DS6234AB 00

®
RT6234A/B
3A, 18V, 500kHz, ACOTTM Step-Down Converter
General Description
Features
The RT6234A/B is a high-efficiency, monolithic
synchronous step-down DC/DC converter that can deliver
up to 3A output current from a 4.5V to 18V input supply.
The RT6234A/B adopts ACOT architecture to allow the
transient response to be improved and keep in constant
frequency. Cycle-by-cycle current limit provides protection
against shorted outputs and soft-start eliminates input
current surge during start-up. Fault conditions also include
output under voltage protection and thermal shutdown.







Ω MOSFETs
Integrated 130mΩ
Ω / 70mΩ
4.5V to 18V Supply Voltage Range
500kHz Switching Frequency
ACOT Control
0.8V ± 2% Voltage Reference
Output Adjustable from 0.8V to 6.5V
Monotonic Start-Up into Pre-Biased Outputs
Applications

Ordering Information

RT6234A/B


Package Type
QW : WDFN-8L 2x3 (W-Type)

Lead Plating System
G : Green (Halogen Free and Pb Free)
Set Top Box
Portable TV
Access Point Router
DSL Modem
LCD TV
Pin Configurations
BOOT
GND
SW
VIN
A : PSM Mode
B : PWM Mode
1
2
3
4
GND
(TOP VIEW)
UVP Option
H : Hiccup
9
8
7
6
5
SS
PGOOD
EN
FB
Note :
Richtek products are :

WDFN-8L 2x3
RoHS compliant and compatible with the current requirements of IPC/JEDEC J-STD-020.

Suitable for use in SnPb or Pb-free soldering processes.
Simplified Application Circuit
RT6234A/B
VIN
VIN
CIN
Enable
VPGOOD
RPGOOD
BOOT
CBOOT
L
VOUT
SW
EN
PGOOD
R1
CFF
COUT
FB
R2
SS
GND
CSS
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS6234A/B-00 January 2016
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RT6234A/B
Marking Information
RT6234AHGQW
RT6234BHGQW
11 : Product Code
10 : Product Code
W : Date Code
11W
10W
W : Date Code
Function Pin Description
Pin No.
Pin Name
Pin Function
BOOT
Bootstrap, Supply for High-Side Gate Driver. Connect a 0.1F or greater
ceramic capacitor between the BOOT pin and SW pin to power the high-side
switch.
GND
System Ground. Provides the ground return path for the control circuitry and
low-side power MOSFET. The exposed pad must be soldered to a large PCB
and connected to GND for maximum power dissipation.
3
SW
Switch Node. SW is the switching node that supplies power to the output and
connect the output LC filter from SW pin to the output load.
4
VIN
Power Input. Supplies the power switches of the device.
5
FB
Feedback Voltage Input. This pin is used to set the desired output voltage via
an external resistive divider.
6
EN
Enable Control Input. Floating this pin or connecting this pin to ground can
disable the device and connecting this pin to logic high can enable the device.
7
PGOOD
Power Good Indicator. This pin is an open-drain logic output that is pulled to
ground when the output voltage is lower or higher than its specified threshold
under the conditions of OTP, EN shutdown, or during soft-start.
8
SS
Soft-Start Control Input. Connect a capacitor between the SS pin and ground to
set the soft-start period.
1
2,
9 (Exposed Pad)
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RT6234A/B
Function Block Diagram
BOOT
VIN
VIN
Reg
PVCC
VCC
VIBIAS
UV
VREF Protection
PVCC
UGATE
OC
VCC
SS
FB
Ripple
Gen.
SW
Driver
LGATE
Comparator
GND
PGOOD
SW
+
+
-
2µA
Control
FB
EN
0.9 VREF
+
-
Comparator
EN
Operation
The RT6234A/B is a synchronous step-down converter
with advanced constant on-time control mode. Using the
ACOTTM control mode can reduce the output capacitance
and provide fast transient response. It can minimize the
component size without additional external compensation
network.
