ROHM BU1840AMUV-E

Datasheet
For 2Cell Solar,
Synchronous Switch-Mode Charger IC
BU1840AMUV
●General Description
The BU1840AMUV device provides the best system to
the product charged with 1cell Li-ion battery and 3cell
Nickel-metal-hydride batteries using the 2cell, 3cell, and
4cell solar panel.
It is possible to boost it according to the voltage of 2 cell
solar panel with built-in the function to boost the low
voltage input.
Moreover, the solar battery maximum dissipation can be
drawn out with built-in the peak power track function. It is
possible to select the the switching frequency according
to the terminal SEL.
It is also possible to monitor the charging current by the
I2C interface.
Built in heat reckless driving protection (Thermal
shutdown), decrease voltage protection, and input
current protection for protection function
●Applications
„ Solar mobile phone
„ Solar audio
„ Solar portable charger
„ Solar LED illumination
W(Typ.) x D(Typ.) x H(Max.)
4.00mm x 4.00mm x 1.00mm
●Package(s)
VQFN024V4040
●Features
„ Synchronous Switch-Mode Charger for 2Cell Solar
[email protected]=3.7V,VIN=1V
„ MPPT control voltage range:0.7V~1.5V
„ Charging current completion voltage:
5.0V (hysteresis: 0.075V)
„ Built in MPPT
„ Switching frequency (160kHz,320kHz)
„ Charging current monitor by I2C
„ UVLO-detect Voltage:0.625V
„ UVLO-release Voltage:0.700V
„ Thermal Shutdown
„ 24 pin VQFN024V4040 (4.1mm×4.1mm<MAX>)
VQFN024V4040
●Typical Application Circuit(s)
●Typical Performance characteristics
<For 2 Cells Solar>
<Efficiency (for 2 cells solar)>
(VINMON=1.0V, OUTS=3.7V, Pin = 50mW ~ 2W)
100
SEL=GND
Efficiency [%]
SEL=VIN
90
80
70
10
○Product structure:Silicon monolithic integrated circuit
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
100
Pin [mW]
1000
10000
○This product is not designed protection against radioactive rays
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Datasheet
BU1840AMUV
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Maximum applied voltage 1
Vmax1
7.0
V
Maximum applied voltage 2
Vmax2
2.5
V
Power dissipation1
Pd1
560
mW
Power dissipation2
Pd2
1766
mW
Operating temperature range
Topr
-30~+85
℃
Storage temperature range
Tstr
-55~+150
℃
Conditions
VIO,SDA,SCL,SW1,2,3, ENB
COREVDD,OUTP1,2,OUTPM,OUTS
VIN,VINMON,V18,IMON,PCOMP,
SEL,OSC
1layer(74.2x74.2mm)boad
2
(Surface heat radiation copper foil:6.28mm )
4layer(74.2x74.2mm)boad
2
(1,4layer heat radiation copper foil:6.28mm )
2
(2,3layer heat radiation copper foil:5500mm )
*1 When it is used by more than Ta=25℃, it is reduced by 5.6mW/℃. *1
*2 When it is used by more than Ta=25℃, it is reduced by 17.66mW/℃.
●Operating conditions (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Power supply voltage range 1
VCC1
0.625~1.98
V
VIN terminal voltage
Power supply voltage range 2
VCC2
1.7~5.5
V
VIO terminal
●Electrical characteristics (Unless otherwise specified: Ta=25℃, VIN=1.0V)
Rating
Parameter
Symbol
Min.
Typ.
Max.
Conditions
Unit
Conditions
MPPT control minimum voltage
MPPTL
-
-
0.7
V
VINMON-monitor
MPPT control maximum voltage
MPPTH
1.5
-
-
V
VINMON-monitor
MPPT-VIN control voltage resolution
PPTVT
12.5
25.0
37.5
mV
UVLO Release Threshold
VuvloR
0.6
0.7
0.8
V
VIN-rising
UVLO Detect Threshold
VuvloD
0.575
0.625
0.675
V
VIN-falling
Vuvlohys
30
80
130
mV
MPPT start up voltage
Vst1
2.45
2.6
2.75
V
Charging current completion voltage
Vch2
4.93
5.0
5.07
V
Circuit current 1 (VIN-CURRENT)
ICC1
-
-
1.0
mA
Circuit current 2 (OUTS-CURRENT)
ICC2
-
-
2
uA
ICC3
-
-
4
uA
UVLO Hysteresis
COREVDD-monitor
(hys=0.3V)
OUTS-monitor RISING.
