VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology VSMY2943RG FEATURES VSMY2943G • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.55 • Peak wavelength: λp = 940 nm • High reliability • High radiant power • Very high radiant intensity • Angle of half intensity: ϕ = ± 28° DESCRIPTION • Suitable for high pulse current operation SurfLightTM As part of the portfolio, the VSMY2943 series are infrared, 940 nm emitting diodes based on GaAlAs surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). • Terminal configurations: gullwing or reverse gullwing • Package matches with detector VEMD2503X01 series • Floor life: 4 weeks, MSL 2a, acc. J-STD-020 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Miniature light barrier • Photointerrupters • Optical switch • Emitter source for proximity sensors • IR illumination PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns) VSMY2943RG 35 ± 28 940 10 VSMY2943G 35 ± 28 940 10 Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY2943RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMY2943G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note • MOQ: minimum order quantity Rev. 1.0, 31-Aug-15 Document Number: 84252 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1 A PV 200 mW Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C Storage temperature range Soldering temperature -40 to +100 °C Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W 200 100 IF - Forward Current (mA) PV - Power Dissipation (mW) Thermal resistance junction/ambient Tstg Acc. figure 7, J-STD-020 150 RthJA = 250 K/W 100 50 0 80 60 RthJA = 250 K/W 40 20 0 0 20 40 60 80 0 100 20 Tamb - Ambient Temperature (°C) 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL MIN. TYP. MAX. IF = 100 mA, tp = 20 ms VF - 1.55 2.0 V IF = 1 A, tp = 100 μs VF - 2.65 - V IF = 100 mA TKVF - -2.1 - mV/K Reverse current Junction capacitance Radiant intensity Radiant power Temperature coefficient of radiant power IR VR = 0 V, f = 1 MHz, E = 0 mW/cm2 IF = 100 mA, tp = 20 ms not designed for reverse operation UNIT μA CJ - 125 - pF Ie 20 35 65 mW/sr IF = 1 A, tp = 100 μs Ie - 300 - mW/sr IF = 100 mA, tp = 20 ms φe - 55 - mW IF = 100 mA TKφe - -0.2 - %/K ϕ - ± 28 - deg nm Angle of half intensity Peak wavelength IF = 100 mA λp 920 940 960 Spectral bandwidth IF = 30 mA Δλ - 40 - nm Temperature coefficient of λp IF = 30 mA TKλp - 0.25 - nm/K Rise time IF = 100 mA, 20 % to 80 % tr - 10 - ns Fall time IF = 100 mA, 20 % to 80 % tf - 10 - ns Rev. 1.0, 31-Aug-15 Document Number: 84252 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1 0.1 0.01 0.001 0.5 1 1.5 2 2.5 3 IF = 100 mA 90 80 70 60 50 40 30 20 10 0 800 3.5 VF - Forward Voltage (V) 22097 850 900 950 1000 λ - Wavelength (nm) Fig. 3 - Forward Current vs. Forward Voltage Fig. 5 - Relative Radiant Power vs. Wavelength 0° 10° 20° 1000 Ie rel - Relative Radiant Intensity 30° Ie - Radiant Intensity (mW/sr) tp = 100 µs 100 10 1 0.1 0.001 0.01 0.1 SOLDER PROFILE Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 80° 0.6 0.4 0.2 0 Fig. 6 - Relative Radiant Intensity vs. Angular Displacement Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: max. 120 s max. 100 s Floor life: 4 weeks 100 max. ramp down 6 °C/s 0 100 150 Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. max. ramp up 3 °C/s 200 250 300 Time (s) Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.0, 31-Aug-15 70° 0.7 max. 30 s 150 19841 60° FLOOR LIFE 200 50 50° 0.8 DRYPACK 300 0 0.9 22688 Fig. 4 - Radiant Intensity vs. Forward Current 50 40° 1.0 1 IF - Forward Current (A) 250 1050 ϕ - Angular Displacement IF - Forward Current (A) tp = 100 µs 0 100 Ie, rel - Relative Radiant Intensity (%) 10 DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Document Number: 84252 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2943RG Ø 1.8 0.3 Z 1.6 2.55 0.05 ± 0.1 0.4 2.2 2.22 5.8 exposed copper Z 20:1 0.8 2.3 0.4 0.5 2.3 0.75 anode pin ID 1.7 cathode solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.2 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5409.03-4 Issue: 2; 24.09.14 Rev. 1.0, 31-Aug-15 Document Number: 84252 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2943G Ø 1.8 1.6 X 0.05 ± 0.1 2.55 0.3 0.4 2.22 2.2 4.2 exposed copper X 20:1 2.3 0.4 0.5 2.3 0.6 0.75 anode pin ID solder pad proposal acc. IPC 7351 cathode technical drawings according to DIN specifications Not indicated tolerances ± 0.2 2.45 5.15 Drawing-No.: 6.544-5408.03-4 Issue: 2; 24.09.14 Rev. 1.0, 31-Aug-15 Document Number: 84252 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2943RG Reel X unreel direction Ø 13 ± 0.5 Ø 330 ± 1 .5 ±0 Ø 62 ± 0.5 2.5 tape position coming out from reel 6000 pcs/reel technical drawings according to DIN specifications label posted here 12.4 ± 1.5 Leader and trailer tape empty (160 mm min.) parts mounted direction of pulling out Terminal position in tape Ø 1.55 ± 0.05 I Rev. 1.0, 31-Aug-15 X 2:1 2 ± 0.05 4 ± 0.1 12 5.5 ± 0.05 3.05 ± 0.1 Drawing-No.: 9.800-5100.02-4 Issue: 2; 24.09.14 4 ± 0.1 + 0.3 - 0.1 Lead I Lead II Device VSMB2943RGX01 VSMF2893RGX01 Cathode Anode VEMD2x03X01 VEMT2x03X01 Collector Emitter VSMY2853RG Anode Cathode VSMY2943RG 1.75 ± 0.1 empty (400 mm min.) II Document Number: 84252 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2943RG, VSMY2943G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2943G Reel X unreel direction Ø 13 ± 0.5 Ø 330 ± 1 .5 ±0 Ø 62 ± 0.5 2.5 tape position coming out from reel 6000 pcs/reel technical drawings according to DIN specifications label posted here 12.4 ± 1.5 Leader and trailer tape empty (160 mm min.) parts mounted direction of pulling out Terminal position in tape 2 ± 0.05 4 ± 0.1 12 5.5 ± 0.05 3.05 ± 0.1 Rev. 1.0, 31-Aug-15 X 2:1 + 0.3 - 0.1 Lead I Lead II Device VSMB2943GX01 VSMF2893GX01 Cathode Anode VEMD2x23X01 VEMT2x23X01 Collector Emitter VSMY2853G Anode Cathode VSMY2943G Drawing-No.: 9.800-5091.21-4 Issue: 2; 24.09.14 4 ± 0.1 Ø 1.55 ± 0.05 I 1.75 ± 0.1 empty (400 mm min.) II Document Number: 84252 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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