VSMB294008RG, VSMB294008G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, MQW VSMB294008RG VSMB294008G FEATURES • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 • Peak wavelength: p = 940 nm • High reliability • High radiant power • High radiant intensity DESCRIPTION • Angle of half intensity: = ± 7° VSMB294008 series are infrared, 940 nm emitting diodes in GaAlAs multi quantum well (MQW) technology with high radiant power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). • Low forward voltage • Suitable for high pulse current operation • Terminal configurations: gullwing or reserve gullwing • Package matches with detector VEMD2000X01 series APPLICATIONS • Floor life: 4 weeks, MSL 2a, acc. J-STD-020 • Data transmission • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 • Miniature light barrier • Photointerrupters • Optical switch • Control and drive circuits • Shaft encoders PRODUCT SUMMARY Ie (mW/sr) (deg) P (nm) tr (ns) VSMB294008RG 70 ±7 940 15 VSMB294008G 70 ±7 940 15 COMPONENT Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMB294008RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMB294008G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note • MOQ: minimum order quantity ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage VR 5 V Forward current IF 100 mA IFSM 500 mA PV 160 mW °C Surge forward current tp = 100 μs Power dissipation Junction temperature Tj 100 Operating temperature range Tamb -40 to +85 °C Storage temperature range Tstg -40 to +100 °C according to fig. 10, J-STD-020 Tsd 260 °C J-STD-051, leads 7 mm, soldered on PCB RthJA 250 K/W Soldering temperature Thermal resistance junction/ambient Rev. 1.1, 19-Nov-14 Document Number: 84228 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB294008RG, VSMB294008G www.vishay.com Vishay Semiconductors 120 160 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 10 21343 20 30 40 50 60 70 80 90 0 100 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 10 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21344 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF Reverse current Junction capacitance Radiant intensity TEST CONDITION SYMBOL MIN. TYP. MAX. IF = 100 mA, tp = 20 ms VF 1.15 1.45 1.75 UNIT V IF = 500 mA, tp = 100 μs VF - 1.8 - V IF = 100 mA TKVF - -0.64 - mV/K VR = 5 V IR - - 10 μA VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ - 38 - pF IF = 100 mA, tp = 100 μs Ie 30 70 115 mW/sr IF = 500 mA, tp = 100 μs Ie - 260 - mW/sr IF = 100 mA, tp = 100 μs e - 40 - mW IF = 100 mA TKe - -0.43 - %/K - ±7 - deg Peak wavelength IF = 30 mA p 920 940 960 nm Spectral bandwidth IF = 30 mA - 25 - nm Radiant power Temperature coefficient of radiant power Angle of half intensity Temperature coefficient of p IF = 30 mA TKp - 0.25 - nm/K Rise time IF = 100 mA, 20 % to 80 % tr - 15 - ns Fall time IF = 100 mA, 20 % to 80 % tf - 15 - ns IDC = 70 mA, IAC = 30 mA pp fc - 23 - MHz Cut-off frequency Rev. 1.1, 19-Nov-14 Document Number: 84228 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB294008RG, VSMB294008G www.vishay.com Vishay Semiconductors TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 tp = 100 μs Ie - Radiant Intensity (mW/sr) IF - Forward Current (mA) 1000 tp = 100 μs 100 10 100 10 1 1 0.1 1.0 1.2 1.4 1.6 1.8 2.0 1 VF - Forward Voltage (V) IF = 100 mA tp = 20 ms 1.43 1.41 1.39 1.37 1.35 0 20 40 60 80 130 IF = 100 mA tp = 20 ms 120 110 100 90 80 70 60 -50 100 Tamb - Ambient Temperature (°C) -25 0 25 50 75 100 Tamb - Ambient Temperature (°C) Fig. 4 - Forward Voltage vs. Ambient Temperature Fig. 7 - Radiant Intensity vs. Ambient Temperature 105 100 Φe rel - Relative Radiant Power (%) VF, rel - Relative