UVLO Protection
To protect the chip from operating at insufficient supply
voltage, the UVLO is needed. When the input voltage of
VIN is lower than the UVLO falling threshold voltage, the
device will be lockout.
Thermal Shutdown
Current Protection
The inductor current is monitored via the internal switches
cycle-by-cycle. Once the output voltage drops under UV
threshold, the RT6234A/B will enter hiccup mode.
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DS6234A/B-00 January 2016
When the junction temperature exceeds the OTP
threshold value, the IC will shut down the switching
operation. Once the junction temperature cools down and
is lower than the OTP lower threshold, the converter will
autocratically resume switching.
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RT6234A/B
Absolute Maximum Ratings










(Note 1)
Supply Input Voltage, VIN ---------------------------------------------------------------------------------- −0.3V to 20V
Switch Voltage, SW ----------------------------------------------------------------------------------------- −0.3V to (VIN + 0.3V)
<10ns ----------------------------------------------------------------------------------------------------------- −5V to 25V
BOOT Voltage, VBOOT ---------------------------------------------------------------------------------------------------------------------------- (VSW − 0.3V) to (VIN + 6.3V)
All Other Pins ------------------------------------------------------------------------------------------------- −0.3V to 6V
Power Dissipation, PD @ TA = 25°C
WDFN-8L 2x3 ------------------------------------------------------------------------------------------------- 3.17W
Package Thermal Resistance (Note 2)
WDFN-8L 2x3, θJA -------------------------------------------------------------------------------------------- 31.5°C/W
WDFN-8L 2x3, θJC -------------------------------------------------------------------------------------------- 7.5°C/W
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------ 260°C
Junction Temperature Range ------------------------------------------------------------------------------- 150°C
Storage Temperature Range ------------------------------------------------------------------------------- −65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Model) --------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions



(Note 4)
Supply Voltage ------------------------------------------------------------------------------------------------ 4.5V to 18V
Junction Temperature Range ------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 12V, TA = 25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
3.6
3.9
4.2
V
--
340
--
mV
Supply Voltage
VIN Under-Voltage Lockout
Threshold-Rising
VUVLO
Vin Under-Voltage Lockout
Threshold-Hysteresis
VUVLO
VIN Rising
Supply Current
Supply Current (Shutdown)
ISHDN
VEN = 0V
--
--
6
A
Supply Current (Quiescent)
IQ
VEN = 2V, VFB = 1V
--
0.8
--
mA
--
2
--
A
Soft-Start
Soft-Start Current
ISS
Enable Voltage
EN Rising Threshold
VEN_H
1.38
1.5
1.62
V
EN Falling Threshold
VEN_L
1.16
1.28
1.4
V
VFB
784
800
816
mV
Feedback Voltage
Feedback Voltage
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DS6234A/B-00 January 2016
RT6234A/B
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
--
130
--
m
Internal MOSFET
VBOOT  VSW = 4.8V
High-Side Switch-On Resistance
RDS(ON)_H
Low-Side Switch-On Resistance
RDS(ON)_L
--
70
--
m
ILIM
4
4.5
--
A
f SW
--
500
--
kHz
Maximum Duty Cycle
DMAX
--
90
--
%
Minimum On Time
tON(MIN)
--
60
--
ns
Thermal Shutdown
TSD
--
150
--
C
Thermal Hysteresis
TSD
--
20
--
C
UVP detect
45
50
55
%
Hysteresis
--
10
--
%
Current Limit
Current Limit
Switching Frequency
Oscillator Frequency
On-Time Timer Control
Thermal Shutdown
Output Under Voltage Protections
Output Under Voltage Trip
Threshold
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. The device is not guaranteed to function outside its operating conditions.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
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RT6234A/B
Typical Application Circuit
RT6234A/B
VIN
4.5V to 18V
4
CIN
22µF
BOOT
SW
1
CBOOT
0.1µF
3
L
5
R T*
VOUT
6 EN
Enable
VPGOOD
VIN
RPGOOD
100k
7
8
CSS
10nF
PGOOD
SS
FB
GND
R1
2, 9 (Exposed Pad)
CFF
Option
COUT
22µF
R2
*Note :
When CFF is added, it is necessary to add RT = 10k between
feedback network and chip FB pin.