(hysteresis=0.075V)
ENB=1V, SW=VIN
ENB=1V, OUTS,P=5.2V,
COREVDD=3.7V
ENB=0V, OUTS,P=5.2V
COREVDD=3.7V
Circuit current 3 (OUTS-CURRENT)
Not-Switching
Nch-SW ON registor
Rnsw
-
60
-
mΩ
Pch-SW ON registor
Rpsw
-
100
-
mΩ
Input over current limiter
DCDC switching frequency 1
(SEL=VIN)
DCDC switching frequency 2
(SEL=GND)
Charging current voltage range
VIlim
3.0
4.0.
5.0
A
Fosc1
260
320
380
kHz
OSC2OUT
Fosc2
130
160
190
kHz
OSC2OUT
VImon
0
40
mV
V(OUTPM)-V(OUTS)
Charging current monitor accuracy 1
Imon1
0D
2B
49
Hex
V(OUTPM)-V(OUTS)=0mV
Charging current monitor accuracy 2
Imon2
88
A6
BF
Hex
V(OUTPM)-V(OUTS)=40mV
Logic operating clock
Logosc
-
30
-
kHz
C4=100pF
ENB ”H” level voltage
Venh
1.1
-
-
V
POWER-OFF
ENB ”L” level voltage
Venl
0
-
0.2
V
POWER-ON
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Datasheet
BU1840AMUV
●Electrical characteristics (Unless otherwise specified: Ta=25℃, VIO=1.8V)
Item
Symbol
Min.
Typ.
Max.
Unit
L level input voltage
VIL1
-0.3
-
0.25 ×
VIO
V
H level input voltage
VIH1
-
VIO
+0.3
V
Hysteresis width
Vhys1
-
-
V
Conditions
2
【I C input (SDA, SCL)】
L level output voltage
(Sink current = 3mA)
Input current
0.75 ×
VIO
0.05 ×
VIO
VOL1
0
-
0.3
V
Iin1
-3
-
3
μA
SDA pin
Pin voltage=0~VIO
2
●I C BUS format
2
The writing/reading operation is based on the I C slave standard.
・Slave address
A7
1
A6
1
A5
1
A4
0
A3
0
・Bit Transfer
SCL transfers 1-bit data during H. SCL cannot change
signal of SDA during H at the time of bit transfer. If SDA
changes while SCL is H, START conditions or STOP
conditions will occur and it will be interpreted as a
control signal.
・START and STOP condition
When SDA and SCL are H, data is not transferred on
2
the I C- bus. This condition indicates, if SDA changes
from H to L while SCL has been H, it will become START
(S) conditions, and an access start, if SDA changes from
L to H while SCL has been H, it will become STOP (P)
conditions and an access end.
・Acknowledge
It transfers data 8 bits each after the
occurrence of START condition. A
transmitter opens SDA after transfer 8bits
data, and a receiver returns the
acknowledge signal by setting SDA to L.
A2
0
A1
1
R/W
1/0
SDA
SCL
SDA
SDA a state of stability:
It can change
Data are effective
SDA
SCL
S
P
STOP condition
START condition
DATA OUTPUT
BY TRANSMITTER
・Protocol
not acknowledge
DATA OUTPUT
BY RECEIVER
acknowledge
SCL
S
START condition
1
2
8
9
clock pulse for
acknowledgement
Legend
The mastering side is a transmitter.
The slave side is a receiver.
A Acknowledge
S Start condition
The slave side is a transmitter.
The mastering side is a receiver.
A Unacknowledged
P Stop condition
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TSZ02201-0Q1Q0AJ00130-1-2
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Datasheet
BU1840AMUV
1. Writing protocol
A register address is transferred by the next 1 byte that transferred the slave address and the write-in command. The
3rd byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register
address is carried out automatically. However, when a register address turns into the last address, it is set to 00h by
the next transmission. After the transmission end, the increment of the address is carried out.