Forward Voltage (%) 1000 Fig. 6 - Radiant Intensity vs. Forward Current Ie, rel - Relative Radiant Intensity (%) VF - Forward Voltage (V) 1.47 -60 -40 -20 100 IF - Forward Current (mA) Fig. 3 - Forward Current vs. Forward Voltage 1.45 10 IF = 100 mA tp = 20 ms 103 101 99 97 -60 -40 -20 0 20 40 60 80 Fig. 5 - Relative Forward Voltage vs. Ambient Temperature Rev. 1.1, 19-Nov-14 80 21445 IF = 30 mA 70 60 50 40 30 20 10 0 840 100 Tamb - Ambient Temperature (°C) 90 880 920 960 1000 1040 λ - Wavelength (nm) Fig. 8 - Relative Radiant Power vs. Wavelength Document Number: 84228 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB294008RG, VSMB294008G www.vishay.com 0° Vishay Semiconductors 10° DRYPACK 20° 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.4 0.6 0.2 Fig. 9 - Relative Radiant Intensity vs. Angular Displacement SOLDER PROFILE 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 0 0 19841 50 100 150 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. DRYING 0 λ - Wavelength (nm) 250 ϕ - Angular Displacement Ie, rel - Relative Radiant Intensity 30° 200 250 300 Time (s) In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.1, 19-Nov-14 Document Number: 84228 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB294008RG, VSMB294008G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMB294008RG 0.3 Ø 1.8 ± 0.1 Z 1.6 0.19 2.77 ± 0.2 0.05 ± 0.1 0.4 2.2 2.2 5.8 ± 0.2 Z 20:1 1.1 ± 0.1 0.4 0.5 2.3 ± 0.2 0.254 exposed copper 2.3 ± 0.2 Cathode Pin ID 1.7 Anode 0.75 Solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5391.02-4 Issue: 2; 18.03.10 21517 Rev. 1.1, 19-Nov-14 Document Number: 84228 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB294008RG, VSMB294008G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMB294008G Ø 1.8 2.77 ± 0.2 0.3 0.4 0.19 0.05 1.6 X 2.2 2.2 4.2 ± 0.2 X 20:1 exposed copper 0.6 Cathode 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 Anode Pin ID technical drawings according to DIN specifications 0.75 Solder pad proposal acc. IPC 7351 Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.02-4 Issue: 4; 18.03.10 21488 Rev. 1.1, 19-Nov-14 Document Number: 84228 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB294008RG, VSMB294008G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMB294008RG Unreel direction X 2. Ø 62 ± 0.5 Reel 0 5± Ø 13 ± 0.5 Ø 330 ± 1 .5 Tape position coming out from reel 6000 pcs/reel Label posted here Technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Device Lead I Lead II Collector Emitter Cathode Anode Anode Cathode Ø 1.55 ± 0.05 I VEMT2000 VEMT2500 X 2:1 4 ± 0.1 2 ± 0.05 VEMD2000 5.5 ± 0.05 VEMD2500 VSMB2000 VSMG2000 VSMY2850RG 3.05 ± 0.1 II 12 ± 0.3 Terminal position in tape 1.75 ± 0.1 Empty (400 mm min.) 4 ± 0.1 Drawing-No.: 9.800-5100.01-4 Issue: 2; 18.03.10 21572 Rev. 1.1, 19-Nov-14 Document Number: 84228 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMB294008RG, VSMB294008G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMB294008G Reel X Unreel direction 5± Ø 62 ± 0.5 2. Ø 13 ± 0.5 Ø 330 ± 1 0.5 Tape position coming out from reel 6000 pcs/reel Label posted here technical drawings according to DIN specifications 12.4 ± 1.5 Leader and trailer tape: Empty (160 mm min.) Parts mounted Direction of pulling out Ø 1.55 ± 0.05 Device Lead I Lead II Collector Emitter Cathode Anode Anode Cathode I VEMT2020 VEMT2520 X 2:1 4 ± 0.1 2 ± 0.05 VSMB2020 VEMD2020 VEMD2520 VSMY2850G 3.05 ± 0.1 II 4 ± 0.1 5.5 ± 0.05 VSMG2020 12 ± 0.3 Terminal position in tape 1.75 ± 0.1 Empty (400 mm min.) Drawing-No.: 9.800-5091.01-4 Issue: 3; 18.03.10 21571 Rev. 1.1, 19-Nov-14 Document Number: 84228 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000