Table 1. Suggested Component Values (VIN = 12V)
VOUT (V)
R1 (k)
R2 (k)
L (H)
COUT (F)
CFF (pF)
1.05
10
32.4
2.2
44
--
1.2
20.5
41.2
2.2
44
--
1.8
40.2
32.4
3.3
44
--
2.5
40.2
19.1
3.3
44
22 to 68
3.3
40.2
13
4.7
44
22 to 68
5
40.2
7.68
4.7
44
22 to 68
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RT6234A/B
Typical Operating Characteristics
Efficiency vs. Output Current
100
Output Voltage vs. Output Current
1.082
RT6234AH
90
1.072
70
VOUT =
VOUT =
VOUT =
VOUT =
60
50
Output Voltage (V)
80
Efficiency (%)
RT6234AH
1.05V
1.8V
3.3V
5V
40
30
20
1.061
1.051
1.040
1.030
10
VIN = 12V
0
0.001
VIN = 12V, VOUT = 1.05V
1.019
0.01
0.1
1
10
0
0.5
Output Current (A)
RT6234AH
2.5
3
RT6234AH
3.45
Output Voltage (V)
1.818
1.800
1.782
1.764
3.40
3.35
3.30
3.25
3.20
3.15
VIN = 12V, VOUT = 1.8V
VIN = 12V, VOUT = 3.3V
1.746
3.10
0
0.5
1
1.5
2
2.5
3
0
0.5
Output Current (A)
1.5
2
2.5
3
Output Voltage vs. Input Voltage
1.082
RT6234AH
5.15
1
Output Current (A)
Output Voltage vs. Output Current
5.20
RT6234AH
1.071
Output Voltage (V)
5.10
Output Voltage (V)
2
Output Voltage vs. Output Current
3.50
1.836
Output Voltage (V)
1.5
Output Current (A)
Output Voltage vs. Output Current
1.854
1
5.05
5.00
4.95
4.90
4.85
4.80
1.061
1.050
1.040
IOUT = 1A
IOUT = 2A
IOUT = 3A
1.029
4.75
VIN = 6V to 18V, VOUT = 1.05V
VIN = 12V, VOUT = 5V
4.70
1.019
0
0.5
1
1.5
2
2.5
Output Current (A)
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6
8
10
12
14
16
18
Input Voltage (V)
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RT6234A/B
Output Voltage vs. Input Voltage
1.854
Output Voltage vs. Input Voltage
3.40
RT6234AH
IOUT = 1A
IOUT = 2A
IOUT = 3A
3.35
1.818
Output Voltage (V)
Output Voltage (V)
1.836
RT6234AH
IOUT = 1A
IOUT = 2A
IOUT = 3A
1.800
1.782
1.764
3.30
3.25
3.20
3.15
VIN = 6V to 18V, VOUT = 1.8V
VIN = 6V to 18V, VOUT = 3.3V
1.746
3.10
0
5
10
15
20
6
8
10
Input Voltage (V)
5.05
5.00
4.95
4.90
4.85
4.80
RT6234BH
70
VOUT =
VOUT =
VOUT =
VOUT =
60
50
1.05V
1.8V
3.3V
5V
40
30
20
4.75
10
VIN = 7V to 18V, VOUT = 5V
4.70
6
8
10
12
14
16
VIN = 12V
0
0.001
18
0.01
Input Voltage (V)
0.1
1
10
Output Current (A)
Output Voltage vs. Output Current
1.082
Output Voltage vs. Output Current
1.854
RT6234BH
RT6234BH
1.836
Output Voltage (V)
1.072
Output Voltage (V)
18
80
Efficiency (%)
Output Voltage (V)
90
IOUT = 1A
IOUT = 2A
IOUT = 3A
5.10
16
Efficiency vs. Output Current
100
RT6234AH
5.15
14
Input Voltage (V)
Output Voltage vs. Input Voltage
5.20
12
1.061
1.051
1.040
1.030
1.818
1.800
1.782
1.764
VIN = 12V, VOUT = 1.8V
VIN = 12V, VOUT = 1.05V
1.019
1.746
0
0.5
1
1.5
2
2.5
Output Current (A)
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3
0
0.5
1
1.5
2
2.5
3
Output Current (A)
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RT6234A/B
Output Voltage vs. Output Current
3.399
Output Voltage vs. Output Current
5.15
RT6234BH
5.10
Output Voltage (V)
