05-08-1763

UK Package
44-Lead Plastic QFN (7mm × 7mm)
(Reference LTC DWG # 05-08-1763 Rev Ø)
0.70 ±0.05
5.15 ± 0.05
5.00 REF
6.10 ±0.05 7.50 ±0.05
(4 SIDES)
5.15 ± 0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
7.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
R = 0.10
TYP
R = 0.125
TYP
43 44
0.40 ± 0.10
PIN 1 TOP MARK
(SEE NOTE 6)
1
PIN 1
CHAMFER
C = 0.35
5.00 REF
(4-SIDES)
2
5.15 ± 0.10
5.15 ± 0.10
(UK44) QFN 1007 REV Ø
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE.
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD