Materials Declaration Package Body Size LeadCount Option 6650 MQFP 10 X 10 x 2.0 (+3.2) 44 Pb-free Weight (g) 2.72 E-01 7.24 E-02 1.81 E-02 5.42 E-03 5.42 E-03 1.08 E-03 3.74 E-01 PPM 539459 143836 35959 10773 10773 2155 742954 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Draft IEC 62321. ICP-OES None Detected None Detected Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES None Detected None Detected Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MS. None Detected Draft IEC 62321. GC-MS. None Detected Weight (g) 1.00 E-01 3.12 E-03 6.73 E-04 1.58 E-04 1.04 E-01 PPM 198865 6200 1336 313 206714 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. UV-VIS. None Detected None Detected Draft IEC 62321. GC-MS. Draft IEC 62321. GC-MS. None Detected Internal Leadframe Plating % of Plating 100.0 Weight (g) 1.03 E-03 PPM 2046 Sn External Leadframe Plating % of Plating 100.0 Weight (g) 6.18 E-03 PPM 12278 Au Bond Wires % of Wire 99.99 Weight (g) 9.11 E-04 PPM 1810 Si Chip % of Chip 100.0 Weight (g) 1.49 E-02 PPM 29565 Weight (g) 1.76 E-03 4.40 E-04 6.60 E-05 6.60 E-05 2.33 E-03 PPM 3496 874 131 131 4633 Item Silica Epoxy, Cresol Novolac Phenol Resin Antimony Trioxide Brominated Epoxy Resin Carbon Black Subtotal Item Cu Ni Si Mg Subtotal Ag Item 8361J Item Ag Epoxy resin Gamma Butyrolactone Curing agent & hardener Subtotal Molding Compound % of Compound 72.61 19.36 4.84 1.45 1.45 0.29 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Die Attach % of Die Attach 75.5 18.9 2.8 2.8 Package Totals Weight (g) PPM 1000000 5.03 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6650 8361J STS-S-B S-01 Materials Declaration Package Body Size LeadCount Option Item Silica Epoxy, Cresol Novolac Phenol Resin Antimony Trioxide Brominated Epoxy Resin Carbon Black Subtotal Item Cu Ni Si Mg Subtotal MQFP 10 X 10 x 2.0 (+3.2) 44 Sn/Pb Molding Compound % of Compound 72.61 19.36 4.84 1.45 1.45 0.29 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Weight (g) 2.72 E-01 7.24 E-02 1.81 E-02 5.42 E-03 5.42 E-03 1.08 E-03 3.74 E-01 PPM 539459 143836 35959 10773 10773 2155 742954 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Draft IEC 62321. ICP-OES None Detected None Detected Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES None Detected None Detected Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MS. None Detected Draft IEC 62321. GC-MS. None Detected Weight (g) 1.00 E-01 3.12 E-03 6.73 E-04 1.58 E-04 1.04 E-01 PPM 198865 6200 1336 313 206714 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. UV-VIS. None Detected None Detected Draft IEC 62321. GC-MS. Draft IEC 62321. GC-MS. None Detected Weight (g) 1.03 E-03 PPM Ag Internal Leadframe Plating % of Plating 100.0 Sn Pb Subtotal External Leadframe Plating % of Plating Weight (g) 85 5.25 E-03 15 9.27 E-04 6.18 E-03 Item 2046 PPM 10436 1842 12278 Bond Wires % of Wire 99.99 Weight (g) 9.11 E-04 PPM Au Weight (g) 1.49 E-02 PPM Si Chip % of Chip 100.0 Weight (g) 1.76 E-03 4.40 E-04 6.60 E-05 6.60 E-05 2.33 E-03 PPM Item Ag Epoxy resin Gamma Butyrolactone Curing agent & hardener Subtotal Die Attach % of Die Attach 75.5 18.9 2.8 2.8 Package Totals Weight (g) 5.03 E-01 1810 29565 3496 874 131 131 4633 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary STS-S-A S-02 Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy & Phenol Resin Carbon black Subtotal MQFP 10 X 10 x 2.0 (+3.2) 44 Pb-free, Halide-free Molding Compound % of Compound 86.91 12.78 0.31 Weight (g) 3.25 E-01 4.78 E-02 1.16 E-03 3.74 E-01 PPM 639326 94012 2280 735618 Weight (g) 1.00 E-01 3.12 E-03 6.76 E-04 1.56 E-04 1.04 E-01 PPM 196895 6140 1330 307 204673 Internal Leadframe Plating % of Plating 100.0 Weight (g) 1.03 E-03 PPM 2026 Sn External Leadframe Plating % of Plating 100.0 Weight (g) 6.15 E-03 PPM 12091 Au Bond Wires % of Wire 99.99 Weight (g) 1.78 E-03 PPM 3493 Si Chip % of Chip 100.0 Weight (g) 1.85 E-02 PPM 36396 Weight (g) 2.19 E-03 5.47 E-04 8.20 E-05 8.20 E-05 2.90 E-03 PPM 4304 1076 161 161 5702 Item Cu Ni Si Mg Subtotal Ag Item Item Ag Epoxy resin Gamma Butyrolactone Curing agent & hardener Subtotal Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Die Attach % of Die Attach 75.5 18.9 2.8 2.8 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. UV-VIS. None Detected Draft IEC 62321. GC-MS. None Detected Draft IEC 62321. GC-MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. UV-VIS. None Detected Draft IEC 62321. GC-MS. None Detected Draft IEC 62321. GC-MS. STS-S-N Package Totals Weight (g) PPM 1000000 5.08 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary S-03 Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy & Phenol Resin Carbon black Subtotal Item Cu Ni Si Mg Subtotal MQFP 10 X 10 x 2.0 (+3.2) 44 with Pb, Halide-free Molding Compound % of Compound 86.91 12.78 0.31 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Internal Leadframe Plating % of Plating 100.0 Ag Item Sn Pb Subtotal External Leadframe Plating % of Plating 85 15 Weight (g) 3.25 E-01 4.78 E-02 1.16 E-03 3.74 E-01 PPM 639326 94012 2280 735618 Weight (g) 1.00 E-01 3.12 E-03 6.76 E-04 1.56 E-04 1.04 E-01 PPM 196895 6140 1330 307 204673 Weight (g) 1.03 E-03 PPM Weight (g) 5.22 E-03 9.22 E-04 6.15 E-03 PPM 2026 Bond Wires % of Wire 99.99 Weight (g) 1.78 E-03 PPM Weight (g) 1.85 E-02 PPM Si Chip % of Chip 100.0 Weight (g) 2.19 E-03 5.47 E-04 8.20 E-05 8.20 E-05 2.90 E-03 PPM Item Ag Epoxy resin Gamma Butyrolactone Curing agent & hardener Subtotal Package Totals Weight (g) 5.08 E-01 Molding Compound Method PPM None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. UV-VIS. None Detected Draft IEC 62321. GC-MS. None Detected Draft IEC 62321. GC-MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. ICP-OES None Detected Draft IEC 62321. UV-VIS. None Detected Draft IEC 62321. GC-MS. None Detected Draft IEC 62321. GC-MS. 10278 1814 12091 Au Die Attach % of Die Attach 75.5 18.9 2.8 2.8 Item Pb Cd Hg Cr+6 PBB PBDE 3493 36396 4304 1076 161 161 5702 PPM 1000000 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary STS-S-M S-04