BR24G64-3A Datasheet High Reliability Serial EEPROMs I2C BUS BR24xxxxfamily BR24G64-3A ●Packages W(Typ.) x D(Typ.)x H(Max.) ●General Description 2 BR24G64-3A is a serial EEPROM of I C BUS interface method ●Features All controls available by 2 ports of serial clock(SCL) and serial data(SDA) Other devices than EEPROM can be connected to the same port, saving microcontroller port 1.7V to 5.5V single power source action most suitable for battery use 1.7V to 5.5Vwide limit of action voltage, possible 1MHz action Page write mode useful for initial value write at factory shipment Auto erase and auto end function at data rewrite Low current consumption Write mistake prevention function ¾ Write (write protect) function added ¾ Write mistake prevention function at low voltage Data rewrite up to 1,000,000 times Data kept for 40 years Noise filter built in SCL / SDA terminal Shipment data all address FFh DIP-T8 TSSOP-B8 9.30mm x 6.50mm x 7.10mm 3.00mm x 6.40mm x 1.20mm TSSOP-B8J SOP8 3.00mm x 4.90mm x 1.10mm 5.00mm x 6.20mm x 1.71mm SOP-J8 MSOP8 4.90mm x 6.00mm x 1.65mm 2.90mm x 4.00mm x 0.90mm SSOP-B8 VSON008X2030 3.00mm x 6.40mm x 1.35mm 2.00mm x 3.00mm x 0.60mm Fig.1 ●Page write Number of Pages 32Byte Product number BR24G64-3A ●BR24G64-3A Bit Capacity format 64Kbit 8K×8 Type Power source Voltage DIP-T8*1 SOP8 SOP-J8 BR24G64-3A 1.7 to 5.5V ● ● ● SSOP-B8 TSSOP-B8 TSSOP-B8J MSOP8 ● ● ● VSON008 X2030 ● ● *1 DIP-T8 is not halogen free package ○Product structure:Silicon monolithic integrated circuit .www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Ratings Unit VCC -0.3 to +6.5 V Impressed voltage Permissible dissipation Storage temperature range Action temperature range When using at Ta=25℃ or higher 4.5mW to be reduced per 1℃. When using at Ta=25℃ or higher 4.5mW to be reduced per 1℃. 300 (SSOP-B8) When using at Ta=25℃ or higher 3.0mW to be reduced per 1℃. When using at Ta=25℃ or higher 3.3mW to be reduced per 1℃. mW 310 (TSSOP-B8J) When using at Ta=25℃ or higher 3.1mW to be reduced per 1℃. 310 (MSOP8) When using at Ta=25℃ or higher 3.1mW to be reduced per 1℃. 300 (VSON008X2030) When using at Ta=25℃ or higher 3.0mW to be reduced per 1℃. 800 (DIP-T8) When using at Ta=25℃ or higher 8.0mW to be reduced per 1℃. Tstg -65 to +150 ℃ Topr -40 to +85 ℃ ‐ -0.3 to Vcc+1.0 V The Max value of Terminal Voltage is not over 6.5V. When the pulse width is 50ns or less, the Min value of Terminal Voltage is not under -1.0V. Tjmax 150 ℃ Junction temperature at the storage condition Terminal voltage Junction temperature 450 (SOP8) 450 (SOP-J8) 330 (TSSOP-B8) Pd Remarks ●Memory Cell Characteristics (Ta=25℃, Vcc=1.7V to 5.5V) Limits Parameter Min. Typ. 1,000,000 - Number of data rewrite times *1 40 - Data hold years *1 Max - - Unit Times Years *1Not 100% TESTED ●Recommended Operating Ratings Parameter Symbol Power source voltage Vcc Input voltage VIN ●Electrical Characteristics Parameter “H” input voltage 1 “L” input voltage 1 “L” output voltage 1 “L” output voltage 2 Input leak current Output leak current Current consumption at action Standby current Ratings 1.7 to 5.5 0 to Vcc Unit V (Unless otherwise specified, Ta=-40 to +85℃, Vcc =1.7 to 5.5V) Limits Symbol Unit Min. Typ. Max. VIH1 - Vcc+1.0 V - 0.3Vcc V - - 0.4 V IOL=3.0mA, 2.5V≦Vcc≦5.5V (SDA) VOL2 - - 0.2 V IOL=0.7mA, 1.7V≦Vcc<2.5V (SDA) ILI -1 - 1 μA VIN=0 to Vcc ILO -1 - 1 μA VIL1 VOL1 0.7Vcc Conditions -0.3*1 ICC1 - - 2.5 ICC2 - - 2.0 ISB - - 2.0 mA μA VOUT=0 to Vcc (SDA) Vcc=5.5V,fSCL=1MHz, tWR=5ms, Byte write, Page write Vcc=5.5V,fSCL=1MHz Random read, current read, sequential read Vcc=5.5V, SDA, SCL=Vcc A0, A1, A2=GND,WP=GND *1 When the pulse width is 50ns or less, it is -1.0V. www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Action Timing Characteristics (Unless otherwise specified, Ta=-40 to +85℃, VCC=1.7V to 5.5V) Limits Parameter Symbol Min. Typ. Max. Unit Clock Frequency fSCL - - 1000 kHz Data Clock “HIGH“ Period tHIGH 0.30 - - µs Data Clock “LOW“ Period tLOW 0.5 - - µs tR - - 0.12 µs SDA, SCL (INPUT) Rise Time *1 SDA, SCL (INPUT) Fall Time *1 tF1 - - 0.12 µs SDA (OUTPUT) Fall Time *1 tF2 - - 0.12 µs tHD:STA 0.25 - - µs Start Condition Setup Time tSU:STA 0.25 - - µs Input Data Hold Time tHD:DAT 0 - - ns Input Data Setup Time Start Condition Hold Time tSU:DAT 50 - - ns Output Data Delay Time tPD 0.05 - 0.45 µs Output Data Dold Time tDH 0.05 - - µs Stop Condition Setup Time tSU:STO 0.25 - - µs Bus Free Time tBUF 0.5 - - µs Write Cycle Time tWR - - 5 ms tI - - 0.05 µs tHD:WP 1.0 - - µs WP Setup Time tSU:WP 0.1 - - µs WP High Period tHIGH:WP 1.0 - - µs Noise Spike Width (SDA, SCL) WP Hold Time *1 Not 100% tested ●Action Timing Characteristics Condition Parameter Symbol