Output Voltage (V)
3.366
RT6234BH
3.333
3.300
3.267
3.234
5.05
5.00
4.95
4.90
VIN = 12V, VOUT = 3.3V
VIN = 12V, VOUT = 5V
3.201
4.85
0
0.5
1
1.5
2
2.5
3
0
0.5
Output Current (A)
RT6234BH
2.5
3
RT6234BH
1.836
Output Voltage (V)
Output Voltage (V)
2
Output Voltage vs. Input Voltage
1.854
1.071
1.061
1.050
IOUT = 1A
IOUT = 2A
IOUT = 3A
1.040
IOUT = 1A
IOUT = 2A
IOUT = 3A
1.818
1.800
1.782
1.029
1.764
VIN = 6V to 18V, VOUT = 1.05V
VIN = 6V to 18V, VOUT = 1.8V
1.019
1.746
6
8
10
12
14
16
18
6
8
Input Voltage (V)
10
12
14
16
18
Input Voltage (V)
Output Voltage vs. Input Voltage
3.399
Output Voltage vs. Input Voltage
5.20
RT6234BH
RT6234BH
5.15
Output Voltage (V)
3.366
Output Voltage (V)
1.5
Output Current (A)
Output Voltage vs. Input Voltage
1.082
1
IOUT = 1A
IOUT = 2A
IOUT = 3A
3.333
3.300
3.267
3.234
IOUT = 1A
IOUT = 2A
IOUT = 3A
5.10
5.05
5.00
4.95
4.90
4.85
VIN = 7V to 18V, VOUT = 5V
VIN = 6V to 18V, VOUT = 3.3V
3.201
4.80
6
8
10
12
14
16
Input Voltage (V)
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6
8
10
12
14
16
18
Input Voltage (V)
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RT6234A/B
Enable Voltage vs. Temperature
1.80
4.8
1.72
4.6
1.64
Enable Voltage (V)
UVLO Voltage (V)
UVLO vs. Temperature
5.0
4.4
4.2
Turn On
4.0
3.8
3.6
Turn Off
3.4
1.56
Enable On
1.48
1.40
1.32
Enable Off
1.24
1.16
3.2
1.08
VOUT = 1.05V, IOUT = 1A
3.0
VOUT = 1.05V, IOUT = 0A
1.00
-50
-25
0
25
50
75
100
125
-50
-25
0
Temperature (°C)
25
50
75
100
125
Temperature (°C)
Output Voltage vs. Temperature
Reference Voltage vs. Temperature
1.050
0.820
1.044
Output Voltage (V)
1.032
Reference Voltage (V)
VIN = 4.5V
VIN = 12V
VIN = 18V
1.038
1.026
1.020
1.014
1.008
1.002
0.996
0.812
0.804
0.796
VIN = 4.3V
VIN = 12V
VIN = 18V
0.788
IOUT = 1A
VOUT = 1.05V, IOUT = 1A
0.990
0.780
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
Temperature (°C)
Temperature (°C)
Load Transient Response
Output Ripple Voltage
100
125
VOUT
(20mV/Div)
VOUT
(20mV/Div)
VSW
(10V/Div)
IOUT
(1A/Div)
I SW
(2A/Div)
VIN = 12V, VOUT = 1.05V,
IOUT = 1.5A to 3A, L = 1.8μH
Time (100μs/Div)
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VIN = 12V, VOUT = 1.05V,
IOUT = 3A, L = 1.8μH
Time (2μs/Div)
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RT6234A/B
Power On from VIN
VIN = 12V, VOUT = 1.05V,
IOUT = 3A, L = 1.8μH
VIN
(10V/Div)
VOUT
(1V/Div)
Power Off from VIN
VIN
(10V/Div)
VOUT
(1V/Div)
VSW
(10V/Div)
VSW
(10V/Div)
I SW
(2A/Div)
I SW
(2A/Div)
VIN = 12V, VOUT = 1.05V,
IOUT = 3A, L = 1.8μH
Time (4ms/Div)
Time (10ms/Div)
Power On from EN
Power Off from EN
EN
(2V/Div)
VIN = 12V, VOUT = 1.05V,
IOUT = 3A, L = 1.8μH
VOUT
(1V/Div)
EN
(2V/Div)
VIN = 12V, VOUT = 1.05V,
IOUT = 3A, L = 1.8μH
VOUT
(1V/Div)
VSW
(10V/Div)
VSW
(10V/Div)
I SW
(2A/Div)
I SW
(2A/Div)
Time (4ms/Div)
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RT6234A/B
Application Information
Inductor Selection
