Product Overview

V I S H AY I N T E R T E C H N O L O G Y, I N C .
OPTOELECTRONICS
Infrared Emitters
The Aging of Infrared Emitter Components
INTRODUCTION
Over its lifetime, an infrared emitter gradually loses its radiant power. This type of aging or degradation
has three main causes:
–– Mechanical stress deforms the crystal structure, causing loss of efficiency
–– Delamination occurs between epoxy and chip, causing loss of optical coupling
–– Thermal stress inflicts damage on the crystal structure
The rate of device aging is determined by:
–– Chip technology: GaAIAs Double Hetero (DH), bulk, and surface emitter technologies result in
lower rates, while GaAIAs and GaAs technologies result in higher rates
of aging
–– Package technology: metal can and chip on board (COB) packaging technologies result in
lower rates, and epoxy packaging technologies result in higher rates of aging
Chip size: The smaller the chip, the higher the current density. A higher current density results in faster aging.
RESOURCES
• Infrared Emitter Selector Guide: http://www.vishay.com/doc?49495
• Optoelectronis Portfolio: http://www.vishay.com/optoelectronics/
• For technical questions, contact [email protected]
PRODUCT LITERATURE
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V I S H AY I N T E R T E C H N O L O G Y, I N C .
OPTOELECTRONICS
Infrared Emitters
DEVICE AGING AND DEVICE SELECTION
Degradation rate is an important feature to consider when selecting an emitter. State-of-the-art chip
technologies and high quality standards in the assembly process are essential to maintain a low
degradation rate. Aging behavior varies, moreover, for the various infrared chip technologies. For example, DH, bulk, and surface emitter chips age slowly even when used in applications with high duty
cycles and are thus best suited for long-term DC mode applications. GaAIAs and GaAs chips typically
degrade more depending on their usage. This combined with their inherent outstanding radiant power
makes them ideal for remote control (RC) applications, which of course have extremely low duty cycles.
In the typical RC system in fact, the expected useful lifetime of the GaAIAs/GaAs emitter chips averages
10 or more years.
APPLICATIONS
––
––
––
––
Data Transmission
IrDC
Photo Interrupter
IR Curtain
––
––
––
––
Encoder
DC Mode
Remote Control
Low Duty Cycle
–– Burst Mode
–– Pulse Mode
–– Keyless Entry
TYPICAL DEGRADATION OF RADIANT POWER AFTER 4000 h OPERATION
Comparison of Major IR Emitter Chip Technologies Assembled Using T-1 3/4’’ Plastic Package
Relative Radiant Power
100
95
90
85
80
75
Surface Emitter
Bulk / DH
GaAs
GaAlAs
IR Emitter Chip Technologies
PRODUCT LITERATURE
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V I S H AY I N T E R T E C H N O L O G Y, I N C .
OPTOELECTRONICS
Infrared Emitters
PACKAGE FORMS
PRODUCT LITERATURE
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V I S H AY I N T E R T E C H N O L O G Y, I N C .
OPTOELECTRONICS
Infrared Emitters
CHIP TECHNOLOGY, DEVICES AND DEDICATED APPLICATION
Technology
DH
GaAs
GaAIAs
Bulk
Emitter (*)
Surface
Emitter
Performance @ Test Condition IF = 100 mA
Typ. 4000 h-Degradation
-5%
-7%
-15%
-5%
-5%
Radiant Power
45 mW
15 mW
25 mW
40 mW
55 mW
Cut-off Frequency
12 MHz
450 kHz
600 kHz
23 MHz
35 MHz
Rise/Fall Time tr, tf
30 ns
800 ns
600 ns
15 ns
10 ns
Wavelength
830 ... 890 nm
950 nm
870 nm
940 nm
850 nm / 940 nm
T1
-
TSUS4xxx
TSHA4400
VSLB3940
VSLY3850
T1 3/4
TSHF5xxx /
TSFF5xxx /
TSHG5xxx
TSUS5xxx
TSHA5xxx
VSLB3940
VSLY5850
Side View / SMD
TSSF4500
TSKS5400
-
VSMB2940SLX01
VSMY2853SL
Dome SMD
VSMF289x /
VSMG2xxx
-
-
VSMB2020X01
VSMY2850
PLCC-2
VSMF3710 /
VSMF4710 /
VSMG3700
VSMS3700
-
VSMB3940
VSMY3850
0805
-
-
-
VSMB1940
VSMY1850
Metal Can
-
TSTS7xxx
TSTA7xxx
-
-
High Reliability
High Reliability
Standard
Application
High Reliability
High Reliability
Data
Transmission
Photo Interrupter
Keyless Entry
Data
Transmission
Data
Transmission
IrDC
IR Curtain
Low Duty Cycle
IrDC
IrDC
Encoder
Encoder
Burst Mode
Encoder
Encoder
DC Mode
DC Mode
Pulse Mode
DC Mode
DC Mode
Product Series
Package Forms
APPLICATIONS
(*) and GaAlAs MQW
PRODUCT LITERATURE
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V I S H AY I N T E R T E C H N O L O G Y, I N C .
