http://datasheet.sii-ic.com/en/battery_protection/S8206A_E.pdf

S-8206A Series
www.sii-ic.com
BATTERY PROTECTION IC FOR 1-CELL PACK
(SECONDARY PROTECTION)
© SII Semiconductor Corporation, 2015-2016
Rev.1.2_00
The S-8206A Series is used for secondary protection of lithium-ion / lithium polymer rechargeable batteries, and incorporates a
high-accuracy voltage detection circuit and a delay circuit.
 Features
• High-accuracy voltage detection circuit
Overcharge detection voltage
3.50 V to 5.00 V (5 mV step)
Accuracy ±20 mV
*1
Accuracy ±50 mV
Overcharge release voltage
3.10 V to 4.95 V
• Detection delay time is generated only by an internal circuit (external capacitors are unnecessary).
• Output logic is selectable:
Active "H", active "L"
• Output form is selectable:
CMOS output, Nch open-drain output
• Wide operation temperature range
Ta = −40°C to +85°C
• Low current consumption
During operation:
1.5 μA typ., 3.0 μA max. (Ta = +25°C)
• Lead-free (Sn 100%), halogen-free
*1. Overcharge release voltage = Overcharge detection voltage − Overcharge hysteresis voltage
(Overcharge hysteresis voltage can be selected from a range of 0.05 V to 0.4 V in 50 mV step.)
 Applications
• Lithium-ion rechargeable battery pack
• Lithium polymer rechargeable battery pack
 Packages
• SNT-6A
• HSNT-6 (1212)
1
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
 Block Diagram
1. CMOS output, active "H"
VDD
DO
Overcharge detection
comparator
Control logic
VSS
Delay circuit
Oscillator
CO
VM
Figure 1
2
Rev.1.2_00
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
2. CMOS output, active "L"
VDD
DO
Overcharge detection
comparator
Control logic
VSS
Delay circuit
Oscillator
CO
VM
Figure 2
3
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
3. Nch open-drain output
VDD
DO
Overcharge detection
comparator
Control logic
VSS
Delay circuit
Oscillator
CO
VM
Figure 3
4
Rev.1.2_00
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
 Product Name Structure
1. Product name
S-8206A xx
-
xxxx
U
Environmental code
U:
Lead-free (Sn 100%), halogen-free
Package abbreviation and IC packing specifications*1
I6T1: SNT-6A, Tape
A6T2: HSNT-6 (1212), Tape
Serial code*2
Sequentially set from AA to ZZ
*1. Refer to the tape drawing.
*2. Refer to "3. Product name list".
2. Packages
Table 1 Package Drawing Codes
Package Name
SNT-6A
HSNT-6 (1212)
Dimension
Tape
Reel
Land
PG006-A-P-SD
PM006-A-P-SD
PG006-A-C-SD
PM006-A-C-SD
PG006-A-R-SD
PM006-A-R-SD
PG006-A-L-SD
PM006-A-L-SD
5
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
3. Product name list
3. 1 SNT-6A
Table 2
Product Name
Overcharge
Detection Voltage
[VCU]
Overcharge
Release Voltage
[VCL]
Overcharge Detection
*1
Delay Time
[tCU]
S-8206AAA-I6T1U
S-8206AAB-I6T1U
S-8206AAC-I6T1U
S-8206AAD-I6T1U
S-8206AAE-I6T1U
S-8206AAF-I6T1U
S-8206AAG-I6T1U
S-8206AAH-I6T1U
S-8206AAI-I6T1U
4.500 V
4.150 V
4.550 V
4.200 V
4.150 V
4.000 V
4.250 V
4.100 V
4.150 V
4.000 V
4.250 V
4.100 V
4.450 V
4.150 V
4.400 V
4.100 V
4.350 V
4.050 V
*1. Overcharge detection delay time 1 s / 2 s / 4 s is selectable.
*2. Output logic active "H" / active "L" is selectable.
*3. Output form CMOS output / Nch open-drain output is selectable.
2s
2s
2s
2s
2s
2s
2s
2s
2s
*2
Output Form*3
Output Logic
Active "H"
Active "H"
Active "L"
Active "L"
Active "H"
Active "H"
Active "H"
Active "H"
Active "H"
CMOS output
CMOS output
CMOS output
CMOS output
Nch open-drain output
Nch open-drain output
CMOS output
CMOS output
CMOS output
Remark Please contact our sales office for the products with detection voltage value other than those specified above.