*1
S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A D7 D6 D5 D4 D3 D2 D1 D0 A
slave address
register address
*1
D7 D6 D5 D4 D3 D2 D1 D0 A P
DATA
DATA
register address
increment
R/W=0(write)
register address
increment
A=acknowledge(SDA LOW)
A=not acknowledge(SDA HIGH)
S=START condition
P=STOP condition
*1: Write Timing
from master to slave
from slave to master
2. Reading protocol
It reads from the next byte after writing a slave address and R/W bit. The register to read considers as the following
address accessed at the end, and the data of the address that carried out the increment is read after it. If an address
turns into the last address, the next byte will read out 00h. After the transmission end, the increment of the address is
carried out.
S X X X X X X X
1 A D7 D6 D5 D4 D3 D2 D1 D0 A
slave address
D7 D6 D5 D4 D3 D2 D1 D0 A P
DATA
DATA
register address
increment
register address
increment
R/W=1(read)
A=acknowledge(SDA LOW)
A=not acknowledge(SDA HIGH)
S=START condition
P=STOP condition
from master to slave
from slave to master
3. Multiple reading protocols
After specifying an internal address, it reads by repeated START condition and changing the data transfer direction.
The data of the address that carried out the increment is read after it. If an address turns into the last address, the
next byte will read out 00h. After the transmission end, the increment of the address is carried out.
S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A Sr X X X X X X X 1 A
slave address
register address
slave address
R/W=0(write)
R/W=1(read)
D7 D6 D5 D4 D3 D2 D1 D0 A
D7D6 D5D4D3D2D1D0 A P
DATA
DATA
register address
increment
from master to slave
from slave to master
register address
increment
A=acknowledge(SDA LOW)
A=not acknowledge(SDA HIGH)
S=START condition
P=STOP condition
Sr=repeated START condition
※ As for reading protocol and multiple reading protocols, please do A(not acknowledge) after doing the final reading
operation. It stops with read when ending by A (acknowledge), and SDA stops in the state of Low when the reading
data of that time is 0. However, this state returns usually when SCL is moved, data is read, and A (not acknowledge) is
done.
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Datasheet
BU1840AMUV
●Electrical Characteristics(Unless otherwise specified, Ta=25 ℃, VIO=1.8V)
Item
Symbol
【I2C BUS format】
SCL clock frequency
fSCL
Standard-mode
Fast-mode
Typ.
Min.
Typ.
Max.
Min.
Typ.
Max.
-
100
-
0
1.3
-
400
-
kHz
LOW period of the SCL clock
tLOW
0
4.7
HIGH period of the SCL clock
tHIGH
4.0
-
-
0.6
-
-
μs
tHD;STA
4.0
-
-
0.6
-
-
μs
Set-up time for a repeated START condition
tSU;STA
4.7
-
-
0.6
-
-
μs
Data hold time
tHD;DAT
0
-
3.45
0
-
0.9
μs
Data set-up time
tSU;DAT
250
-
-
100
-
-
ns
Set-up time for STOP condition
tSU;STO
4.0
-
-
0.6
-
-
μs
tBUF
4.7
-
-
1.3
-
-
μs
Hold time for a repeated START condition
Bus free time between a STOP and START condition
μs
●Timing diagram
SDA
t BUF
t SU;DAT
t LOW
t HD;STA
SCL
t HD;STA
t SU;STO
t SU;STA
t HD;DAT
S
Sr
t HIGH
P
S
D0
INITIAL
●Register Map
Address
Symbol
Name
R/W
D7
D6
D5
D4
D3
D2
D1
00h
SFTRST
W
-
-
-
-
-
-
-
01h
ADCDATA
R
ADC
DATA7
ADC
DATA6
ADC
DATA5
ADC
DATA4
ADC
DATA3
ADC
DATA2
ADC
DATA1
SFT
RST
ADC
DATA0
Function
00h
00h
Please input "0" to "-".
In an empty address, there is a possibility of doing assign to the register for the test.
The access to a register for the test and an undefined register is prohibited.
The I2C control timing and the internal operation of IC timing become asynchronous relations when reading out data from the
outside.
I hope measures so as not to become a problem on the application as the agreement sequence is compare three times.
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Datasheet
BU1840AMUV
●Register Explanation
Address
00h
Symbol
Name
SFTRST
R/W
D7
D6
D5
D4
D3
D2
D1
D0
INITIAL
データ内容
W
-
-
-
-
-
-
-
SFT
RST
00h
ソフトウェア
リセット制御入力
Bit name
Bit
SFTRST
D0
Function
RST (All registers are initialized.)
