WFF5N65L Product Description Silicon N-Channel MOSFET Features D � 4.5A,650V,RDS(on)(Max2.8Ω)@VGS=10V � Ultra-low Gate charge(Typical 14.5nC) � Fast Switching Capability � 100%Avalanche Tested � Enhanced EMI capability � Maximum Junction Temperature Range(150℃) G S General Description This Power MOSFET is N channel enhanced high voltage power MOS field effect transistor fabrication by F-CellTM planar high pressure VDMOS process technology. this product have lower resistance,Superior switching performance and high EAS capability. The product can be widely used in AC-DC switching power supply, DC-DC power converter, and high H bridge PWM motor drive. Absolute Maximum Ratings Symbol VDSS Parameter Value Units Drain Source Voltage 650 V Continuous Drain Current(@Tc=25℃) 4.5* A Continuous Drain Current(@Tc=100℃) 2.5* A 16 A ±30 V ID IDM Drain Current Pulsed (Note1) VGS Gate to Source Voltage EAS Single Pulsed Avalanche Energy (Note2) 200 mJ EAR Repetitive Avalanche Energy (Note1) 14 mJ 30 W 0.24 W/℃ -55~150 ℃ Total Power Dissipation(@Tc=25℃) PD Derating Factor above 25℃ TJ,Tstg Junction and Storage Temperature Thermal Characteristics Value Symbol Parameter Min Typ Max Units RQJC Thermal Resistance , Junction -to -Case - - 4.17 ℃/W RQJA Thermal Resistance , Junction-to -Ambient - - 62.5 ℃/W WT-F114-Rev.A0 Nov 2015(F0) WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS Copyright@Winsemi Microelectronics Co., Ltd., All right reserved. WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS 1115 WFF5N65L Product Description Silicon N-Channel MOSFET Electrical Characteristics(Tc=25℃) Characteristics Symbol Gate leakage current Gate-source breakdown voltage Drain Cut -off current Test Condition Min Type Max Unit IGSS VGS=±30V,VDS=0V - - ±100 nA V(BR)GSS IG=±10 µA,VDS=0V ±30 - - V VDS=650V,VGS=0V - - 1.0 µA VDS=500V,Tc=125℃ - - 100 µA IDSS Drain -source breakdown voltage V(BR)DSS ID=250 µA,VGS=0V 650 - - V Gate threshold voltage VGS(th) VDS=VGS,ID=250 µA 2 - 4 V Drain -source ON resistance RDS(ON) VGS=10V,ID=2.0A - 2.4 2.8 Ω Forward Transconductance gfs VDS=15V,ID=2.0A - 3.5 - S Input capacitance Ciss VDS=25V, - 611 - Reverse transfer capacitance Crss VGS=0V, - 3.6 - Output capacitance Coss f=1MHz - 54 - VDD=325V, - 16 - ID=4A - 14 - RG=10Ω - 11 - - 32 - - 14.5 - - 3.0 - - 6.5 - Turn-on Rise time tr Turn-on delay time Td(on) Switching time pF ns tf Turn-off Fall time (Note3,4) Td(off) Turn-off delay time Total gate charge(gate-source VDD=520V, Qg plus gate-drain) VGS=10V, nC Gate-source charge Qgs Gate-drain("miller") Charge Qgd ID=4A (Note3,4) Source-Drain Ratings and Characteristics(Ta=25℃) Characteristics Symbol Test Condition Min Type Max Unit Continuous drain reverse current IDR - - - 4 A Pulse drain reverse current IDRP - - - 16 A Forward voltage(diode) VDSF IDR=4A,VGS=0V - - 1.5 V Reverse recovery time trr - 256 - ns - 1.2 - µC - 