3. 2 HSNT-6 (1212)
Table 3
Product Name
S-8206AAA-A6T2U
S-8206AAB-A6T2U
Overcharge
Detection Voltage
[VCU]
Overcharge
Release Voltage
[VCL]
Overcharge Detection
*1
Delay Time
[tCU]
4.500 V
4.150 V
4.550 V
4.200 V
*1. Overcharge detection delay time 1 s / 2 s / 4 s is selectable.
*2. Output logic active "H" / active "L" is selectable.
*3. Output form CMOS output / Nch open-drain output is selectable.
2s
2s
*2
Output Logic
Active "H"
Active "H"
Output Form*3
CMOS output
CMOS output
Remark Please contact our sales office for the products with detection voltage value other than those specified above.
6
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
 Pin Configurations
1. SNT-6A
Top view
1
2
3
Table 4
6
5
4
Figure 4
Pin No.
1
Symbol
NC*1
2
CO
3
4
5
6
DO
VSS
VDD
VM
Description
No connection
Connection pin of charge control FET gate
(CMOS output)
Input pin for test signal
Input pin for negative power supply
Input pin for positive power supply
Negative power supply pin for CO pin
*1. The NC pin is electrically open.
The NC pin can be connected to VDD pin or VSS pin.
2. HSNT-6 (1212)
Table 5
Top view
1
2
3
6
5
4
Bottom view
6
5
4
1
2
3
Pin No.
1
Symbol
*2
NC
2
CO
3
4
5
6
DO
VSS
VDD
VM
Description
No connection
Connection pin of charge control FET gate
(CMOS output)
Input pin for test signal
Input pin for negative power supply
Input pin for positive power supply
Negative power supply pin for CO pin
*1
Figure 5
*1. Connect the heat sink of backside at shadowed area to the board, and set electric potential open or VDD.
However, do not use it as the function of electrode.
*2. The NC pin is electrically open.
The NC pin can be connected to VDD pin or VSS pin.
7
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
 Absolute Maximum Ratings
Table 6
(Ta = +25°C unless otherwise specified)
Item
Symbol
Applied Pin
Absolute Maximum Rating
Unit
Input voltage between VDD pin and VSS pin
VDS
VDD
VSS − 0.3 to VSS + 6
V
VM pin input voltage
VVM
VM
VDD − 28 to VDD + 0.3
V
DO pin input voltage
VDO
DO
VCO
CO
VSS − 0.3 to VDD + 0.3
VVM − 0.3 to VDD + 0.3
VVM − 0.3 to VVM + 28
400*1
480*1
−40 to +85
V
V
V
mW
mW
°C
−55 to +125
°C
CMOS output
Nch open-drain output
SNT-6A
Power dissipation
HSNT-6 (1212)
Operation ambient temperature
Topr
−
−
−
Storage temperature
Tstg
−
CO pin output
voltage
PD
*1. When mounted on board
[Mounted board]
(1) Board size: 114.3 mm × 76.2 mm × t1.6 mm
(2) Board name: JEDEC STANDARD51-7
Caution
The absolute maximum ratings are rated values exceeding which the product could suffer physical
damage. These values must therefore not be exceeded under any conditions.
Power Dissipation (PD) [mW]
700
600
HSNT-6 (1212)
500
SNT-6A
400
300
200
100
0
0
50
100
150
Ambient Temperature (Ta) [°C]
Figure 6 Power Dissipation of Package (When Mounted on Board)
8
Rev.1.2_00
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
 Electrical Characteristics
1. Ta = +25°C
Item
Table 7
Symbol
(Ta = +25°C unless otherwise specified)
Test
Min.
Typ.
Max.