Selecting an inductor involves specifying its inductance
and also its required peak current. The exact inductor value
is generally flexible and is ultimately chosen to obtain the
best mix of cost, physical size, and circuit efficiency.
Lower inductor values benefit from reduced size and cost
and they can improve the circuit’s transient response,
but they increase the inductor ripple current and output
voltage ripple and reduce the efficiency due to the resulting
higher peak currents. Conversely, higher inductor values
increase efficiency, but the inductor will either be physically
larger or have higher resistance since more turns of wire
are required and transient response will be slower since
more time is required to change current (up or down) in
the inductor. A good compromise between size, efficiency,
and transient response is to use a ripple current (ΔIL) about
20% to 50% of the desired full output load current.
Calculate the approximate inductor value by selecting the
input and output voltages, the switching frequency (fSW),
the maximum output current (IOUT(MAX)) and estimating a
ΔIL as some percentage of that current.
L=
VOUT   VIN  VOUT 
VIN  fSW  IL
Once an inductor value is chosen, the ripple current (ΔIL)
is calculated to determine the required peak inductor
current.
VOUT   VIN  VOUT 
VIN  fSW  L
I
IL(PEAK) = IOUT(MAX)  L
2
IL =
To guarantee the required output current, the inductor
needs a saturation current rating and a thermal rating that
exceeds IL(PEAK). These are minimum requirements. To
maintain control of inductor current in overload and short
circuit conditions, some applications may desire current
ratings up to the current limit value. However, the IC's
output under-voltage shutdown feature make this
unnecessary for most applications.
the output current) while ensuring that IL(PEAK) does not
exceed the upper current limit level.
For best efficiency, choose an inductor with a low DC
resistance that meets the cost and size requirements.
For low inductor core losses some type of ferrite core is
usually best and a shielded core type, although possibly
larger or more expensive, will probably give fewer EMI
and other noise problems.
Considering the Typical Operating Circuit for 1.2V output
at 3A and an input voltage of 12V, using an inductor ripple
of 0.9A (30%), the calculated inductance value is :
L=
1.2  12  1.2 
= 2.4μH
12  500kHz  0.9A
The ripple current was selected at 0.9A and, as long as
we use the calculated 2.4μH inductance, that should be
the actual ripple current amount. The ripple current and
required peak current as below :
IL =
1.2  12  1.2 
= 0.9A
12  500kHz  2.4μH
and IL(PEAK) = 3A  0.9A = 3.45A
2
For the 2.4μH value, the inductor's saturation and thermal
rating should exceed 3.45A. Since the actual value used
was 2.4μH and the ripple current exactly 0.9A, the required
peak current is 3.45A.