Condition Unit CL 100 pF SDA, SCL (INPUT) Rise Time tR 20 ns SDA, SCL (INPUT) Fall Time tF1 20 ns VIL1/VIH1 0.2Vcc/0.8Vcc V - 0.3Vcc/0.7Vcc V Load Capacitance Input Data Level Input/Output Data Timing Reference Level www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Sync data input / output timing tR SCL tF1 70% 70% 70% 70% 30% 30% tHD:DAT tSU:DAT 70% 70% 30% 30% tLOW tHD:STA 70% tHIGH 70% 70% 30% 30% SDA (入力) (INPUT) tDH tPD tBUF 70% 70% SDA 30% (出力) (OUTPUT) 30% 30% ○Input read at the rise edge of SCL ○Data output in sync with the fall of SCL tF2 Fig.2-(a) Sync data input / output timing 70% 70% 70% tSU:STA tHD:STA tSU:STO 70% 30% 30% STOP CONDITION START CONDITION Fig.2-(b) Start-stop bit timing D0 70% 70% ACK tWR write data (n-th address) STOP CONDITION START CONDITION Fig.2-(c) Write cycle timing 70% DATA(n) DATA(1) D0 D1 70% ACK ACK tWR 30% 30% tSU:WP tHD:WP STOP CONDITION Fig.2-(d) WP timing at write execution DATA(n) DATA(1) D1 D0 ACK ACK tWR tHIGH:WP 70% 70% 70% Fig.2-(e) WP timing at write cancel www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Block Diagram 1 A0 64Kbit EEPROM array 8 Vcc 7 WP 6 SCL 5 SDA 8bit 2 A1 Address decoder Word address register 13bit START A2 3 Data register STOP Control circuit ACK GND 4 Power source voltage detection High voltage generating circuit Fig.3 Block diagram ●Pin Configuration A0 1 8 Vcc A1 2 7 A2 3 6 SCL GND 4 5 SDA 1 1 1 BR24G64-3A 1 1 WP 1 1 1 ●Pin Description Function Terminal Name Input/ Output A0 Input Slave address setting A1 Input Slave address setting A2 Input Slave address setting GND - Reference voltage of all input / output, 0V SDA Input/ output Serial data input serial data output SCL Input Serial clock input WP Input Write protect terminal Vcc - Connect the power source. BR24G64-3A www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Typical Performance Curves 6 6 5 Ta=-40 ℃ Ta= 25 ℃ Ta= 85 ℃ 4 L INPUT VOLTAGE: VIL1(V) H INPUT VOLTAGE: V IH1 (V) 5 3 SPEC 2 3 2 1 1 0 0 0 1 2 3 4 5 Ta=-40℃ Ta= 25 ℃ Ta= 85 ℃ 4 SPEC 0 6 1 SUPPLY VOLTAGE: Vcc(v) 4 5 6 1 1 0.8 OL1(V) Ta=-40 ℃ Ta= 25 ℃ Ta= 85 ℃ L OUTPUT VOLTAGE: V OL2 (V) 3 Fig.5 'L' input voltage VIL1 (A0,A1,A2,SCL,SDA,WP) Fig.4 'H' input voltage VIH1 (A0,A1,A2,SCL,SDA,WP) L OUTPUT VOLTAGE: V 2 SUPPLY VOLTAGE: Vcc(v) 0.6 SPEC 0.4 0.2 0 Ta=-40 ℃ Ta= 25 ℃ Ta= 85 ℃ 0.8 0.6 0.4 SPEC 0.2 0 0 1 2 3 4 5 0 6 2 3 4 5 6 L OUTPUT CURRENT: IOL(m A) L OUTPUT CURRENT: IOL(mA) Fig.7 'L' output voltage VOL2(Vcc=1.7V) Fig. 6 'L' output voltage VOL1(Vcc=2.5V) www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 6/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Typical Performance Curves‐Continued 1.2 SPEC 1 OUTPUT LEAK CURRENT: ILO(µA) INPUT LEAK CURRENT: I LI (µA) 1.2 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.8 0.6 0.4 0.2 SPEC 1 0.8 Ta=-40 ℃ Ta= 25℃ Ta= 85℃ 0.6 0.4 0.2 0 0 0 1 2 3 4 5 0 6 1 4 Fig.9 Output leak current (A0,A1,A2,SCL,WP) 5 6 ILO(SDA) 2.5 3 SPEC SPEC CURRENT CONSUMPTION AT READING: Icc2(mA) 2.5 CURRENT CONSUMPTION AT WRITING: Icc1(mA) 3 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig.8 Input leak current ILI 2 2 1.5 Ta=-40℃ Ta= 25 ℃ Ta= 85 ℃ 1 0.5 0 2 Ta=-40℃ Ta= 25℃ Ta= 85℃ 1.5 1 0.5 0 0 1 2 3 4 5 6 0 SUPPLY VOLTAGE: Vcc(v) 2 3 4 5 6 SUPPLY VOLTAGE: Vcc(v) Fig.11 Current consumption at READ operation ICC2 (fscl=1MHz) Fig.10 Current consumption at WRITE operation Icc1 www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 7/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Typical Performance Curves‐Continued 10000 SPEC 2 SCL FREQUENCY: fscl(kHz) STANDBY CURRENT: I SB (µA) 2.5 Ta=-40℃ Ta= 25℃ Ta= 85℃ 1.5 1 0.5 0 1000 SPEC 100 Ta=-40℃ Ta= 25℃ Ta= 85℃ 10 1 0.1 0 1 2 3 4 5 6 0 1 2 3 4 5 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig.12 Standby operation ISB Fig.13 Clock Frequency fSCL 0.4 6 0.6 LOW (µs) SPEC 0.3 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.2 DATA CLK L TIME : t DATA CLK H TIME : t HIGH (µs) SPEC 0.1 0 0.5 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.4 0.3 0.2 0.1 0 0 1 2 3 4 5 6 0 1 2 3 4 5 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig.14 Data Clock High Period tHIGH Fig.15 Data Clock Low Period tLOW www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/34 6 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Typical Performance Curves‐Continued HD :STA (µs) SPEC 0.12 START CONDITION HOLD TIME: t SDA (OUTPUT) FALL TIME: t F2 (µs) 0.14 0.1 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.08 0.06 0.04 0.02 0 0 1 2 3 4 5 SUPPLY VOLTAGE: Vcc(v) 0.3 SPEC 0.25 0.2 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.15 0.1 0.05 0 6 0 2 3 4 5 SUPPLY VOLTAGE: Vcc(v) Fig.17 Fig.16 SDA (OUTPUT) Fall Time