OPTOELECTRONICS
Infrared Emitters
SEMICONDUCTORS
PASSIVE COMPONENTS
MOSFETs Segment
Resistors and Inductors Segment
MOSFETs
Low-Voltage TrenchFET® Power MOSFETs
Medium-Voltage Power MOSFETs
High-Voltage Planar MOSFETs
High-Voltage Super Junction MOSFETs
Automotive-Grade MOSFETs
ICs
Power Management and Power Control ICs
Smart Load Switches
Analog Switches and Multiplexers
Film Resistors
Metal Film Resistors
Thin Film Resistors
Thick Film Resistors
Power Thick Film Resistors
Metal Oxide Film Resistors
Carbon Film Resistors
Wirewound Resistors
Vitreous, Cemented, and Housed Resistors
Braking and Neutral Grounding Resistors
Custom Load Banks
Power Metal Strip® Resistors
Battery Management Shunts
Crowbar and Steel Blade Resistors
Thermo Fuses
Chip Fuses
Pyrotechnic Initiators/Igniters
Variable Resistors
Cermet Variable Resistors
Wirewound Variable Resistors
Conductive Plastic Variable Resistors
Contactless Potentiometers
Hall Effect Position Sensors
Precision Magnetic Encoders
Networks/Arrays
Non-Linear Resistors
NTC Thermistors
PTC Thermistors
Varistors
Magnetics
Inductors
Wireless Charging Coils
Transformers
Connectors
Diodes Segment
Rectifiers
Schottky Rectifiers
Ultrafast Recovery Rectifiers
Standard and Fast Recovery Rectifiers
High-Power Rectifiers/Diodes
Bridge Rectifiers
Small-Signal Diodes
Schottky and Switching Diodes
Zener Diodes
Tuner/Capacitance Diodes
Bandswitching Diodes
RF PIN Diodes
Protection Diodes
TVS Diodes or TRANSZORB®
(unidirectional, bidirectional)
ESD Protection Diodes (including arrays)
Thyristors/SCRs
Phase-Control Thyristors
Fast Thyristors
IGBTs
Power Modules
Input Modules (diodes and thyristors)
Output and Switching Modules (contain
MOSFETs,
IGBTs, and diodes)
Custom Modules
Optoelectronic Components Segment
Infrared Emitters and Detectors
Optical Sensors
Infrared Remote Control Receivers
Optocouplers
Phototransistor, Photodarlington
Linear
Phototriac
High-Speed
IGBT and MOSFET Driver
Solid-State Relays
LEDs and 7-Segment Displays
Infrared Data Transceiver Modules
Custom Products
PRODUCT LITERATURE
Capacitors Segment
Tantalum Capacitors
Molded Chip Tantalum Capacitors
Molded Chip Polymer Tantalum Capacitors
Coated Chip Tantalum Capacitors
Solid Through-Hole Tantalum Capacitors
Wet Tantalum Capacitors
Ceramic Capacitors
Multilayer Chip Capacitors
Multilayer Chip RF Capacitors
Disc Capacitors
Film Capacitors
Power Capacitors
Heavy-Current Capacitors
Aluminum Capacitors
ENYCAP™ Energy Storage Capacitors
5/5
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VMN-PL0486-1507
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