0
1
Normal
Reset
After initializing this all registers when SFTRST: D0=1 is done in WRITE, the value of this register returns to an initial value, too.
Address
01h
Symbol
Name
ADCDATA
D7-D0:
R/W
R
D7
ADC
DATA7
D6
ADC
DATA6
D5
ADC
DATA5
D4
ADC
DATA4
D3
ADC
DATA3
D2
D1
D0
INITIAL
ADC
DATA2
ADC
DATA
1
ADC
DATA0
00h
データ内容
ADCDATA7-0
8bitADC data(Initial 00h)
Note)When not charging it (V18<1.6V & DET4OUT=HI <full charge>), doesn't return the acknowledge signal.
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Datasheet
BU1840AMUV
●Block diagram
VINMON
SDA SCL
VIN
VIO
SW1,2,3
I2C
OSC2OUT
DET3OUT
OSC2
DET3
(1.6V)
(160kHz, 320kHz)
DET1
0.7V
OSC1
V18REG
V18
DET2OUT
VIN
DET2
(2.6V)
500k
COREVDD
Current
limiter
SEL
VIN
OUTP1,2
SWP
OSC1OUT
SWN
500k
ENB
DCDC
Control
PGND1,2,3
+
+
DET4OUT
-
DET4
(5V)
OUTS
-
DACOUT
MMPT
Control
DAC
OSC3OUT
OSC3
AGND1,2
PCOMP
ADCOUT
ADC
OSC
Current
Sense
OUTPM
IMON
●Block Operation Characteristics
DET1:The voltage of VINMON is detected. (It has hysteresis characteristics.)
0.700V-DETECT
0.625V-RELEASE
DET2:The voltage of COREVDD (2.6V) is detected. (It has hysteresis characteristics.)
2.6V-DETECT
2.3V-RELEASE
DET3:The voltage of V18 is detected. (It has hysteresis characteristics.)
1.6V-DETECT
1.5V-RELEASE
DET4:The voltage of OUTS is detected. (It has hysteresis characteristics.)
5.0V-DETECT
4.925V-RELEASE
OSC1:It is an oscillator. It operates at the self-excitation boost.
OSC2:It is an oscillator. It operates at MPPT.
SEL= GND:frequency=160kHz
SEL= VIN :frequency=320kHz
OSC3:It is an oscillator. It uses it for the clock in the MPPT-CONTROL Block and the A/D Block.
DAC :It is D/A converter. A standard voltage of MPPT is output.
ADC :It is A/D converter. The analogue signal amplified in the Current-Sense block is converted into the digital signal.
Current-Sense:The OUTPM-OUTS voltage is amplified.
V18REG:Internal power supply V18 is generated from COREVDD.
Current-limiter:The current that flows from SW to PGND is detected.
I2C:It is I2C interface block. VIO is made a power supply.
MPPT-Control:To charge it by the solar battery maximum dissipation, it controls.
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Datasheet
BU1840AMUV
●Charging Current Sense Register (R1)
It is necessary to decide the constant of R1 in proportion to the maximum charge current.
Maximum charging current = “Maximum input power” × “Efficiency” ÷ “Voltage of battery”
Maximum
charging
current [mA]
R1 [mΩ]
Maximum
charging
current [mA]
R1 [mΩ]
60
560
350
100
80
470
400
100
100
390
480
82
120
330
580
68
150
220
700
56
200
180
820
47
250
150
1000
39
300
120
1200
33
●Charging Current Data
The current for each 1bit of the charge current data is decided by the following calculating formula
Charging current=(Charging current data[Hex]-2B[Hex]) × ”Charging current / 1bit”
R1 [mΩ]
Charging
current/1bit
[mA]
R1 [mΩ]
Charging
current/1bit
[mA]
33
9.685
150
2.131
39
8.195
180
1.776
47
6.800
220
1.453
56
5.707
270
1.184
68
4.700
330
0.9685
82
3.898
390
0.8195
100
3.196
470
0.6800
120
2.663
560
0.5707
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Datasheet
BU1840AMUV
●Operating Sequence
0.7V
0.7V
VIN
MPPT Calculation Voltage
MPPT Calculation Voltage
MPPT Voltage
0.7V
0.7V
MPPT Voltage
VIN MON
DET1OUT
(Inter-node)
OSC1OUT
(Inter-node)
DET2OUT
(Inter-node)
1.6V
V18
DET3OUT
(Inter-node)
OSC2OUT
(Inter-node)
MPPT Calculation Voltage
DACOUT
(Inter-node)
MPPT Calculation Voltage
MPPT Voltage
MPPT Voltage
ADCDATA
(I2C-Inter face)
Changing Current Monitor
Charging Current Monitor
DET4OUT
(Inter-node)
COREVDD
2.6V
5.0V
4.925V
OUTS
Operation Boost Stop
Self Boost
MPPT Operation
Boost Stop
MPPT Operation
Boost Stop
Note) When MPPT operating, it is calculated of MPP each 158mS. (Logosc=30kHz)
The amount of the MPP voltage change is 25mV step.
