2.0
1.0
0.0
40 25
0
25
Ta [C]
50
75 85
2. Detection voltage
2. 2 VCL vs. Ta
4.31
4.24
4.29
4.21
VCL [V]
VCU [V]
2. 1 VCU vs. Ta
4.27
4.25
4.23
4.15
4.12
40 25
4.09
0
25
Ta [C]
50
75 85
2. 3 VDL vs. Ta
2.38
2.80
2.34
2.70
2.30
2.26
2.22
40 25
0
25
Ta [C]
50
75 85
0
25
Ta [C]
50
75 85
2. 4 VDU vs. Ta
VDU [V]
VDL [V]
4.18
2.60
2.50
40 25
2.40
0
25
Ta [C]
50
75 85
40 25
15
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
3. Delay time
3. 1 tCU vs. Ta
3. 2 tCL vs. Ta
2.6
80
64
1.8
tCL [ms]
tCU [s]
2.2
1.4
1.0
32
0.6
0.2
48
16
40 25
0
25
Ta [C]
50
75 85
0
25
Ta [C]
50
75 85
40 25
0
25
Ta [C]
50
75 85
3. 3 tDL vs. Ta
320
tDL [ms]
256
192
128
64
40 25
4. Output resistance
4. 2 RCOL vs. VCO
30
30
20
20
RCOL [k]
RCOH1 [k]
4. 1 RCOH1 vs. VCO
10
0
0
0
1
2
3
VCO [V]
4
5
0
1
2
3
VCO [V]
4
5
1
2
3
VDO [V]
4
5
4. 4 RDOL vs. VDO
30
30
20
20
RDOL [k]
RDOH [k]
4. 3 RDOH vs. VDO
10
0
10
0
0
16
10
1
2
3
VDO [V]
4
5
0
BATTERY MONITORING IC FOR 1-CELL PACK
S-8259A Series
Rev.1.0_02
 Marking Specifications
1.
SOT-23-6
Top view
6
5
(1) to (3):
(4):
4
Product code (refer to Product name vs. Product code)
Lot number
(1) (2) (3) (4)
1
2
3
Product name vs. Product code
Product Name
Product Code
(1)
(2)
(3)
S-8259AAA-M6T1U
H
5
A
S-8259AAB-M6T1U
S-8259AAC-M6T1U
S-8259AAD-M6T1U
S-8259AAE-M6T1U
H
H
H
H
5
5
5
5
B
C
D
E
17
2.9±0.2
1.9±0.2
6
0.95
5
1
4
2
3
+0.1
0.15 -0.05
0.95
0.35±0.15
No. MP006-A-P-SD-2.0
TITLE
SOT236-A-PKG Dimensions
No.
MP006-A-P-SD-2.0
SCALE
UNIT
mm
SII Semiconductor Corporation
4.0±0.1(10 pitches:40.0±0.2)
+0.1
ø1.5 -0
2.0±0.05
+0.2
ø1.0 -0
0.25±0.1
4.0±0.1
1.4±0.2
3.2±0.2
3 2 1
4 5 6
Feed direction
No. MP006-A-C-SD-3.1
TITLE
SOT236-A-Carrier Tape
MP006-A-C-SD-3.1
No.
SCALE
UNIT
mm
SII Semiconductor Corporation
12.5max.
9.0±0.3
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. MP006-A-R-SD-2.1
SOT236-A-Reel
TITLE
MP006-A-R-SD-2.1
No.
SCALE
UNIT
QTY
3,000
mm
SII Semiconductor Corporation
Disclaimers (Handling Precautions)
1.
All the information described herein (product data, specifications, figures, tables, programs, algorithms and
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without
notice.
2.
The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or
infringement of third-party intellectual property rights and any other rights due to the use of the information described
herein.
3.
SII Semiconductor Corporation is not responsible for damages caused by the incorrect information described herein.
4.
Take care to use the products described herein within their specified ranges. Pay special attention to the absolute
maximum ratings, operation voltage range and electrical characteristics, etc.
SII Semiconductor Corporation is not responsible for damages caused by failures and/or accidents, etc. that occur
due to the use of products outside their specified ranges.
5.
When using the products described herein, confirm their applications, and the laws and regulations of the region or
country where they are used and verify suitability, safety and other factors for the intended use.
6.
When exporting the products described herein, comply with the Foreign Exchange and Foreign Trade Act and all
other export-related laws, and follow the required procedures.
7.
The products described herein must not be used or provided (exported) for the purposes of the development of
weapons of mass destruction or military use. SII Semiconductor Corporation is not responsible for any provision
(export) to those whose purpose is to develop, manufacture, use or store nuclear, biological or chemical weapons,
missiles, or other military use.
8.
The products described herein are not designed to be used as part of any device or equipment that may affect the
human body, human life, or assets (such as medical equipment, disaster prevention systems, security systems,
combustion control systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment,
aviation equipment, aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle
use or other uses. Do not use those products without the prior written permission of SII Semiconductor Corporation.
Especially, the products described herein cannot be used for life support devices, devices implanted in the human
body and devices that directly affect human life, etc.
Prior consultation with our sales office is required when considering the above uses.
SII Semiconductor Corporation is not responsible for damages caused by unauthorized or unspecified use of our
products.
9.
Semiconductor products may fail or malfunction with some probability.
The user of these products should therefore take responsibility to give thorough consideration to safety design
including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing
injury or death, fires and social damage, etc. that may ensue from the products' failure or malfunction.
The entire system must be sufficiently evaluated and applied on customer's own responsibility.
10. The products described herein are not designed to be radiation-proof. The necessary radiation measures should be
taken in the product design by the customer depending on the intended use.
11. The products described herein do not affect human health under normal use. However, they contain chemical
substances and heavy metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips
may be sharp. Take care when handling these with the bare hands to prevent injuries, etc.
12. When disposing of the products described herein, comply with the laws and ordinances of the country or region where
they are used.
13. The information described herein contains copyright information and know-how of SII Semiconductor Corporation.
The information described herein does not convey any license under any intellectual property rights or any other
rights belonging to SII Semiconductor Corporation or a third party. Reproduction or copying of the information
described herein for the purpose of disclosing it to a third-party without the express permission of SII Semiconductor
Corporation is strictly prohibited.
14. For more details on the information described herein, contact our sales office.
1.0-2016.01
www.sii-ic.com