Input Capacitor Selection
The input filter capacitors are needed to smooth out the
switched current drawn from the input power source and
to reduce voltage ripple on the input. The actual
capacitance value is less important than the RMS current
rating (and voltage rating, of course). The RMS input ripple
current (IRMS) is a function of the input voltage, output
voltage, and load current :
V
IRMS = IOUT(MAX)  OUT
VIN
VIN
1
VOUT
IL(PEAK) should not exceed the minimum value of IC's upper
current limit level or the IC may not be able to meet the
desired output current. If needed, reduce the inductor ripple
current (ΔIL) to increase the average inductor current (and
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12
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DS6234A/B-00 January 2016
RT6234A/B
Ceramic capacitors are most often used because of their
low cost, small size, high RMS current ratings, and robust
surge current capabilities. However, take care when these
capacitors are used at the input of circuits supplied by a
wall adapter or other supply connected through long, thin
wires. Current surges through the inductive wires can
induce ringing at the RT6234A/B input which could
potentially cause large, damaging voltage spikes at VIN.
If this phenomenon is observed, some bulk input
capacitance may be required. Ceramic capacitors (to meet
the RMS current requirement) can be placed in parallel
with other types such as tantalum, electrolytic, or polymer
(to reduce ringing and overshoot).
Choose capacitors rated at higher temperatures than
required. Several ceramic capacitors may be paralleled to
meet the RMS current, size, and height requirements of
the application. The typical operating circuit uses two 10μF
and one 0.1μF low ESR ceramic capacitors on the input.
Output Capacitor Selection
The RT6234A/B are optimized for ceramic output
capacitors and best performance will be obtained using
them. The total output capacitance value is usually
determined by the desired output voltage ripple level and
transient response requirements for sag (undershoot on
positive load steps) and soar (overshoot on negative load
steps).
For the Typical Operating Circuit for 1.2V output and an
inductor ripple of 0.4A, with 2 x 22μF output capacitance
each with about 5mΩ ESR including PCB trace resistance,
the output voltage ripple components are :
VRIPPLE(ESR) = 0.9A  5m = 4.5mV
0.9A
= 5.11mV
8  44μF  500kHz
= 4.5mV  5.11mV = 9.61mV
VRIPPLE(C) =
VRIPPLE
Feed-forward Capacitor (Cff)
The RT6234A/B are optimized for ceramic output
capacitors and for low duty cycle applications. However
for high-output voltages, with high feedback attenuation,
the circuit's response becomes over-damped and transient
response can be slowed. In high-output voltage circuits
(VOUT > 3.3V) transient response is improved by adding a
small “feed-forward” capacitor (Cff) across the upper FB
divider resistor (Figure 1), to increase the circuit's Q and
reduce damping to speed up the transient response without
affecting the steady-state stability of the circuit. Choose
a suitable capacitor value that following below step.

Get the BW the quickest method to do transient
response form no load to full load. Confirm the damping
frequency. The damping frequency is BW.
Output Ripple
Output ripple at the switching frequency is caused by the
inductor current ripple and its effect on the output
capacitor's ESR and stored charge. These two ripple
components are called ESR ripple and capacitive ripple.
Since ceramic capacitors have extremely low ESR and
relatively little capacitance, both components are similar
in amplitude and both should be considered if ripple is
critical.
VRIPPLE = VRIPPLE(ESR)  VRIPPLE(C)
VRIPPLE(ESR) = IL  RESR
VRIPPLE(C) =
IL
8  COUT  fSW
BW
VOUT
R1
Cff
FB
RT6234A/B
R2
GND
Figure 1. Cff Capacitor Setting
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS6234A/B-00 January 2016
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13
RT6234A/B
Cff can be calculated base on below equation :
1
Cff 
2  3.1412  R1 BW  0.8

Output Voltage Setting
Enable Operation (EN)
Set the desired output voltage using a resistive divider
from the output to ground with the midpoint connected to
FB. The output voltage is set according to the following
equation :
VOUT  0.8V  (1 + R1 )
R2
For automatic start-up the high-voltage EN pin can be
connected to VIN, through a 100kΩ resistor. Its large
hysteresis band makes EN useful for simple delay and
timing circuits. EN can be externally pulled to VIN by
adding a resistor-capacitor delay (REN and CEN in Figure
2). Calculate the delay time using EN's internal threshold
where switching operation begins.