Unit
Circuit
Condition
Detection Voltage
Overcharge detection voltage
VCU
Overcharge release voltage
VCL
Input Voltage
Operation voltage between VDD pin and
VSS pin
Input Current
Current consumption during operation
Output Resistance
CO pin resistance "H" 1
CO pin resistance "L" 1
DO pin resistance "H"
DO pin resistance "L"
CO pin resistance "H" 2
CO pin resistance "L" 2
Output Current
CO pin leakage current "L"
Delay Time
Overcharge detection delay time
VDSOP
−
*1
Ta = −10°C to +60°C
VCL ≠ VCU
VCL = VCU
−
VCU − 0.020
VCU − 0.025
VCU
VCU
VCU + 0.020
VCU + 0.025
V
V
1
1
VCL − 0.050
VCL
VCL + 0.050
V
1
VCL − 0.025
VCL
VCL + 0.020
V
1
1.5
−
6.0
V
−
IOPE
VDD = 3.4 V, VVM = 0 V
−
1.5
3.0
μA
2
RCOH1
RCOL1
RDOH
RDOL
RCOH2
RCOL2
CMOS output
−
−
−
CMOS output, active "L"
CMOS output, active "H"
5
5
5
5
1
1
10
10
10
10
4
4
20
20
20
20
−
−
kΩ
kΩ
kΩ
kΩ
MΩ
MΩ
3
3
3
3
3
3
ICOLL
Nch open-drain output
−
−
0.1
μA
3
tCU × 0.7
tCU
tCU × 1.3
−
4
tCU
−
*1. Since products are not screened at high and low temperature, the specification for this temperature range is guaranteed by
design, not tested in production.
9
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
 Test Circuits
Caution 1. Unless otherwise specified, the output voltage levels "H" and "L" at CO pin (VCO) are judged by the
threshold voltage (1.0 V) of the N-channel FET. Judge the CO pin level with respect to VVM.
2. Set SW to ON and OFF in Nch open-drain output and CMOS output, respectively.
1. Overcharge detection voltage, overcharge release voltage
(Test circuit 1)
1. 1 Active "H"
Overcharge detection voltage (VCU) is defined as the voltage V1 at which VCO goes from "L" to "H" when the voltage
V1 is gradually increased from the starting condition of V1 = 3.4 V. Overcharge release voltage (VCL) is defined as
the voltage V1 at which VCO goes from "H" to "L" when the voltage V1 is then gradually decreased. Overcharge
hysteresis voltage (VHC) is defined as the difference between VCU and VCL.
1. 2 Active "L"
Overcharge detection voltage (VCU) is defined as the voltage V1 at which VCO goes from "H" to "L" when the
voltage V1 is gradually increased from the starting condition of V1 = 3.4 V. Overcharge release voltage (VCL) is
defined as the voltage V1 at which VCO goes from "L" to "H" when the voltage V1 is then gradually decreased.
Overcharge hysteresis voltage (VHC) is defined as the difference between VCU and VCL.
2. Current consumption during operation
(Test circuit 2)
The current consumption during operation (IOPE) is the current that flows through VDD pin (IDD) under the set condition of
V1 = 3.4 V.
3. CO pin resistance "H" 1 (CMOS output)
(Test circuit 3)
3. 1 Active "H"
The CO pin resistance "H" 1 (RCOH1) is the resistance between VDD pin and CO pin under the set conditions of V1 = 5.1 V,
V2 = 4.7 V.
3. 2 Active "L"
The CO pin resistance "H" 1 (RCOH1) is the resistance between VDD pin and CO pin under the set conditions of V1 = 3.4 V,
V2 = 3.0 V.
4. CO pin resistance "L" 1
(Test circuit 3)
4. 1 Active "H"
The CO pin resistance "L" 1 (RCOL1) is the resistance between VM pin and CO pin under the set conditions of V1 = 3.4 V,
V2 = 0.4 V.
4. 2 Active "L"
The CO pin resistance "L" 1 (RCOL1) is the resistance between VM pin and CO pin under the set conditions of V1 = 5.1 V,
V2 = 0.4 V.
5. DO pin resistance "H"
(Test circuit 3)
The DO pin resistance "H" (RDOH) is the resistance between VDD pin and DO pin under the set conditions of V1 = 3.4 V,
V3 = 3.0 V.
10
Rev.1.2_00
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
6. DO pin resistance "L"
(Test circuit 3)
The DO pin resistance "L" (RDOL) is the resistance between VSS pin and DO pin under the set conditions of V1 = 1.8 V,
V3 = 0.4 V.
