Datasheet DC Brush Motor Drivers (36V max.) BD62321HFP ●General Description BD62321HFP is a full bridge driver for brush motor applications. This IC can operate at a wide range of power-supply voltages (from 6V to 32V) with output currents of up to 3A. MOS transistors in the output stage allow PWM speed control. The BD62321HFP is pin compatible with the BD623xHFP series. ●Key Specifications ■ Supply Voltage Range: ■ Maximum Output Current: ■ Output ON resistance: ■ PWM Input frequency range: ■ Standby current: ■ Operating temperature range: ●Package HRP7 ●Features Built-in one channel driver Cross-conduction prevention circuit Four protection circuits provided: OCP, OVP, TSD, UVLO and SAP 36V(Max.) 3.0A 1.0Ω 20 to 100kHz 0μA (Typ.) -40 to 85℃ (Typ.) (Typ.) (Max.) 9.395mm x 10.540mm x 2.005mm ●Applications VTR; CD/DVD players; audio-visual equipment; optical disc drives; PC peripherals; OA equipments HRP7 (Pd=1.60W) *Pd : Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. ●Ordering Information B D 6 2 3 2 1 Part Number H F P Package HFP : HRP7 Voltage rating (Max.) Channels Output current (Max.) 36V 1ch 3.0A ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 - TR Packaging and forming specification TR: Embossed tape and reel (HRP7) Package HRP7 Reel of 2000 Orderable Part Number BD62321HFP-TR ○This product is not designed for protection against radioactive rays 1/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Block Diagram BD62321HFP VCC 1 FIN 3 RIN 5 PROTECT 7 VCC 4 GND CTRL FIN 2 6 GND OUT1 OUT2 Fig.1 BD62321HFP ●Pin Configuration TOP VIEW VCC OUT2 RIN GND FIN OUT1 VCC Fig.2 HRP7 package ●Pin Description Table 1 BD62321HFP Pin Name Function 1 VCC Power supply 2 OUT1 Driver output 3 FIN 4 GND Ground 5 RIN Control input (reverse) 6 OUT2 Driver output 7 VCC Power supply FIN GND Ground Control input (forward) Note: Use all VCC pin by the same voltage. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Absolute Maximum Ratings (Ta=25℃, All voltages are with respect to ground) Parameter Symbol Ratings Unit Supply voltage VCC 36 V Output current IOMAX 3.0 *1 A VIN -0.3 to VCC V Operating temperature TOPR -40 to +85 ℃ Storage temperature TSTG -55 to +150 ℃ Pd 1.6 *2 W Tjmax 150 ℃ All other input pins Power dissipation Junction temperature *1 *2 Do not exceed Pd or ASO. HRP7 package. Mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. Derate by 12.8mW/℃ above 25℃. ●Recommended Operating Rating (Ta=25℃) Parameter Supply voltage Symbol Ratings Unit VCC 6 to 32 V ●Electrical Characteristics (Unless otherwise specified, Ta=25℃ and VCC=24V) Limits Parameter Symbol Unit Conditions Min. Min. Min. ICC 0.7 1.4 2.2 mA Forward / Reverse / Brake Stand-by current ISTBY - 0 10 µA Stand-by Input high voltage VIH 2.0 - - V Input low voltage VIL - - 0.8 V Input bias current IIH 30 50 100 µA VIN=5.0V Output ON resistance RON 0.5 1.0 1.5 Ω IO=1.0A, vertically total Input frequency range FMAX 20 - 100 kHz Supply current www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/13 FIN / RIN TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Typical Performance Curves (Reference data) 8 Stand-by Current: ISTBY [µA] Circuit Current: Icc [mA] 2.0 1.5 1.0 85°C 25°C -40°C 0.5 -40°C 25°C 85°C 6 4 2 0 6 12 18 24 30 6 36 12 24 30 36 Supply Voltage: Vcc [V] Supply Voltage: Vcc [V] Fig.3 Supply current Fig.4 Stand-by current 1.0 Input Bias Current: IIH [mA] 1.5 Internal Logic: H/L [-] _ 18 1.0 -40°C 25°C 85°C -40°C 25°C 85°C 0.5 0.0 85°C 25°C -40°C 0.8 0.6 0.4 0.2 0.0 -0.5 0.8 1.2 1.6 0 2 12 18 24 30 36 Input Voltage: VIN [V] Input Voltage: VIN [V] Fig.5 Input threshold voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6 Fig.6 Input bias current 4/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Typical Performance Curves (Reference data) - Continued 54 _ 85°C 25°C -40°C Internal signal: Release [V] Internal signal: Release [V] _ 9 6 3 0 45 36 27 85°C 25°C -40°C 18 9 0 4.5 5 5.5 6 36 40 Supply Voltage: VCC [V] 48 Supply Voltage: VCC [V] Fig.7 Under voltage lock out Fig.8 Over voltage protection 3 2 85°C 25°C -40°C 2.5 Output Voltage:VCC-VOUT [V] Output Voltage: VCC-VOUT [V] 44 2 1.5 1 0.5 0 -40°C 25°C 85°C 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 0 Output Current: IOUT [A] 1 1.5 2 2.5 3 Output Current: IOUT [A] Fig.9 Output high voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 0.5 Fig.10 5/13 High side body diode TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Typical Performance Curves (Reference data) - Continued 1.5 3 85°C 25°C -40°C 2.5 Output Voltage: VOUT [V] Internal Logic: H/L [-] _ 85°C 25°C -40°C 1.0 0.5 0.0 2 1.5 1 0.5 -0.5 0 4.1 4.3 4.5 4.7 4.9 