tF2 6 Start Condition Hold Time tHD : STA 50 (ns) 0.3 SPEC HD :D AT 0.25 0.2 INPUT DATA HOLD TIME: t START CONDITION SET UP TIME: tSU:STA(µs) 1 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.15 0.1 0.05 SPEC 0 -50 Ta=-40℃ Ta= 25℃ Ta= 85℃ -100 -150 0 0 1 2 3 4 5 0 6 2 3 4 5 6 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig.19 Input Data Hold Time tHD : DAT(HIGH) Fig.18 Start Condition Setup Time tSU : STA www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 9/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Typical Performance Curves‐Continued 60 SU:DAT (ns) SPEC 0 INPUT DATA SET UP TIME: t INPUT DATA HOLD TIME: t HD:D AT (ns) 50 -50 Ta=-40℃ Ta= 25℃ Ta= 85℃ -100 -150 0 1 2 3 4 5 SPEC 50 Ta=-40℃ Ta= 25℃ Ta= 85℃ 40 30 20 10 0 0 6 1 2 3 4 5 6 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig.20 Input Data Hold Time tHD : DAT(LOW) Fig.21 Input Data Setup Time tSU : DAT(HIGH) 0.5 60 SPEC OUTPUT DATA DELAY TIME: PD t (µs) INPUT DATA SET UP TIME: t SU:DAT (ns) SPEC 50 40 Ta=-40℃ Ta= 25℃ Ta= 85℃ 30 20 10 0.4 0.3 0.2 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.1 SPEC 0 0 0 1 2 3 4 5 0 6 1 2 3 4 5 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig.22 Input Data Setup Time tSU : DAT(LOW) Fig.23 Output Data Delay Time tPD0 www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/34 6 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Typical Performance Curves‐Continued 0.3 SPEC STOP CONDITION SET UP TIME: tSU:STO(µs) OUTPUT DATA DELAY TIME: PD t (µs) 0.5 0.4 0.3 0.2 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.1 SPEC SPEC 0.25 0.2 0.15 0.1 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.05 0 0 0 1 2 3 4 5 6 0 1 SUPPLY VOLTAGE: Vcc(v) 3 4 5 6 SUPPLY VOLTAGE: Vcc(v) Fig.25 Stop Condition Setup Time tsu:sto Fig.24 Output Data Delay Time tPD1 6 0.6 SPEC 0.5 0.4 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.3 0.2 4 3 2 0.1 1 0 0 0 1 2 3 SPEC 5 INTERNAL WRITING CYCLE TIME: tWR (ms) BUS OPEN TIME BEFORE TRANSMISSION : tBUF(µs) 2 4 5 0 6 1 2 3 4 5 6 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig.27 Write Cycle Time tWR Fig.26 BUS Free Time t BUF www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Ta=-40℃ Ta= 25℃ Ta= 85℃ 11/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Typical Performance Curves‐Continued 0.3 NOISE REDUCTION EFECTIVE TIME: tI(SCL L)(µs) NOISE REDUCTION EFECTIVE TIME: tI(SCL H)(µs) 0.3 0.25 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.2 0.15 0.1 0.05 SPEC 0.25 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.2 0.15 0.1 0.05 SPEC 0 0 0 1 2 3 4 5 0 6 0.3 0.3 0.25 0.25 NOISE REDUCTION EFECTIVE TIME: t I(SDA L)(µs) NOISE REDUCTION EFECTIVE TIME: tI(SDA H)(µs) 3 4 5 6 Fig. 29 Noise Spike Width tl (SCL L) Fig. 28 Noise Spike Width tl (SCL H) Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.15 0.1 0.05 2 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) 0.2 1 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.2 0.15 0.1 0.05 SPEC SPEC 0 0 0 1 2 3 4 5 0 6 2 3 4 5 6 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig. 30 Noise Spike Width tl (SDA H) www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 Fig. 31 Noise Spike Width tl (SDA L) 12/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Typical Performance Curves‐Continued 1.2 0.2 WP DATA SET UP TIME: tSU:WP(µs) WP DATA HOLD TIME: t HD :W P (µs) SPEC 1 0.8 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.6 0.4 0.2 SPEC 0.1 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0 -0.1 -0.2 -0.3 0 0 1 2 3 4 5 0 6 1 2 3 4 SUPPLY VOLTAGE: Vcc(v) SUPPLY VOLTAGE: Vcc(v) Fig. 32 WP Hold Time tHD :WP Fig. 33 WP Setup Time tSU: WP 5 6 1.2 WP EFECTIVE TIME: t HIGH:W P ( µs) SPEC 1 0.8 Ta=-40℃ Ta= 25℃ Ta= 85℃ 0.6 0.4 0.2 0 0 1 2 3 4 5 6 SUPPLY VOLTAGE: Vcc(v) Fig. 34 WP High Time t HIGH : WP www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●I2C BUS communication ○I2C BUS data communication I2C BUS data communication starts by start condition input, and ends by stop condition input. Data is always 8bit long, and 2 acknowledge is always required after each byte. I C BUS carries out data transmission with plural devices connected by 2 communication lines of serial data (SDA) and serial clock (SCL). Among devices, there are “master” that generates clock and control communication start and end, and “slave” that is controlled by address peculiar to devices. EEPROM becomes “slave”. And the device that outputs data to bus during data communication is called “transmitter”, and the device that receives data is called “receiver”. SDA SCL 1-7 S START ADDRESS condition 8 9 R/W ACK 1-7 8 1-7 9 DATA ACK 8 DATA 9 ACK Fig.35 Data transfer timing P STOP condition ○Start condition (Start bit recognition) ・Before executing each command, start condition (start bit) where SDA goes from 'HIGH' down to 'LOW' when SCL is 'HIGH' is necessary. ・This IC always detects whether SDA and SCL are in start condition (start bit) or not, therefore, unless this confdition is satisfied, any command is executed. ○Stop condition (stop bit recongnition) ・Each command can be ended by SDA rising from 'LOW' to 'HIGH' when stop condition (stop bit), namely, SCL is 'HIGH' ○Acknowledge (ACK) signal ・This acknowledge (ACK) signal is a software rule to show whether data transfer has been made normally or not. In master and slave, the device (μ-COM at slave address input of write command, read command, and this IC at data output of read command) at the transmitter (sending) side releases the bus after output of 8bit data. ・The device (this IC at slave address input of write command, read command, and μ-COM at data output of read command) at the receiver (receiving) side sets SDA 'LOW' during 9 clock cycles, and outputs acknowledge signal (ACK signal) showing that it has received the 8bit data. ・This IC, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ACK signal) 'LOW'. ・Each write action outputs acknowledge signal (ACK signal) 'LOW', at receiving 8bit data (word address and write data). ・Each read action outputs 8bit data (read data), and detects acknowledge signal (ACK signal) 'LOW'. When acknowledge signal (ACK signal) is detected, and stop condition is not sent from the master (μ-COM) side, this IC continues data output. When acknowledge signal (ACK signal) is not detected, this IC stops data transfer, and recognizes stop cindition (stop bit), and ends read action. And this IC gets in status. ○Device addressing ・Output slave address after start condition from master. ・The significant 4 bits of slave address are used for recognizing a device type. The device code of this IC is fixed to '1010'. ・Next slave addresses (A2 A1 A0 --- device address) are for selecting devices, and plural ones can be used on a same bus according to the number of device addresses. ・ The most insignificant bit (R/W --- READ / WRITE) of slave address is used for designating write or read action, and is as shown below. Setting R / Setting R / ―― W W ―― to 0 ------- write (setting 0 to word address setting of random read) to 1 ------- read Type BR24G64-3A www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Maximum number of Connected buses Slave address 1 0 1 0 A2 A1 A0 14/34 ―― R/W 8 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Write Command ○Write cycle ・Arbitrary data is written to EEPROM. When to write only 1 byte, byte write is normally used, and when to write continuous data of 2 bytes or more, simultaneous write is possible by page write cycle. The maximum number of write bytes is specified per device of each capacity. Up to 32 arbitrary bytes can be written. S T A R T SDA LINE W R I T E SLAVE ADDRESS 1st WORD ADDRESS 2nd WORD ADDRESS DATA WAWAWA WAWA 15 14 13 12 11 1 0 1 0 A2 A1 A0 R A / C W K *1 S T O P WA 0 A C K *1 WA13 to WA15 become don't care. D0 D7 A C K A C K Fig.36 Byte write cycle S T A R T SDA LINE SLAVE ADDRESS 1 0 1 0 0 0 W R I T E 1st WORD ADDRESS(n) 2nd WORD ADDRESS(n) WA WA WA WA WA A2 A1 A0 15 R A / C W K *1 D7 0 14 13 12 11 A C K DATA(n+31) DATA(n) WA D0 A C K S T O P *1 WA13 to WA15 become don't care. D0 A C K A C K Fig.37 Page write cycle ・During internal write execution, all input commands are ignored, therefore ACK is not sent back. ・Data is written to the address designated by word address (n-th address) ・By issuing stop bit after 8bit data input, write to memory cell inside starts. ・When internal write is started, command is not accepted for tWR (5ms at maximum). ・By page write cycle, the following can be written in bulk : Up to 32Byte And when data of the maximum bytes or higher is sent, data from the first byte is overwritten. (Refer to "Internal address increment" of "Notes on page write cycle" in P16.) ・As for page write cycle of BR24G64-3A, after the significant 8 bits of word address is designated arbitrarily, by continuing data input of 2 bytes or more, the address of insignificant 5 bits is incremented internally, and data up to 32 bytes can be written. www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ○Notes on write cycle continuous input List of numbers of page write Number of 32Byte Pages Product BR24G64-3A number The above numbers are maximum bytes for respective types. Any bytes below these can be written. In the case BR24G64-3A, 1 page=32bytes, but the page write cycle time is 5ms at maximum for 32byte bulk write. It does not stand 5ms at maximum × 