7. CO pin resistance "H" 2 (CMOS output, active "L")
(Test circuit 3)
The CO pin resistance "H" 2 (RCOH2) is the resistance between VDD pin and CO pin under the set conditions of V1 = 5.1 V,
V2 = 0 V.
8. CO pin resistance "L" 2 (CMOS output, active "H")
(Test circuit 3)
The CO pin resistance "L" 2 (RCOL2) is the resistance between VM pin and CO pin under the set conditions of V1 = 5.1 V,
V2 = 5.1 V.
9. CO pin leakage current "L" (Nch open-drain output)
(Test circuit 3)
9. 1 Active "H"
The CO pin leakage current "L" (ICOLL) is the current that flows through CO pin (ICO) under the set conditions of
V1 = 5.1 V, V2 = 28 V.
9. 2 Active "L"
The CO pin leakage current "L" (ICOLL) is the current that flows through CO pin (ICO) under the set conditions of
V1 = 3.4 V, V2 = 28 V.
10. Overcharge detection delay time
(Test circuit 4)
10. 1 Active "H"
The overcharge detection delay time (tCU) is the time needed for VCO to go to "H" just after the voltage V1 increases
and exceeds VCU under the set condition of V1 = 3.4 V.
10. 2 Active "L"
The overcharge detection delay time (tCU) is the time needed for VCO to go to "L" just after the voltage V1 increases
and exceeds VCU under the set condition of V1 = 3.4 V.
11
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
R1 = 330 Ω
IDD
A
VDD
S-8206A Series
V1
C1 = 0.1 μF
VDD
V1
S-8206A Series
VSS
VSS
VM
DO
CO
V VCO SW
COM
COM
Figure 7 Test Circuit 1
Figure 8 Test Circuit 2
VDD
V1
VDD
V1
S-8206A Series
VSS
VM
DO
S-8206A Series
VSS
CO
VM
A IDO
A ICO
V3
V2
COM
DO
Oscilloscope
CO
SW
Oscilloscope
COM
Figure 9 Test Circuit 3
12
VM
DO
CO
V VDO
Rev.1.2_00
Figure 10 Test Circuit 4
Rev.1.2_00
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
 Operation
Remark Refer to " Battery Protection IC Connection Example".
1. Overcharge detection status
The S-8206A Series monitors the voltage of the battery connected between VDD pin and VSS pin to detect overcharge.
When the battery voltage exceeds the overcharge detection voltage (VCU) during charging in the normal status and the
condition continues for the overcharge detection delay time (tCU) or longer, the S-8206A Series outputs overcharge
detection signal from the CO pin. This condition is called overcharge status. Connecting FET to the CO pin provides
charge control and a second protection.
2. Test mode
tCU can be shortened by forcibly setting the DO pin to VSS level from external. When the DO pin is forcibly set to VSS level
from external, tCU will be shortened to approximately 1/64.
13
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
 Timing Charts
1. Overcharge detection
VCU
VCL (VCU − VHC)
Battery voltage
VDD
CO pin voltage
CMOS output
Active "H"
VVM
VDD
CO pin voltage
CMOS output
Active "L"
VVM
VDD
CO pin voltage
Nch open-drain output
Active "H"
High-Z
VVM
VDD
CO pin voltage
Nch open-drain output
Active "L"
High-Z
High-Z
VVM
Overcharge detection delay time (tCU)
(1)
*1
Status
*1. (1): Normal status
(2): Overcharge status
Figure 11
14
(2)
(1)
Rev.1.2_00
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
 Battery Protection IC Connection Example
Figure 12 shows the connection example when CMOS output, active "H" product is used.
Protector fuse
EB+
R1
VDD
Battery
C1
DO
S-8206A Series
FET
VSS
CO
VM
EB−
Figure 12
Table 8 Constants for External Components
Symbol
FET
R1
C1
Part
Purpose
N-channel
Charge control
MOS FET
ESD protection,
Resistor
For power fluctuation
Capacitor For power fluctuation
Min.
Typ.
Max.
Remark
−
−
−
−
150 Ω
330 Ω
1 kΩ
−
0.068 μF
0.1 μF
1.0 μF
−
Caution 1. The above constants may be changed without notice.