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Datasheet
BU1840AMUV
●Pin Layout
●Package Diagram
No.
PIN Name
Function
1
SCL
2
SDA
3
VINMON
4
IMON
5
OUTS
6
AGND1
Charging current
sense pin 1
GND pin
7
OUTP1
8
OUTP2
I2C Interface clock
input pin
I2C Interface data
input and output pin
VIN monitor pin
ESD Diode
GND side
High side
VIO
AGND
VIO
AGND
-
AGND
COREVDD
AGND
-
AGND
COREVDD
AGND
Output voltage pin
-
AGND
Output voltage pin
-
AGND
9
SW1
Inductor connect pin
-
-
10
SW2
Inductor connect pin
-
-
11
SW3
-
-
12
OUTPM
-
AGND
13
PGND1
Inductor connect pin
Charging current
sense pin 2
GND pin
COREVDD
AGND
14
PGND2
GND pin
COREVDD
AGND
GND pin
COREVDD
AGND
Internal power supply 1
COREVDD
AGND
V18
AGND
VIN
AGND
VIN
AGND
15
PGND3
16
COREVDD
17
V18
18
SEL
19
VIN
20
OSC
21
22
23
V18
AGND
PCOMP
Internal power supply 2
DCDC switching frequency
changing pin
SEL = GND :160kHz
SEL = VIN :320kHz
Solar battery input pin
Logic frequency adjustment
pin
Phase compensation pin
V18
AGND
AGND2
GND pin
V18
AGND
-
AGND
VIO
AGND
ENB
Chip enable pin
(ON:L、OFF:H)
VQFN024V4040VQ
Power supply pin
for interface
24
VIO
When I2C Interface is not used,
please connect VIO pin
to COREVDD pin.
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Datasheet
BU1840AMUV
●How to select parts of application
<For 2 Cells Solar>
R1
R2
R3
R7
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
L1
D1*
Value
※1
24kΩ
10Ω
100mΩ
200uF
0.47uF
0.1uF
100pF
22uF
2.2uF
100uF ※2
22nF
47nF
10uF
470uF ※2
4.7uH~10uH
SBD
Maker
TOKO
-
<For 4 Cells Solar>
Parts
D128C
-
R1
R2
R3
R4
R5
R6
R7
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
C11
L1
D1*
D2
Value
※1
24kΩ
10Ω
100kΩ
100kΩ
1kΩ
100mΩ
200uF
0.47uF
0.1uF
100pF
22uF
2.2uF
100uF ※2
22nF
47nF
10uF
470uF ※2
4.7uH~10uH
SBD
Zener Di
Maker
TOKO
RENESAS
Parts
D128C
HZ2A1
※1 Please set a optimal value for R1 depending on maximum charging current. For details, please see p.8 "Charge Current
Sense Register (R1)".
※2 Recommended capacitance value of output (OUTS pin) is equivalent to at least 570uF, it is the total of C7(ceramic
capacitors) and C11(aluminum electrolytic capacitors) or C7(ceramic capacitors) and C11(tantalum capacitors).
When select the ceramic capacitor, it takes some consideration of DC bias effect(s). (Recommended pressure capacity:over
10V) With sensitive application to output ripple voltage, taking measures to reduce ESR(Equivalent Series Resistance) such as
increasing of ceramic capacitor or parallel capacitor.