32byte=160ms(Max.) ○Internal address increment Page write mode 1Eh 0 0 0 WA7 WA6 WA5 WA4 WA3 WA2 WA1 WA0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0 0 1 1 0 1 1 0 1 1 0 1 1 0 0 1 0 Increment For example, when it is started from address 1Eh, therefore, increment is made as below, 1Eh→1Fh→00h→01h・・・ which please note. ※1Eh・・・1E in hexadecimal, therefore, 00011110 becomes a Significant bit is fixed. No digit up binary number. ○Write protect (WP) terminal ・Write protect (WP) function When WP terminal is set Vcc (H level), data rewrite of all addresses is prohibited. When it is set GND (L level), data rewrite of all address is enabled. Be sure to connect this terminal to Vcc or GND, or control it to H level or L level. Do not use it open. In the case of use it as an ROM, it is recommended to connect it to pull up or Vcc. At extremely low voltage at power ON / OFF, by setting the WP terminal 'H', mistake write can be prevented. www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Read Command ○Read cycle Data of EEPROM is read. In read cycle, there are random read cycle and current read cycle. Random read cycle is a command to read data by designating address, and is used generally. Current read cycle is a command to read data of internal address register without designating address, and is used when to verify just after write cycle. In both the read cycles, sequential read cycle is available, and the next address data can be read in succession. S T A R T SDA LINE SLAVE ADDRESS W R I T E R A / C W K A C K *1 R E A D SLAVE ADDRESS S T O P DATA(n) *1 WA13 to WA15 become don’t care. WA 0 WAWA WAWAWA 15 14 13 12 11 1 0 1 0 A2A1A0 S T A R T 2nd WORD ADDRESS(n) 1st WORD ADDRESS(n) 1 0 1 0 A2 A1A0 A C K D7 D0 R A / C W K A C K Fig.38 Random read cycle S T A R T SDA L IN E R E A D S LA V E ADDRESS S T O P D A TA (n ) 1 0 1 0 A 2 A 1A 0 D7 D0 A C K R A / C W K Fig.39 Current read cycle S T A R T SDA LINE SLAVE ADDRESS R E A D 1 0 1 0 A2 A1A0 DATA(n+x) DATA(n) D7 R A / C W K S T O P D0 D7 A C K A C K D0 A C K Fig.40 Sequential read cycle (in the case of current read cycle) ・In random read cycle, data of designated word address can be read. ・When the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n)-th address, i.e., data of the (n+1)-th address is output. ・When ACK signal 'LOW' after D0 is detected, and stop condition is not sent from master (μ-COM) side, the next address data can be read in succession. ・Read cycle is ended by stop condition where 'H' is input to ACK signal after D0 and SDA signal is started at SCL signal 'H' . ・When 'H' is not input to ACK signal after D0, sequential read gets in, and the next data is output. Therefore, read command cycle cannot be ended. When to end read command cycle, be sure input stop condition to input 'H' to ACK signal after D0, and to start SDA at SCL signal 'H'. ・Sequential read is ended by stop condition where 'H' is input to ACK signal after arbitrary D0 and SDA is started at SCL signal 'H'. www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Software reset Software reset is executed when to avoid malfunction after power on, and to reset during command input. Software reset has several kinds, and 3 kinds of them are shown in the figure below. (Refer to Fig.41-(a), Fig.41-(b), Fig.41-(c).) In dummy clock input area, release the SDA bus ('H' by pull up). In dummy clock area, ACK output and read data '0' (both 'L' level) may be output from EEPROM, therefore, if 'H' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure of system power source or influence upon devices. Dummy clock×14 SCL 1 2 Start×2 13 Normal command 14 SDA Normal command Fig.41-(a) The case of dummy clock × 14 +START+START+ command input SCL Start Dummy clock×9 Start 1 2 8 Normal command 9 SDA Normal command Fig.41-(b) The case of START + dummy clock × 9 +START+ command input Start×9 SCL 1 2 3 7 8 Normal command 9 SDA Normal command SD Fig.41-(c) START×9+ command input タ ト ※Start command from START input. ●Acknowledge polling During internal write execution, all input commands are ignored, therefore ACK is not sent back. During internal automatic write execution after write cycle input, next command (slave address) is sent, and if the first ACK signal sends back 'L', then it means end of write action, while if it sends back 'H', it means now in writing. By use of acknowledge polling, next command can be executed without waiting for tWR = 5ms. When to write continuously, R/W = 0, when to carry out current read cycle after write, slave address R/W = 1 is sent, and if ACK signal sends back 'L', then execute word address input and data output and so forth. During internal write, ACK = HIGH is sent back. First