VSLY3850 Datasheet

VSLY3850
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diode, 850 nm,
Surface Emitter Technology
FEATURES
• Package type: leaded
• Package form: T-1, clear epoxy
• Dimensions: Ø 3 mm
• Peak wavelength: λp = 850 nm
• High speed
• High radiant power
• High radiant intensity
• Angle of half intensity: ϕ = ± 18°
94 8636
• Suitable for high pulse current operation
• Good spectral matching with CMOS cameras
DESCRIPTION
SurfLightTM
As part of the
portfolio, the VSLY3850 is an
infrared, 850 nm emitting diode based on GaAlAs surface
emitter chip technology with extreme high radiant intensity,
high optical power and high speed, molded in a clear,
untinted T1 plastic package.
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Infrared radiation source for operation with CMOS
cameras
• High speed IR data transmission
• 3D TV application
• Light curtains
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
ϕ (deg)
λp (nm)
tr (ns)
70
± 18
850
10
VSLY3850
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
VSLY3850
VSLY3850-ASZ
PACKAGING
REMARKS
PACKAGE FORM
Bulk
MOQ: 5000 pcs, 5000 pcs/bulk
T-1
Ammopack
MOQ: 10 000 pcs, 2000 pcs/box
T-1
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
VALUE
Reverse voltage
TEST CONDITION
VR
5
UNIT
V
Forward current
IF
100
mA
mA
Peak forward current
tp/T = 0.5, tp = 100 μs
IFM
200
Surge forward current
tp = 100 μs
IFSM
1
A
PV
190
mW
°C
Power dissipation
Junction temperature
Tj
100
Operating temperature range
Tamb
-40 to +85
°C
Storage temperature range
Tstg
-40 to +100
°C
t ≤ 5 s, 2 mm from case
Tsd
260
°C
J-STD-051, leads 7 mm, soldered on PCB
RthJA
300
K/W
Soldering temperature
Thermal resistance junction / ambient
Rev. 1.4, 14-Jan-16
Document Number: 82395
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSLY3850
www.vishay.com
Vishay Semiconductors
200
120
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
160
140
120
100
RthJA = 300 K/W
80
60
40
100
80
60
RthJA = 300 K/W
40
20
20
0
0
0
10
22322
20
30
40
50
60
70 80
90 100
0
Tamb - Ambient Temperature (°C)
10
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
22323
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
Temperature coefficient of VF
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
IF = 100 mA, tp = 20 ms
VF
-
1.65
1.9
V
IF = 1 A, tp = 100 μs
VF
-
2.9
-
V
IF = 1 mA
TKVF
-
-1.45
-
mV/K
IF = 10 mA
TKVF
-
-1.25
-
mV/K
Reverse current
Junction capacitance
IR
VR = 0 V, f = 1 MHz,
E = 0 mW/cm2
Not designed for reverse operation
-
35
70
105
mW/sr
-
600
-
mW/sr
φe
-
55
-
mW
IF = 1 mA
TKϕe
-
-0.35
-
%/K
ϕ
-
± 18
-
deg
Peak wavelength
IF = 30 mA
λp
840
850
870
nm
Spectral bandwidth
IF = 30 mA
Δλ
-
30
-
nm
Temperature coefficient of lp
IF = 30 mA
TKλp
-
0.25
-
nm
Rise time
IF = 100 mA, 20 % to 80 %
tr
-
10
-
ns
Fall time
IF = 100 mA, 20 % to 80 %
tf
-
10
-
ns
Radiant power
Temperature coefficient of radiant
power
-
IF = 100 mA, tp = 20 ms
Ie
IF = 1 A, tp = 100 μs
Ie
IF = 100 mA, tp = 20 ms
μA
125
Radiant intensity
CJ
UNIT
Angle of half intensity
Rev. 1.4, 14-Jan-16
pF
Document Number: 82395
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSLY3850
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
10
Radiant Power (mW)
1
0.1
10
1
e-
0.01
100
0.1
0.001
0
0.5
1
1.5
2
2.5
3
3.5
VF - Forward Voltage (V)
22097
1
Fig. 3 - Forward Current vs. Forward Voltage
1
Φe, rel - Relative Radiant Power
IF - Forward Current (mA)
0.02
0.05
0.1
0.2
0.5
100
0.01
16031
0.1
1
10
IF = 30 mA
0.75
0.5
0.25
0
650
100
tp - Pulse Duration (ms)
750
0°
Ie rel - Relative Radiant Intensity
Ie - Radiant Intensity (mW/sr)
100
10
tp = 100 µs
1
10°
20°
30°
40°
1.0
50°
0.9
60°
0.8
70°
80°
0.7
0.01
0.1
1
21355
0.6
0.4
0.2
0
IF - Forward Current (A)
Fig. 5 - Radiant Intensity vs. Forward Current
Rev. 1.4, 14-Jan-16
950
Fig. 7 - Relative Radiant Power vs. Wavelength
1000
21951
850
λ - Wavelength (nm)
21776-1
Fig. 4 - Pulse Forward Current vs. Pulse Duration
0.1
0.001
1000
Fig. 6 - Radiant Power vs. Forward Current
Tamb < 50 °C
tp/T = 0.01
1000
10
100
IF - Forward Current (mA)
16971
ϕ - Angular Displacement
IF - Forward Current (A)
tp = 100 µs
Fig. 8 - Relative Radiant Intensity vs. Angular Displacement
Document Number: 82395
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSLY3850
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
A
< 0.6
(2.5)
3.4 ± 0.15
R1.4 (sphere)
AREA NOT PLANE
5.8 ± 0.3
34.4 ± 0.5
4.4 ± 0.3
3.2 ± 0.15
C
Ø 2.9 ± 0.1
1.5 ± 0.5
+ 0.15
0.5
+ 0.2
- 0.1
0.4 - 0.05
2.54 nom.
technical drawings
according to DIN
specifications
Drawing-No.: 6.544-5264.01-4
Issue: 4; 28.07.14
Rev. 1.4, 14-Jan-16
Document Number: 82395
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 02-Oct-12
1
Document Number: 91000