NTE2918 MOSFET P−Ch, Enhancement Mode High Speed Switch TO220 Type Package Features: D Dynamic dv/dt Rating D +175C Operating Temperature D Fast Switching D Fully Avalanche Rated D G S Absolute Maximum Ratings: Continuous Drain Current (VGS = −10V), ID TC = +25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −31A TC = +100C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −22A Pulsed Drain Current (Note 1), IDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −110A Power Dissipation (TC = +25C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110W Derate Linearly Above 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.71W/C Gate−to−Source Voltage, VGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Single Pulse Avalanche Energy (Note 2), EAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280mJ Avalanche Current (Note 1), IAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −16A Repetitive Avalanche Energy (Note 1), EAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11mJ Peak Diode Recovery dv/dt (Note 3), dv/dt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −5.0V/ns Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55 to +175C Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55 to +175C Lead Temperature (During Soldering, 1.6mm from case for 10sec), TL . . . . . . . . . . . . . . . . . +300C Mounting Torque (6−32 or M3 Screw) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 lbfin (1.1Nm) Thermal Resistance, Junction−to−Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4C/W Thermal Resistance, Junction−to−Ambient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62C/W Typical Thermal Resistance, Case−to−Sink (Flat, Greased Surface), RthCS . . . . . . . . . . . . 0.5C/W Note Note Note Note 1. 2. 3. 4. Repetitive rating; pulse width limited by maximum junction temperature. VDD = −25V, starting TJ = +25C, L = 2.1mH, RG = 25 , IAS = −16A ISD −16A, di/dt −280A/s, VDD −55V, TJ +175C Pules Width 300s, Duty Cycle 2%. Electrical Characteristics: (TJ = +25C unless otherwise specified) Parameter Symbol Test Conditions Drain−to−Source Breakdown Voltage V(BR)DSS Breakdown Voltage Temp. Coefficient V(BR)DSS Reference to +25C, ID = −1mA TJ VGS = 0V, ID = −250A Min Typ Max Unit −55 − − V − -0.034 − V/C − − 0.06 Static Drain−to−Source On−Resistance RDS(on) VGS = −10V, ID = −16A, Note 4 Gate Threshold Voltage VGS(th) VDS = VGS, ID = −250A −2.0 − −4.0 V gfs VDS = −25V, ID = −16A 8.0 − − mhos IDSS VDS = −55V, VGS = 0V − − −25 A VDS = −44V, VGS = 0V, TJ = +125C − − −250 A Forward Transconductance Drain−to−Source Leakage Current Gate−to−Source Forward Leakage IGSS VGS = 20V − − 100 nA Gate−to−Source Reverse Leakage IGSS VGS = −20V − − −100 nA ID = −16A, VDS = −44V, VGS = −10V, Note 4 − − 63 nC − − 13 nC − − 29 nC − 14 − ns − 66 − ns td(off) − 39 − ns tf − 63 − ns Between lead, .250in. (6.0) mm from package and center of die contact − 4.5 − nH − 7.5 − nH VGS = 0V, VDS = −25V, f = 1MHz − 1200 − pF Total Gate Charge Qg Gate−to−Source Charge Qgs Gate−to−Drain (“Miller”) Charge Qgd Turn−On Delay Time td(on) Rise Time tr Turn−Off Delay Time Fall Time VDD = −28V, ID = −16A, RG = 6.8 , RD = 1.6 , Note 4 Internal Drain Inductance LD Internal Source Inductance LS Input Capacitance Ciss Output Capacitance Coss − 520 − pF Reverse Transfer Capacitance Crss − 250 − pF Min Typ Max Unit − − −31 A Source−Drain Ratings and Characteristics: Parameter Symbol Continuous Source Current (Body Diode) IS Test Conditions Pulsed Source Current (Body Diode) ISM Note 1 − − −110 A Diode Forward Voltage VSD TJ = +25C, IS = −16A, VGS = 0V, Note 4 − − −1.3 V Reverse Recovery Time trr − 71 110 ns Reverse Recovery Charge Qrr TJ = +25C, IF = −16A, di/dt = −100A/s, Note 4 − 170 250 nC Note 1. Repetitive rating; pulse width limited by maximum junction temperature. Note 4. Pulse width 300s; duty cycle 2%. .420 (10.67) Max .110 (2.79) .147 (3.75) Dia Max .500 (12.7) Max .250 (6.35) Max .500 (12.7) Min .070 (1.78) Max Gate .100 (2.54) Source Drain/Tab