write command S T A R T Write command S T O P S T Slave A R address T A C K H tWR S T Slave A R address T A C K H … Second write command … S T Slave A R address T tWR A C K H S T Slave A R address T A C K L Word address A C K L Data A C K L S T O P After completion of internal write, ACK=LOW is sent back, so input next word address and data in succession. Fig.42 Case to continuously write by acknowledge polling www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●WP valid timing (write cancel) WP is usually fixed to 'H' or 'L', but when WP is used to cancel write cycle and so forth, pay attention to the following WP valid timing. During write cycle execution, in cancel valid area, by setting WP='H', write cycle can be cancelled. In both byte write cycle and page write cycle, the area from the first start condition of command to the rise of clock to taken in D0 of data(in page write cycle, the first byte data) is cancel invalid area. WP input in this area becomes don't care. The area from the rise of SCL to take in D0 to input the stop condition is cancel valid area. And, after execution of forced end by WP, standby status gets in. ・Rise of SDA ・Rise of D0 taken clock SCL SDA SCL D1 D0 ACK SDA S T Slave A R address T A C Word K address L ACK Enlarged view Enlarged view SDA D0 A C D7 D6 D5 D4 D3 D2 D1 D0 K L WP cancel invalid area A C K L Data A C K L S T O P WP cancel valid area tWR WP cancel invalid area WP Data is not written. Fig.43 WP valid timing ●Command cancel by start condition and stop condition During command input, by continuously inputting start condition and stop condition, command can be cancelled. (Fig.44) However, in ACK output area and during data read, SDA bus may output 'L', and in this case, start condition and stop condition cannot be input, so reset is not available. Therefore, execute software reset. And when command is cancelled by start, stop condition, during random read cycle, sequential read cycle, or current read cycle, internal setting address is not determined, therefore, it is not possible to carry out current read cycle in succession. When to carry out read cycle in succession, carry out random read cycle. SCL SDA 1 0 1 0 Start condition Stop condition Fig.44 Case of cancel by start, stop condition during slave address input www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●I/O peripheral circuit ○Pull up resistance of SDA terminal SDA is NMOS open drain, so requires pull up resistance. As for this resistance value (RPU), select an appropriate value to this resistance value from microcontroller VIL, IL, and VOL-IOL characteristics of this IC. If RPU is large, action frequency is limited. The smaller the RPU, the larger the consumption current at action. ○Maximum value of RPU The maximum value of RPU is determined by the following factors. ①SDA rise time to be determined by the capacitance (CBUS) of bus line of RPU and SDA should be tR or below. And AC timing should be satisfied even when SDA rise time is late. ②The bus electric potential A to be determined by input leak total (IL) of device connected to bus at output of 'H' to SDA bus and RPU should sufficiently secure the input 'H' level (VIH) of microcontroller and EEPROM including recommended noise margin 0.2Vcc. VCC-ILRPU-0.2 VCC ≧ VIH 0.8VCC-VIH IL IL=10μA VIH=0.7 VCC Microcontroller RPU ≦ ∴ Ex.) VCC =3V from② RPU ≦ EEPROM RPU SDA terminal A 0.8×3-0.7×3 -6 10×10 IL IL Bus line capacity ≦ 30 [kΩ] ○ Minimum value of RPU CBUS The minimum value of RPU is determined by the following factors. Fig.45 I/O circuit diagram When IC outputs LOW, it should be satisfied that VOLMAX=0.4V and IOLMAX=3mA. VCC-VOL ≦ IOL RPU ∴ RPU ≧ VCC-VOL IOL ②VOLMAX=0.4V should secure the input 'L' level (VIL) of microcontroller and EEPROM including recommended noise margin 0.1Vcc. VOLMAX ≦ VIL-0.1 VCC Ex.) VCC =3V, VOL=0.4V, IOL=3mA, microcontroller, EEPROM VIL=0.3Vcc from① RPU ≧ 3-0.4 3×10 -3 ≧ 867 [Ω] And VOL=0.4[V] VIL=0.3×3 =0.9[V] Therefore, the condition ② is satisfied. ○Pull up resistance of SCL terminal When SCL control is made at CMOS output port, there is no need, but in the case there is timing where SCL becomes 'Hi-Z', add a pull up resistance. As for the pull up resistance, one of several kΩ to several ten kΩ is recommended in consideration of drive performance of output port of microcontroller. www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Cautions on microcontroller connection ○RS In I2C BUS, it is recommended that SDA port is of open drain input/output. However, when to use CMOS input / output of tri state to SDA port, insert a series resistance Rs between the pull up resistance Rpu and the SDA terminal of EEPROM. This