2. It has not been confirmed whether the operation is normal or not in circuits other than the above
example of connection. In addition, the example of connection shown above and the constant do not
guarantee proper operation. Perform thorough evaluation using the actual application to set the
constant.
15
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
[For SC PROTECTOR, contact]
Device Sales Dept., Advanced Process Device Division, Dexerials Corporation
Gate City Osaki East Tower 8F, 1-11-2
Osaki, Shinagawa-ku, Tokyo, 141-0032 Japan
TEL +81-3-5435-3946
Contact Us: http://www.dexerials.jp/en/
 Precautions
• The application conditions for the input voltage, output voltage, and load current should not exceed the package power
dissipation.
• Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic
protection circuit.
• SII Semiconductor Corporation claims no responsibility for any and all disputes arising out of or in connection with any
infringement by products including this IC of patents owned by a third party.
16
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
 Characteristics (Typical Data)
1. Current consumption
1. 1 IOPE vs. Ta
4.0
IOPE [A]
3.0
2.0
1.0
0.0
40 25
0
25
Ta [C]
50
75 85
2. Detection voltage
2. 1 VCU vs. Ta
2. 2 VCL vs. Ta
4.53
VCL [V]
VCU [V]
4.51
4.49
4.47
4.45
40 25
0
25
Ta [C]
50
75 85
0
25
Ta [C]
50
75 85
4.21
4.19
4.17
4.15
4.13
4.11
4.09
4.07
40 25
0
25
Ta [C]
50
75 85
3. Delay time
3. 1 tCU vs. Ta
5.0
tCU [s]
4.0
3.0
2.0
1.0
40 25
17
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
Rev.1.2_00
4. Output resistance
4. 1 RCOH1 vs. VCO
4. 2 RCOL1 vs. VCO
30
RCOL1 [k]
RCOH1 [k]
30
20
10
0
20
10
0
0
1
2
3
4
0
1
2
VCO [V]
3
4
1
2
VDO [V]
3
4
VCO [V]
4. 4 RDOL vs. VDO
30
30
20
20
RDOL [k]
RDOH [k]
4. 3 RDOH vs. VDO
10
0
0
0
1
2
VDO [V]
18
10
3
4
0
Rev.1.2_00
BATTERY PROTECTION IC FOR 1-CELL PACK (SECONDARY PROTECTION)
S-8206A Series
 Marking Specifications
1.
SNT-6A
Top view
6
5
(1) to (3):
(4) to (6):
4
Product code (refer to Product name vs. Product code)
Lot number
(1) (2) (3)
(4) (5) (6)
1
2
3
Product name vs. Product code
Product Code
(1)
(2)
(3)
J
N
A
J
N
B
J
N
C
J
N
D
J
N
E
J
N
F
J
N
G
J
N
H
J
N
I
Product Name
S-8206AAA-I6T1U
S-8206AAB-I6T1U
S-8206AAC-I6T1U
S-8206AAD-I6T1U
S-8206AAE-I6T1U
S-8206AAF-I6T1U
S-8206AAG-I6T1U
S-8206AAH-I6T1U
S-8206AAI-I6T1U
2.
HSNT-6 (1212)
Top view
6
5
(1) to (3):
(4), (5):
4
Product code (refer to Product name vs. Product code)
Lot number
(1) (2) (3)
(4) (5)
1
2
3
Product name vs. Product code
Product Name
S-8206AAA-A6T2U
S-8206AAB-A6T2U
Product Code
(1)
(2)
(3)
J
N
A
J
N
B
19
1.57±0.03
6
1
5
4
2
3
+0.05
0.08 -0.02
0.5
0.48±0.02
0.2±0.05
No. PG006-A-P-SD-2.1
TITLE
SNT-6A-A-PKG Dimensions
No.
PG006-A-P-SD-2.1
ANGLE
UNIT
mm
SII Semiconductor Corporation
+0.1
ø1.5 -0
4.0±0.1
2.0±0.05
0.25±0.05
+0.1
1.85±0.05
5°
ø0.5 -0
4.0±0.1
0.65±0.05
3 2 1
4
5 6
Feed direction
No. PG006-A-C-SD-1.0
TITLE
SNT-6A-A-Carrier Tape
No.