An external MOSFET can be added to implement digital
control of EN when no system voltage above 2V is available
(Figure 3). In this case, a 100kΩ pull-up resistor, REN, is
connected between VIN and the EN pin. MOSFET Q1 will
be under logic control to pull down the EN pin. To prevent
enabling circuit when VIN is smaller than the VOUT target
value or some other desired voltage level, a resistive voltage
divider can be placed between the input voltage and ground
and connected to EN to create an additional input under
voltage lockout threshold (Figure 4).
EN
VIN
REN
EN
RT6234A/B
CEN
GND
Figure 2. External Timing Control
VIN
REN
100k
EN
Q1
Enable
Figure 3. Digital Enable Control Circuit
REN1
REN2
EN
RT6234A/B
GND
Figure 4. Resistor Divider for Lockout Threshold Setting
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14
R1
FB
RT6234A/B
R2
GND
Figure 5. Output Voltage Setting
Place the FB resistors within 5mm of the FB pin. Choose
R2 between 10kΩ and 100kΩ to minimize power
consumption without excessive noise pick-up and
calculate R1 as follows :
R1 
R2  (VOUT  VREF )
VREF
For output voltage accuracy, use divider resistors with 1%
or better tolerance.
External BOOT Bootstrap Diode
When the input voltage is lower than 5.5V it is
recommended to add an external bootstrap diode between
VIN (or VINR) and the BOOT pin to improve enhancement
of the internal MOSFET switch and improve efficiency.
The bootstrap diode can be a low cost one such as 1N4148
or BAT54.
RT6234A/B
GND
VIN
VOUT
External BOOT Capacitor Series Resistance
The internal power MOSFET switch gate driver is
optimized to turn the switch on fast enough for low power
loss and good efficiency, but also slow enough to reduce
EMI. Switch turn-on is when most EMI occurs since VSW
rises rapidly. During switch turn-off, SW is discharged
relatively slowly by the inductor current during the dead
time between high-side and low-side switch on-times. In
some cases it is desirable to reduce EMI further, at the
expense of some additional power dissipation. The switch
turn-on can be slowed by placing a small (<47Ω)
is a registered trademark of Richtek Technology Corporation.
DS6234A/B-00 January 2016
RT6234A/B
5V
3.5
Maximum Power Dissipation (W)1
resistance between BOOT and the external bootstrap
capacitor. This will slow the high-side switch turn-on and
VSW's rise. To remove the resistor from the capacitor
charging path (avoiding poor enhancement due to
undercharging the BOOT capacitor), use the external diode
shown in Figure 6 to charge the BOOT capacitor and place
the resistance between BOOT and the capacitor/diode
connection.
Four-Layer PCB
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
BOOT
RT6234A/B
0.1µF
SW
25
50
75
100
125
Ambient Temperature (°C)
Figure 7. Derating Curve of Maximum Power Dissipation
Figure 6. External Bootstrap Diode
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WDFN-8L 2x3 package, the thermal resistance, θJA, is
31.5°C/W on a standard four-layer thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by the following formula :
PD(MAX) = (125°C − 25°C) / (31.5°C/W) = 3.17W for
WDFN-8L 2x3 package
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 7 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
Copyright © 2016 Richtek Technology Corporation. All rights reserved.
DS6234A/B-00 January 2016
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
15
RT6234A/B
Outline Dimension
D
D2
L
E
E2
SEE DETAIL A
1
e
b
2
A
A1
1
2
1
A3
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.200
0.300
0.008
0.012
D
1.900
2.100
0.075
0.083
D2
1.550
1.650
0.061
0.065
E
2.900
3.100
0.114
0.122
E2
1.650
1.750
0.065
0.069
e
L
0.500
0.350
0.020
0.450
0.014
0.018
W-Type 8L DFN 2x3 Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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DS6234A/B-00 January 2016