is controls over current that occurs when PMOS of the microcontroller and NMOS of EEPROM are turned ON simultaneously. Rs also plays the role of protection of SDA terminal against surge. Therefore, even when SDA port is open drain input/output, Rs can be used. ACK SCL RPU RS SDA 'H' output of microcontroller Over current flows to SDA line by 'H' output of microcontroller and 'L' output of EEPROM. EEPROM Microcontroller 'L' output of EEPROM Fig.46 I/O circuit diagram Fig.47 Input / output collision timing ○Maximum value of Rs The maximum value of Rs is determined by the following relations. ①SDA rise time to be determined by the capacity (CBUS) of bus line of Rpu and SDA should be tR or below. And AC timing should be satisfied even when SDA rise time is late. ②The bus electric potential A to be determined by Rpu and Rs the moment when EEPROM outputs 'L' to SDA bus sufficiently secure the input 'L' level (VIL) of microcontroller including recommended noise margin 0.1Vcc. (VCC-VOL)×RS RPU+RS VCC RPU RS A VOL ∴ RS VIL-VOL-0.1VCC 1.1VCC-VIL ≦ IOL × RPU Ex.)VCC=3V VIL=0.3VCC VOL=0.4V RPU=20kΩ Bus line capacity CBUS VIL + VOL+0.1VCC≦VIL RS EEPROM Micro controller Fig.48 I/O Circuit Diagram ≦ 0.3×3-0.4-0.1×3 1.1×3-0.3×3 × 20×10 3 ≦ 1.67[kΩ] ○Minimum value of Rs The minimum value of Rs is determined by over current at bus collision. When over current flows, noises in power source line, and instantaneous power failure of power source may occur. When allowable over current is defined as I, the following relation must be satisfied. Determine the allowable current in consideration of impedance of power source line in set and so forth. Set the over current to EEPROM 10mA or below. VCC ≦ RS RPU 'L'output RS ∴ RS ≧ Over current I I VCC I Ex.) VCC=3V, I=10mA 'H' output RS Microcontroller EEPROM ≧ 3 -3 10×10 ≧ 300[Ω] Fig.49 I/O circuit diagram www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●I2C BUS Input / Output Circuit ○Input (A0, A1, A2, SCL, WP) ○Input / output (SDA) Fig.51 Input / output pin circuit diagram Fig.50 Input pin circuit diagram ●Notes on Power ON At power on, in IC internal circuit and set, Vcc rises through unstable low voltage area, and IC inside is not completely reset, and malfunction may occur. To prevent this, functions of POR circuit and LVCC circuit are equipped. To assure the action, observe the following conditions at power on. 1. Set SDA = 'H' and SCL ='L' or 'H’ 2. Start power source so as to satisfy the recommended conditions of tR, tOFF, and Vbot for operating POR circuit. tR VCC tOFF Recommended conditions of tR, tOFF,Vbot tR tOFF Vbot 10ms or below 10ms or larger 0.3V or below Vbot 100 or below 10ms or larger 0.2V or below 0 Fig.52 Rise waveform diagram 3. Set SDA and SCL so as not to become 'Hi-Z'. When the above conditions 1 and 2 cannot be observed, take the following countermeasures. a) In the case when the above condition 1 cannot be observed. When SDA becomes 'L' at power on . →Control SCL and SDA as shown below, to make SCL and SDA, 'H' and 'H'. VCC tLOW SCL SDA After Vcc becomes stable After Vcc becomes stable tDH Fig.53 When tSU:DAT SCL= 'H' and SDA= 'L' tSU:DAT Fig.54 When SCL='L' and SDA='L' b) In the case when the above condition 2 cannot be observed. →After power source becomes stable, execute software reset(P18). c) In the case when the above conditions 1 and 2 cannot be observed. →Carry out a), and then carry out b). ●Low voltage malfunction prevention function LVCC circuit prevents data rewrite action at low power, and prevents wrong write. At LVCC voltage (Typ. =1.2V) or below, it prevent data rewrite. ●Vcc noise countermeasures ○Bypass capacitor When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended to attach a by pass capacitor (0.1μF) between IC Vcc and GND. At that moment, attach it as close to IC as possible. And, it is also recommended to attach a bypass capacitor between board Vcc and GND. www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Operational Notes (1) Described numeric values and data are design representative values, and the values are not guaranteed. (2) We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI. (3) Absolute maximum ratings If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to LSI. (4) GND electric potential Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of GND terminal. (5) Terminal design In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin. (6) Terminal to terminal shortcircuit and wrong packaging When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND owing to foreign matter, LSI may be destructed. (7) Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Ordering Information B R 2 4 G 6 4 x x x - 