0 Load Current [A] 1 1.5 2 2.5 3 Output Current: IOUT [A] Fig.11 Over current protection (H side) 2 Fig.12 Output low voltage 1.5 -40°C 25°C 85°C 85°C 25°C -40°C Internal Logic: H/L [-] _ Output Voltage: VOUT [V] 0.5 1.5 1 0.5 0 1.0 0.5 0.0 -0.5 0 0.5 1 1.5 2 2.5 3 3.8 Output Current: IOUT [A] 4.2 4.4 4.6 Load Current [A] Fig.13 Low side body diode www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4 Fig.14 Over current protection (L side) 6/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Functional Descriptions 1) Operation modes Table 2 Logic table FIN RIN OUT1 OUT2 a L L Hi-Z* Hi-Z* b H L H L Forward (OUT1 > OUT2) c L H L H Reverse (OUT1 < OUT2) d H H L L Brake (stop) e PWM L H f L PWM __________ __________ PWM Operation Stand-by (idling) PWM Forward (PWM control) H Reverse (PWM control) * Hi-Z : all output transistors are off. Please note that this is the state of the connected diodes, which differs from that of the mechanical relay. a) Stand-by mode In stand-by mode, all internal circuits are turned off, including the output power transistors. Motor output goes to high impedance. When the system is switched to stand-by mode while the motor is running, the system enters an idling state because of the body diodes. However, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50µs before shutting down all circuits. b) Forward mode This operating mode is defined as the forward rotation of the motor when OUT1 pin is high and OUT2 pin is low. When the motor is connected between OUT1 and OUT2 pins, the current flows from OUT1 to OUT2. c) Reverse mode This operating mode is defined as the reverse rotation of the motor when OUT1 pin is low and OUT2 pin is high. When the motor is connected between the OUT1 and OUT2 pins, the current flows from OUT2 to OUT1. d) Brake mode This operating mode is used to quickly stop the motor (short circuit brake). It differs from the stand-by mode because the internal control circuit is operating in the brake mode. Please switch to stand-by mode (rather than the brake mode) to save power and reduce consumption. OFF OFF ON M OFF OFF OFF M OFF OFF a) Stand-by mode ON OFF M ON b) Forward mode ON c) Reverse mode OFF M OFF ON ON d) Brake mode Fig.15 Four basic operations (output stage) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP e) f) PWM control mode The rotational speed of the motor can be controlled by the duty cycle of the PWM signal fed to the FIN pin or the RIN pin. In this mode, the high side output is fixed and the low side output is switching, corresponding to the input signal. The state of the output toggles between "L" and "Hi-Z". The frequency of the input PWM signal can be between 20kHz and 100kHz. The circuit may not operate properly for PWM frequencies below 20kHz and above 100kHz. Note that control may not be attained by switching on duty at frequencies lower than 20kHz, since the operation functions via the stand-by mode. To operate in this mode, connect the VREF pin to the VCC pin. In addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10µF or higher is recommended) between VCC and ground. ON OFF ON OFF M OFF M ON OFF Control input : H OFF Control input : L Fig.16 PWM control operation (output stage) FIN RIN OUT1 OUT2 Fig.17 PWM control operation (timing chart) 2) Cross-conduction protection circuit In the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to low or low to high transition, an inrush current flows from the power supply to ground, resulting to a loss. This circuit eliminates the inrush current by providing a dead time (about 800ns, nominal) during the transition. 3) Output protection circuits a) Under voltage lock out (UVLO) circuit To ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a UVLO circuit has been built into this driver. When the power supply voltage falls to 5.3V (nominal) or below, the controller forces all driver outputs to high impedance. When the voltage rises to 5.5V (nominal) or above, the UVLO circuit ends the lockout operation and returns the chip to normal operation. b) Over voltage protection (OVP) circuit When the power supply voltage exceeds 45V (nominal), the controller forces all driver outputs to high impedance. The OVP circuit is released and its operation ends when the voltage drops back to 40V (nominal) or below. This protection circuit does not work in the stand-by mode. Also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. Therefore, do not continue to use the IC after this circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP c) Thermal shutdown (TSD) circuit The TSD circuit operates when the junction temperature of the driver exceeds the preset temperature (175℃ nominal). At this time, the controller forces all driver outputs to high impedance. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150℃ nominal). Thus, it is a self-resetting circuit. The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not operate the IC in an environment where activation of the circuit is assumed. d) Over current protection (OCP) circuit To protect this driver IC from ground faults, power supply line faults and load short circuits, the OCP circuit monitors the output current for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290µs, nominal). The IC returns to normal operation after the off time period has elapsed (self-returning type). At the two channels type, this circuit works independently for each channel. Threshold Iout 0 CTRL Input Internal status ON OFF mon. ON off timer Monitor / Timer Fig.18 Over current protection (timing chart) e) Safe area protection (SAP) circuit To protect the output MOS transistors from ASO, ground faults, power supply line faults and load short circuits, the SAP circuit monitors the conditions for the circuit’s monitoring time (10µs, nominal). When the protection circuit detects to exceed ASO, the controller forces all driver outputs to high impedance and latch in the state. It is released that via standby mode during 150µs or more by the control inputs FIN and RIN. ●I/O equivalent circuit VCC FIN RIN 100k OUT1 OUT2 100k GND Fig.19 FIN / RIN www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 Fig.20 OUT1 / OUT2 9/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Operational Notes 1) Absolute maximum ratings Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. 2) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 3) Power supply lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 4) Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) Thermal consideration Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in actual operating conditions. Consider Pc that does not exceed Pd in actual operating conditions (Pc≥Pd). Package Power dissipation Power dissipation : Pd (W)=(Tjmax－Ta)/θja : Pc (W)=(Vcc－Vo)×Io+Vcc×Ib Tjmax : Maximum junction temperature=150℃, Ta : Peripheral temperature[℃] , θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W], Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current 6) Short between pins and mounting errors Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins. 7) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8) Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 9) Capacitor between output and GND If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor can flow into the output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a capacitor smaller than 10uF between output and GND. 10) Testing on application boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 11) Switching noise When the operation mode is in PWM control or VREF control, PWM switching noise may affect the control input pins and cause IC malfunctions. In this case, insert a pull down resistor (10kΩ is recommended) between each control input pin and ground. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP 12) Regarding the input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C Pin B B Pin A N P+ N P+ P N E Parasitic element N P+ Parasitic element B P+ P C N E P substrate GND N P substrate GND Parasitic element GND Parasitic GND element Other adjacent elements Fig21. Example of monolithic IC structure www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Physical Dimension Tape and Reel Information HRP7 <Tape and Reel information> 1.017±0.2 9.395±0.125 (MAX 9.745 include BURR) 8.82±0.1 1.905±0.1 Tape Embossed carrier tape Quantity 2000pcs 0.08±0.05 0.8875 Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1pin +5.5° 4.5° −4.5° +0.1 0.27 -0.05 0.73±0.1 1.27 10.54±0.13 0.835±0.2 1 2 3 4 5 6 7 1.523±0.15 (7.49) 8.0±0.13 (5.59) 0.08 S S Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram HRP7 (TOP VIEW) Part Number Marking BD62321HFP LOT Number 1PIN MARK www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet BD62321HFP ●Revision History Date Revision 10.Apr.2012 001 25.Dec.2012 002 Changes New Release Improved the statement in all pages. Deleted “Status of this document” in page 11. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/13 TSZ02201-0P2P0B300110-1-2 25.Dec.2012 Rev.002 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. 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Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. 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ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.