V is h ay I n tertec h n o l o g y, I n c . AND TEC I INNOVAT O L OGY Using Thin Film Technology N HN PATTERN SUBSTRATES O 19 62-2012 Resistors - Vishay Electro-Films Application-Specific Pattern Substrates Vishay Electro-Films: Substrates and Pattern Substrates Vishay Electro-Films is a leading-edge manufacturer of thin film passive components and custom substrates. Vishay Electro-Films offers a wide variety of substrate choices – alumina, aluminum nitride, beryllium oxide, quartz, silicon, ferrites, titanates, and many metallization alternatives such as nichrome, tantalum nitride, titanium tungsten, copper, nickel, gold, and aluminum to meet application-specific demands. With its ability to integrate fine line patterns and multilayer structures into its manufacturing processes, Vishay Electro-Films is able to produce simple to complex designs in a timely manner. Vishay Electro-Films has one of the industry’s broadest line of thin film products, as well as a rapid prototyping service. Design If your design is complete and you would like to send us your files, or if you would like us to help you finalize your application design, please contact: Resources • For technical questions contact [email protected] • Sales Contacts: http://www.vishay.com/doc?99914 One of the World’s Largest Manufacturers of Discrete Semiconductors and Passive Components Capabilities 1/4 VMN-PL0011-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V is h ay I n tertec h n o l o g y, I n c . AND TEC I INNOVAT O L OGY Using Thin Film Technology N HN PATTERN SUBSTRATES O 19 62-2012 About Vishay Electro-Films Electro-Films, founded in 1974, became the industry leader in custom thin film substrate production for the hybrid circuit and microwave industries. Vishay Intertechnology, a leading global manufacturer of electronic components, acquired Electro-Films in 2000. Since that time, Vishay has invested over $50 million to refurbish the physical plant and purchase state-of-the-art processing equipment. The 57,000-square-foot facility contains 11,400 square feet of clean rooms, including class 100 and class 1000 clean rooms. Vishay Electro-Films is an ISO 9001:2000-certified facility serving commercial, medical, microwave, telecommunications, and defense industry manufacturers worldwide. Resistors - Vishay Electro-Films Features • Rapid prototyping / full in-house capabilities • Large-volume production • Multiple substrate material options • Complete thin film services Substrate Characteristics Material Uses Benefits Standard Thickness* MILS (mm) Alumina (Al2O3) Standard hybrid Medium-power microwave Most cost-effective choice 10, 15, 25 (0.25, 0.38, 0.63) Silicon (Si) DC circuit–medium/high power Best choice for high-density fine-line interconnects 15 (0.38) Quartz (SiO2) Microwave/millimeter-wave low power/low shunt capacitance Good for high-density patterns Low loss tangent/low CTE 10, 20, 25 (0.25, 0.5, 0.63) Aluminum Nitride (AlN) High-power microwave Deal CTE match to silicon devices High thermal conductivity 20, 25, 50 (0.5, 0.63, 1.3) Beryllium Oxide (BeO) High-power DC/RF microwave Highest thermal conductivity 15, 25 (0.38, 0.63) Sapphire Millimeter-wave/optical circuits with special electrical or mechanical requirements Low loss tangent Optical surface finish Special Titanates RF/microwave with high Q Dielectric properties Special Ferrites Circulators/isolators Magnetic sensitivity Special * Additional thicknesses available upon request. Capabilities 2/4 VMN-PL0011-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V is h ay I n tertec h n o l o g y, I n c . AND TEC I INNOVAT O L OGY Using Thin Film Technology N HN PATTERN SUBSTRATES O 19 62-2012 Metallization Capabilities Resistors - Vishay Electro-Films Sputtered Materials Material Uses Notes Tantalum Nitride (Ta2N) Resistor 10-250 ohms/square Nichrome (NiCr) Resistor 10-250 ohms/square Chromium Oxide (Cermet) Resistor Up to 500 ohms/square Chromium Silicon (CrSi) Resistor Up to 500 ohms/square Titanium Tungsten (TiW) Barrier/adhesion 500-1000 Angstrom typical thickness Gold (Au) Adhesion 4-12 micro-inches typical thickness Palladium (Pd) Adhesion Solderable Nickel (Ni) Adhesion Solderable Gold/Tin (Au/Sn) (80/20) Contact metallization Eutectic die attach Aluminum (Al) Contact metallization 12,000 Angstrom typical thickness Copper (Cu) Contact metallization 500-1000 Angstrom typical thickness Plated Materials Material Uses Notes Gold (Au) Contact metallization 100 micro-inches typical thickness Nickel (Ni) Solderable 20-60 micro-inches typical thickness Copper (Cu) Thermal management Thickness up to 0.005 inches Dimensional Capabilities Conductor line width 0.001 inches Conductor line thickness 50 to 300 micro-inches standard, up to 5 mils custom Line width tolerance 0.0001 inches at 150 micro-inches thickness Through-hole minimum diameter 0.005 inches, dependent on substrate thickness Metallized hole diameter to substrate thickness ratio 0.8 minimum Through-hole tolerance: diameter and position +/-0.002 inches Front-to-back alignment +/-0.002 inches Process Capabilities Custom CO2 laser shaping Au or Cu filled vias (0.007 to 0.020 inches diameter) Lange couples with polyimide or air bridges Multilayer metal crossovers Wraparound edge metallization Two-sided metallization Solder balls High aspect ratio structures Capabilities 3/4 VMN-PL0011-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 V is h ay I n tertec h n o l o g y, I n c . I INNOVAT AND TEC O L OGY 19 62-2012 Resistors - Vishay Electro-Films Using Thin Film Technology N HN PATTERN SUBSTRATES O Capabilities 4/4 VMN-PL0011-1204 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000