9.4 - A IDR=4A,VGS=0V, Reverse recovery charge Qrr dIDR /dt =100 A /µs Reverse recovery current Irrm Note 1.Repeativity rating :pulse width limited by junction temperature 2.L=10mH IAS=6.3A,VDD=500V,RG=25Ω,Starting TJ=25℃ 3.Pulse Test:Pulse Width≤300us,Duty Cycle≤2% 4. Essentially independent of operating temperature. This transistor is an electrostatic sensitive device Please handle with caution WINSEMI MICROELECTRONICS www.winsemi.com WINSEMI MICROELECTRONICS Tel : +86-755-8250 6288 WINSEMI MICROELECTRONICS Fax : +86-755-8250 6299 WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS 2/8 WFF5N65L Product Description Silicon N-Channel MOSFET 8 9 .0 Notes : 1.250µs pulse test 2.Tc =25°C VG S =10V 6 7 .5 VG S =7V ID [A ] ID [A ] 6 .0 VG S =6V 4 4 .5 3 .0 VG S =5V 2 25°C 150°C VG S =4V 0 0 10 5 15 0 25 20 N o te s: 1 .2 5 0 µs p u l se te st 2 .V D S =5 0 V 1 .5 2 4 8 6 VD S [V ] 10 VG S [V ] Fig.2 Transfer Characteristics Fig.1 Output Characteristics 8 4 .0 7 6 5 I DR[A] RD S(ON)[Ω] 3 .5 3 .0 V GS=10V 4 25°C 3 2 .5 150°C 2 1 Note:Tc=25°C 2 .0 1 0 2 0 4 3 0 0 .2 0.4 0.6 I D [A] 0.8 1.0 1.2 VS D [V ] Fig.3 Drain to Source ON Resistance vs Drain Current Fig.4 Body Diode Transfer Characteristics 12 10000 Ciss=Cgs+Cgd(Cds=shorted) Coss=Cds+Cgd C rss= C gd 520V 10 1000 325V C is s 130V VGS (V) pF 8 100 6 C os s 4 10 2 Note: 1.VG S =0V 2.f=1MHz 1 0 .1 C rs s Note: I D=4.0A 0 10 1 0 100 3 V D S [V ] WINSEMI MICROELECTRONICS WINSEMI 12 15 Q g(nC) Fig.5 Capacitance vs Drain to source Voltage www.winsemi.com 9 6 MICROELECTRONICS Tel : +86-755-8250 6288 WINSEMI Fig.6 Gate Charge vs Gate to source Voltage MICROELECTRONICS Fax : +86-755-8250 6299 WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS 3/8 WFF5N65L Product Description Silicon N-Channel MOSFET 2 .5 1.15 2 .2 5 2 .0 RDS(O N) BVDSS 1.05 0.95 1 .7 5 1 .5 1 .2 5 0.85 1 .0 N ote: 1.V G S =0V 2.ID =250uA 0.75 -5 5 -3 0 20 -5 45 70 95 120 145 N ote: 1.V G S = 0V 2.I D= 2.0A 0 .7 5 0 .5 -5 0 170 0 50 TJ( ° C ) TJ ( ° C ) Fig.7 Breakdown Voltage vs Junction Temperature Fig.8 Drian to Source On-Resistance vs Junction Temperature 102 6 O p e ra t io n in Th is A re a is L im it e d b y RDS(ON) 10 150 100 5 1 100µs ID [A] I D[A] 4 1ms 10ms 100 3 DC 2 10 -1 No t e s: 1 1 .Tc= 2 5 °C 2 . T J =150°C 3.Si ngl e pul se 0 1 0 -2 100 1 01 1 03 1 02 0 25 50 V D S [V] 75 100 125 150 Tc( ° C ) Fig.9 Maximum Forward Bias Safe Operatiing Area Fig.10 Maximum Continuous Drain Current vs Case temperature ZθJC(t),Thermal Response 10 D = 0 .5 1 0 .2 0 .1 0 .0 5 0 .1 0 .0 2 0 .0 1 * N o te : 1.Duty Factor,D=t1/t2 2.T JM-T C=P DM* Z θJ C (t) Single pulse PD 0 .0 1 M t1 t2 0 .0 0 1 0.00001 0.0001 0 .0 0 1 0 .0 1 0 .1 1 10 100 1000 t1 Square Wave Pulse D uration[sec] Fig.11 Maximum Effective Thermal Impendance Junction to Case WINSEMI MICROELECTRONICS www.winsemi.com WINSEMI MICROELECTRONICS Tel : +86-755-8250 