* On BU1840AMUV, output voltage (OUTS pin voltage) rise up to 5.07V; it is the highest value of the charge current
completion voltage. Please insert the charging control IC between BU1840AMUV output and secondary battery as necessary.
* When I2C interface is not in use, please connect VIO pin with COREVDD pin directly.
* In case of charging of the battery with low voltage (less than 3.0V), There is a probability of the emergence of the pattern
periodically repeating MPPT active/non-active mode and it will cause noise. Please insert SBD between SW pin and COREVDD
pin to reduce such noise as necessary.
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Datasheet
BU1840AMUV
PGND3
PGND2
PGND1
IMON
OUTS
AGND1
COREVDD
V18
SDA
VINMON
SEL
SCL
Low or High
●Notes of board layout
BU1840AMUV is switching DCDC converter, so characteristics of noise and etc changing by board layout. Please note the
following respect besides a general board layout matter when you make PCB.
●About heat loss
In the heat design, please operate it in the following condition.
(Please consider the margin etc. because the following temperature is a guarantee temperature.)
1. Surrounding temperature Ta must be 85℃ or less.
2. Loss of IC must be permissible loss Pd or less.
2.0
1.0
1.8
0.9
1.6
0.8
Power Dissipation : Pd (W)
Power Dissipation : Pd (W)
The allowable dissipation (Pd) characteristics are described below.
1.4
1.2
1.0
0.8
0.7
0.6
0.5
0.4
0.6
0.3
0.4
0.2
0.2
0.1
0.0
0.0
0
25
50
75
100
125
Temperature (℃)
25
50
75
100
125
Temperature (℃)
4layer(74.2×74.2mm)boad
(1,4layer heat radiation copper foil:6.28mm2)
(2,3layer heat radiation copper foil:5500mm2)
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TSZ22111・15・001
0
1layer(74.2×74.2mm)boad
(Surface heat radiation copper foil:6.28mm2)
12/14
TSZ02201-0Q1Q0AJ00130-1-2
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Datasheet
BU1840AMUV
●Caution on use
(1)Absolute Maximum Ratings
An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2)The power supply and the GND lines
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Please take
care about interference by common impedance of the wiring pattern when there are two or more power supply and
GND line. For the GND line, please note the separation of the large current route and the small signal route including
the external circuit.Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the
GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of
the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus
determining the constant.
(3)GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
(4)Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break
down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal
and the power supply or the GND terminal, the ICs can break down.
(5)Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6)Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic
element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal.
Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than
the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when
no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals
a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(7)External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8)Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use. Moreover, please use it within the range where output Tr doesn't exceed the rated voltage and ASO.
(9)Rush current
In CMOS IC, when the power supply is turned on rush current might flow momentarily in logical internal irregular state.
Therefore, note drawing the capacity of the power supply coupling, the power supply, and width and drawing the GND
pattern wiring, please.
(10)Test terminal and unused terminal processing
Please process a test terminal and unused terminal according to explanations of the function manual and the application
note, etc. to be unquestionable while real used. Moreover, please inquire of the person in charge of our company about
the terminal without the explanation especially.
(11)Content of material
The application notes etc. are the design material to design the application, and no one of the content securing it. Please decide
the application after it examines enough and it evaluates it including external parts.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
13/14
TSZ02201-0Q1Q0AJ00130-1-2
2.AUG.2012 Rev.001
Datasheet
BU1840AMUV
●Ordering part number
B
U
1
8
4
0
A
Part No.
M
U
V
-
E
2
Package
Wrapping、Forming specification
MUV : VQFN024V4040
E2: Reel emboss taping
●Physical Dimension Tape and Reel Information
VQFN024V4040
<Tape and Reel information>
4.0±0.1
4.0±0.1
1.0MAX
2.4±0.1
0.4±0.1
7
12
19
18
0.5
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
6
24
0.75
E2
2.4±0.1
1
2500pcs
(0.22)
+0.03
0.02 -0.02
S
C0.2
Embossed carrier tape
Quantity
Direction
of feed
1PIN MARK
0.08 S
Tape
13
+0.05
0.25 -0.04
1pin
(Unit : mm)
Reel
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking Diagram(s)
VQFN024V4040 (TOP VIEW)
Part Number Marking
1 8 4 0 A
LOT Number
1PIN MARK
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TSZ22111・15・001
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.