VSMB2948RG, VSMB2948G Datasheet

VSMB2948RG, VSMB2948G
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, MQW
VSMB2948RG
FEATURES
VSMB2948G
• Package type: surface mount
• Package form: GW, RGW
• Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.55
• Peak wavelength: p = 940 nm
• High reliability
• High radiant power
• High radiant intensity
DESCRIPTION
• Angle of half intensity:  = ± 25°
VSMB2948 series are infrared, 940 nm emitting diodes in
GaAlAs multi quantum well (MQW) technology with high
radiant power and high speed, molded in clear, untinted
plastic packages (with lens) for surface mounting (SMD).
• Low forward voltage
• Suitable for high pulse current operation
• Terminal configurations: gullwing or reserve gullwing
APPLICATIONS
• Package matches with detector VEMD2xx3X01 and
VEMT2xx3X01 series
• IR touch panels
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
• Remote control
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
 (deg)
p (nm)
tr (ns)
VSMB2948RG
20
± 25
940
15
VSMB2948G
20
± 25
940
15
Note
• Test conditions see table “Basic Characteristics“
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMB2948RG
Tape and reel
MOQ: 6000 pcs, 6000 pcs/reel
Reverse gullwing
VSMB2948G
Tape and reel
MOQ: 6000 pcs, 6000 pcs/reel
Gullwing
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
VALUE
Reverse voltage
VR
5
V
Forward current
IF
100
mA
IFSM
500
mA
PV
160
mW
Surge forward current
TEST CONDITION
tp = 100 μs
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
Rev. 1.0, 17-May-13
UNIT
Tj
100
°C
Tamb
- 40 to + 85
°C
°C
Tstg
- 40 to + 100
according figure 9, J-STD-020
Tsd
260
°C
J-STD-051, leads 7 mm, soldered on PCB
RthJA
250
K/W
Document Number: 84201
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948RG, VSMB2948G
www.vishay.com
Vishay Semiconductors
120
160
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
140
120
100
RthJA = 250 K/W
80
60
40
100
80
60
RthJA = 250 K/W
40
20
20
0
0
0
10
21343
20 30
40
50
60
70 80
90
0
100
21344
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
10
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
IF = 100 mA, tp = 20 ms
VF
1.15
1.35
1.6
V
IF = 500 mA, tp = 100 μs
VF
1.8
V
Temperature coefficient of VF
IF = 1 mA
TKVF
- 1.5
mV/K
Reverse current
VR = 5 V
Junction capacitance
Radiant intensity
VR = 0 V, f = 1 MHz, E = 0
IR
mW/cm2
IF = 100 mA, tp = 20 ms
CJ
Ie
10
μA
30
mW/sr
21
10
20
pF
IF = 500 mA, tp = 100 μs
Ie
90
mW/sr
IF = 100 mA, tp = 20 ms
e
40
mW
IF = 1 mA
TKe
- 1.1
%/K
Peak wavelength
IF = 30 mA
p
Spectral bandwidth
IF = 30 mA

25
nm
IF = 30 mA
TKp
0.25
nm/K
IF = 100 mA, 20 % to 80 %
tr
15
ns
IF = 100 mA, 20 % to 80 %
tf
15
ns
IDC = 70 mA, IAC = 30 mA pp
fc
23
MHz
Radiant power
Temperature coefficient of radiant power

Angle of half intensity
Temperature coefficient of p
Rise time
Fall time
Cut-off frequency
Rev. 1.0, 17-May-13
± 25
920
940
deg
960
nm
Document Number: 84201
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948RG, VSMB2948G
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
180
Ie rel - Relative Radiant Intensity (%)
1
0.1
0.01
140
120
IF = 100 mA
100
80
60
tp = 20 ms
40
0.001
0.5
0.9
0.7
1.1
1.3
1.5
- 60 - 40 - 20
1.9
1.7
VF - Forward Voltage (V)
0
20
60
80
100
Fig. 6 - Relative Radiant Intensity vs. Ambient Temperature
110
Φe rel - Relative Radiant Power (%)
100
108
106
104
102
IF = 100 mA
100
IF = 10 mA
98
tp = 20 ms
96
94
IF = 1 mA
92
90
- 40
- 20
0
20
40
60
80
70
60
50
40
30
20
10
0
840
100
Tamb - Ambient Temperature (°C)
21443
IF = 30 mA
80
90
880
920
960
1000
1040
λ - Wavelength (nm)
21445
Fig. 4 - Relative Forward Voltage vs. Ambient Temperature
Fig. 7 - Relative Radiant Power vs. Wavelength
0°
1000
10°
20°
30°
tp = 100 µs
Ie rel - Relative Radiant Intensity
Ie - Radiant Intensity (mW/sr)
40
Tamb - Ambient Temperature (°C)
21444
Fig. 3 - Forward Current vs. Forward Voltage
VF, rel - Relative Forward Voltage (%)
IF = 1 mA
160
100
10
1
0.1
0.001
0.01
0.1
IF - Forward Current (A)
Fig. 5 - Radiant Intensity vs. Forward Current
Rev. 1.0, 17-May-13
1
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
IF - Forward Current (A)
tp = 100 µs
80°
0.6
0.4
0.2
0
22690
Fig. 8 - Relative Radiant Intensity vs. Angular Displacement
Document Number: 84201
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948RG, VSMB2948G
www.vishay.com
Vishay Semiconductors
SOLDER PROFILE
DRYPACK
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
FLOOR LIFE
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label: 
Floor life: 4 weeks 
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
0
0
19841
50
100
150
200
250
300
Time (s)
Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
PACKAGE DIMENSIONS in millimeters: VSMB2948RG
Rev. 1.0, 17-May-13
Document Number: 84201
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948RG, VSMB2948G
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: VSMB2948G
Rev. 1.0, 17-May-13
Document Number: 84201
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948RG, VSMB2948G
www.vishay.com
Vishay Semiconductors
TAPING AND REEL DIMENSIONS in millimeters: VSMB2848RG
Rev. 1.0, 17-May-13
Document Number: 84201
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMB2948RG, VSMB2948G
www.vishay.com
Vishay Semiconductors
TAPING AND REEL DIMENSIONS in millimeters: VSMB2848G
Rev. 1.0, 17-May-13
Document Number: 84201
7
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000