6288 WINSEMI MICROELECTRONICS Fax : +86-755-8250 6299 WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS 4/8 WFF5N65L Product Description Silicon N-Channel MOSFET 50K Ω 12V VG S Same type as D U T Qg 200nF 10V 300nF VD S VG S Qg s Qg d DUT 3m A Ch a rg e Fig.12 Gate Test circuit & Waveform VD S RG RL VD S 90% VD D VG S VG S DUT 10V 10% td(on) tr td(off) to n tf to f f Fig.13 Resistive Switching Test Circuit & Waveform L EA S = VD S B V DSS B V D S S - VD D B V DSS IA S ID RG VD D DUT 10V 1 L IA S 2 2 I D( t) VD S( t ) VD D tp tp Tim e Fig.14 Unclamped Inductive Switching Test Circuit & Waveform WINSEMI MICROELECTRONICS www.winsemi.com WINSEMI MICROELECTRONICS Tel : +86-755-8250 6288 WINSEMI MICROELECTRONICS Fax : +86-755-8250 6299 WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS 5/8 WFF5N65L Product Description Silicon N-Channel MOSFET DUT VD S IS D L Driver RG S am e Type as DUT VG S VD D dv/dt controlled by RG IS D conteolled by pulse period VG S D = (Driver) Gate Pulse Width Gate Pulse Period 10V IF M ,Body Diode Forward Current IS D di/dt (DUT) IR M Body Diode Reverse Current VD S (DUT) Body Diode Recovery dv/dt VD D VS D Body Diode Forward Voltage Drop Fig.15 Peak Diode Recovery dv/dt Test Circuit & Waveform WINSEMI MICROELECTRONICS www.winsemi.com WINSEMI MICROELECTRONICS Tel : +86-755-8250 6288 WINSEMI MICROELECTRONICS Fax : +86-755-8250 6299 WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS 6/8 WFF5N65L Product Description Silicon N-Channel MOSFET TO-220F Package Dimension U n it:m m E 符 号 Symbol M IN MAX A 4 .5 4 .9 B - 1 .4 7 b 0 .7 0 .9 c 0 .4 5 0 .6 D 1 5 .6 7 1 6 .0 7 E 9 .9 6 1 0 .3 6 Q F L2 D P e L B b C 2.54TYPE F 2 .3 4 2 .7 4 L 1 2 .5 8 1 3 .3 8 L2 3 .1 3 3 .3 3 ФP 3 .0 8 3 .2 8 Q 3 .2 3 .4 Q1 2 .5 6 2 .9 6 Q1 e A e WINSEMI MICROELECTRONICS www.winsemi.com WINSEMI MICROELECTRONICS Tel : +86-755-8250 6288 WINSEMI MICROELECTRONICS Fax : +86-755-8250 6299 WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS 7/8 WFF5N65L Product Description Silicon N-Channel MOSFET NOTE: 1.We strongly recommend customers check carefully on the trademark when buying our product, if there is any question, please don't be hesitate to contact us. 2.Please do not exceed the absolute maximum ratings of the device when circuit designing. 3.Winsemi Microelectronics Co., Ltd reserved the right to make changes in this specification sheet and is subject to change without prior notice. CONTACT: Winsemi Microelectronics Co., Ltd. ADD:Room 1002, East, Phase 2, HighTech Plaza,Tian-An Cyber Park,Che gong miao, FuTian, Shenzhen, P.R. China. Post Code : 518040 Tel : +86-755-8250 6288 FAX : +86-755-8250 6299 Web Site : www.winsemi.com WINSEMI MICROELECTRONICS www.winsemi.com WINSEMI MICROELECTRONICS Tel : +86-755-8250 6288 WINSEMI MICROELECTRONICS Fax : +86-755-8250 6299 WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS 8/8