3 A x x BUS type 24 : I2C Operating temperature/ Operating Voltage -40℃ to +85℃/ 1.7V to 5.5V Capacity 64=64K Package Blank : DIP-T8 F : SOP8 FV : SSOP-B8 FVJ : TSSOP-B8J NUX : VSON008X2030 : SOP-J8 FJ FVT : TSSOP-B8 FVM : MSOP8 Process code Revision Packaging and forming specification E2 : Embossed tape and reel (SOP8,SOP-J8, SSOP-B8,TSSOP-B8, TSSOP-B8J) TR : Embossed tape and reel (MSOP8, VSON008X2030) None : Tube (DIP-T8) www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Physical Dimensions Tape and Reel Information DIP-T8 9.3±0.3 5 1 4 3.2±0.2 3.4±0.3 0.51Min. 6.5±0.3 8 7.62 0.3±0.1 0°−15° 2.54 0.5±0.1 (Unit : mm) <Tape and Reel information> Container Tube Quantity 2000pcs Direction of feed Direction of products is fixed in a container tube ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A SOP8 7 6 5 1 2 3 4 0.3MIN 4.4±0.2 6.2±0.3 8 +6° 4° −4° 0.9±0.15 5.0±0.2 (MAX 5.35 include BURR) 0.595 1.5±0.1 +0.1 0.17 -0.05 S S 0.11 0.1 1.27 0.42±0.1 (Unit : mm) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 26/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A SOP-J8 4.9±0.2 (MAX 5.25 include BURR) 7 6 5 1 2 3 4 0.45MIN 8 3.9±0.2 6.0±0.3 +6° 4° −4° 0.545 0.2±0.1 1.375±0.1 S 0.175 1.27 0.42±0.1 0.1 S (Unit : mm) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 27/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A SSOP-B8 3.0±0.2 (MAX 3.35 include BURR) 7 6 5 1 2 3 4 0.1 1.15±0.1 0.3MIN 6.4 ± 0.3 4.4 ± 0.2 8 0.15±0.1 S (0.52) 0.65 0.1 S +0.06 0.22 −0.04 0.08 M (Unit : mm) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 28/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A TSSOP-B8 3.0 ± 0.1 (MAX 3.35 include BURR) 7 6 5 1 2 3 4 4±4 1.0±0.2 0.5±0.15 1PIN MARK 0.525 +0.05 0.145 −0.03 S 0.1±0.05 1.2MAX 1.0±0.05 6.4±0.2 4.4±0.1 8 0.08 S +0.05 0.245 −0.04 0.08 M 0.65 (Unit : mm) <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 29/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A TSSOP-B8J 3.0 ± 0.1 (MAX 3.35 include BURR) 5 1 2 3 4 4±4 0.45±0.15 1PIN MARK 0.95±0.2 6 3.0±0.1 7 +0.05 0.145 −0.03 0.525 S 0.1±0.05 4.9±0.2 0.85±0.05 1.1MAX 8 0.08 S +0.05 0.32 −0.04 0.08 M 0.65 (Unit : mm) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) ∗ Order quantity needs to be multiple of the minimum quantity. 30/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A MSOP8 4.0±0.2 2.8±0.1 8 7 6 5 0.6±0.2 +6° 4° −4° 0.29±0.15 2.9±0.1 (MAX 3.25 include BURR) 1 2 3 4 1PIN MARK +0.05 0.145 −0.03 0.475 0.08±0.05 0.75±0.05 0.9MAX S +0.05 0.22 −0.04 0.08 S 0.65 (Unit : mm) <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin Direction of feed Reel www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ∗ Order quantity needs to be multiple of the minimum quantity. 31/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A VSON008X2030 3.0±0.1 2.0±0.1 0.6MAX 1PIN MARK 1.5±0.1 0.5 1 4 8 5 0.25 1.4±0.1 0.3±0.1 C0.25 (0.12) 0.08 S +0.03 0.02 −0.02 S +0.05 0.25 −0.04 (Unit : mm) <Tape and Reel information> Tape Embossed carrier tape Quantity 4000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin Reel www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 ) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 32/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Marking Diagrams SOP8(TOP VIEW) DIP-T8 (TOP VIEW) Part Number Marking BR24G64A Part Number Marking 4 G 6 4 A LOT Number LOT Number 1PIN MARK SOP-J8(TOP VIEW) SSOP-B8(TOP VIEW) Part Number Marking Part Number Marking 4 G 6 4 A 4GGA LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B8(TOP VIEW) TSSOP-B8J(TOP VIEW) Part Number Marking 4G64A Part Number Marking 4 G 6 LOT Number 4 A 3 1PIN MARK 1PIN MARK VSON008X2030 (TOP VIEW) MSOP8(TOP VIEW) 4 A LOT Number G G Part Number Marking Part Number Marking 4 G 6 LOT Number LOT Number 4 A 3 1PIN MARK 1PIN MARK www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 33/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet BR24G64-3A ●Revision History Date Revision 15.May.2012 001 Changes New Release www.rohm.co © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 34/34 TSZ02201-0R2R0G100040 -1-2 15.May.2012 REV.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. ●Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). ●Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. ●Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. ●Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. ●Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. ●Precaution Regarding Intellectual Property Rights 1) All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved. Datasheet ●Other Precaution 1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.003 © 2012 ROHM Co., Ltd. All rights reserved.