PG006-A-C-SD-1.0
ANGLE
UNIT
mm
SII Semiconductor Corporation
12.5max.
9.0±0.3
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. PG006-A-R-SD-1.0
SNT-6A-A-Reel
TITLE
No.
PG006-A-R-SD-1.0
ANGLE
QTY.
UNIT
5,000
mm
SII Semiconductor Corporation
0.52
1.36
2
0.52
0.2 0.3
1.
2.
1
(0.25 mm min. / 0.30 mm typ.)
(1.30 mm ~ 1.40 mm)
0.03 mm
SNT
1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.).
2. Do not widen the land pattern to the center of the package ( 1.30 mm ~ 1.40 mm ).
Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package.
2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm
or less from the land pattern surface.
3. Match the mask aperture size and aperture position with the land pattern.
4. Refer to "SNT Package User's Guide" for details.
1.
2.
(0.25 mm min. / 0.30 mm typ.)
(1.30 mm ~ 1.40 mm)
No. PG006-A-L-SD-4.1
TITLE
SNT-6A-A
-Land Recommendation
No.
PG006-A-L-SD-4.1
ANGLE
UNIT
mm
SII Semiconductor Corporation
0.40
1.00±0.05
0.38±0.02
0.40
4
6
3
1
+0.05
0.08 -0.02
1.20±0.04
The heat sink of back side has different electric
potential depending on the product.
Confirm specifications of each product.
Do not use it as the function of electrode.
0.20±0.05
No. PM006-A-P-SD-1.1
TITLE
HSNT-6-B-PKG Dimensions
No.
PM006-A-P-SD-1.1
ANGLE
UNIT
mm
SII Semiconductor Corporation
2.0±0.05
+0.1
ø1.5 -0
4.0±0.1
0.25±0.05
+0.1
ø0.5 -0
0.50±0.05
4.0±0.1
1.32±0.05
5°
3
1
4
6
Feed direction
No. PM006-A-C-SD-1.0
TITLE
HSNT-6-B-C a r r i e r Tape
No.
PM006-A-C-SD-1.0
ANGLE
UNIT
mm
SII Semiconductor Corporation
+1.0
9.0 - 0.0
11.4±1.0
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. PM006-A-R-SD-1.0
TITLE
HSNT-6-B-Reel
No.
PM006-A-R-SD-1.0
ANGLE
QTY.
UNIT
5,000
mm
SII Semiconductor Corporation
1.04min.
Land Pattern
0.24min.
1.02
0.40±0.02
0.40±0.02
(1.22)
Caution It is recommended to solder the heat sink to a board
in order to ensure the heat radiation.
PKG
Metal Mask Pattern
Aperture ratio
Aperture ratio
Caution
Mask aperture ratio of the lead mounting part is 100%.
Mask aperture ratio of the heat sink mounting part is 40%.
Mask thickness: t0.10mm to 0.12 mm
100%
40%
t0.10mm ~ 0.12 mm
TITLE
HSNT-6-B
-Land Recommendation
PM006-A-L-SD-2.0
No.
ANGLE
No. PM006-A-L-SD-2.0
UNIT
mm
SII Semiconductor Corporation
Disclaimers (Handling Precautions)
1.
All the information described herein (product data, specifications, figures, tables, programs, algorithms and
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without
notice.
2.
The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
SII Semiconductor Corporation is not responsible for damages caused by the reasons other than the products or
infringement of third-party intellectual property rights and any other rights due to the use of the information described
herein.
3.
SII Semiconductor Corporation is not responsible for damages caused by the incorrect information described herein.
4.
Take care to use the products described herein within their specified ranges. Pay special attention to the absolute
maximum ratings, operation voltage range and electrical characteristics, etc.
SII Semiconductor Corporation is not responsible for damages caused by failures and/or accidents, etc. that occur
due to the use of products outside their specified ranges.
5.
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Prior consultation with our sales office is required when considering the above uses.
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The user of these products should therefore take responsibility to give thorough consideration to safety design
including redundancy, fire spread prevention measures, and malfunction prevention to prevent accidents causing
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The entire system must be sufficiently evaluated and applied on customer's own responsibility.
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The information described herein does not convey any license under any intellectual property rights or any other
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1.0-2016.01
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