HA-2520, HA-2522, HA-2525 ® Data Sheet November 15, 2006 20MHz, High Slew Rate, Uncompensated, High Input Impedance, Operational Amplifiers FN2894.8 Features • High Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . 120V/μs • Fast Settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200ns HA-2520, HA-2522, HA-2525 comprise a series of operational amplifiers delivering an unsurpassed combination of specifications for slew rate, bandwidth and settling time. These dielectrically isolated amplifiers are controlled at close loop gains greater than 3 without external compensation. In addition, these high performance components also provide low offset current and high input impedance. 120V/ms slew rate and 200ns (0.2%) settling time of these amplifiers make them ideal components for pulse amplification and data acquisition designs. These devices are valuable components for RF and video circuitry requiring up to 20MHz gain bandwidth and 2MHz power bandwidth. For accurate signal conditioning designs the HA-2520, HA-2522, HA-2525’s superior dynamic specifications are complemented by 10nA offset current, 100MΩ input impedance and offset trim capability. • Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . . 2MHz • Gain Bandwidth (AV ≥ 3) . . . . . . . . . . . . . . . . . . . . 20MHz • High Input Impedance . . . . . . . . . . . . . . . . . . . . . . 100MΩ • Low Offset Current . . . . . . . . . . . . . . . . . . . . . . . . . . .10nA • Compensation Pin for Unity Gain Capability • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Data Acquisition Systems • RF Amplifiers • Video Amplifiers • Signal Generators Ordering Information Pinouts TEMP. RANGE (°C) PKG. DWG. # PART NUMBER PART MARKING HA2-2520-2 HA2-2520-2 -55 to +125 8 Ld Metal Can T8.C HA7-2520-2 HA7-2520-2 -55 to +125 8 Ld CerDIP F8.3A HA2-2522-2 HA2-2522-2 -55 to +125 8 Ld Metal Can T8.C PACKAGE HA2-2525-5 HA2-2525-5 0 to +75 8 Ld Metal Can T8.C HA3-2525-5 HA3-2525-5 0 to +75 8 Ld PDIP E8.3 HA3-2525-5Z (Note) HA3-2525-5Z 0 to +75 8 Ld PDIP* (Pb-free) E8.3 HA7-2525-5 HA7-2525-5 0 to +75 8 Ld CerDIP F8.3A HA9P2525-5 25255 0 to +75 8 Ld SOIC M8.15 0 to +75 8 Ld SOIC (Pb-free) M8.15 HA9P2525-5Z 2525-5Z (Note) HA-2520, HA-2525 (8 LD CERDIP, 8 LD PDIP, CERDIP, SOIC) TOP VIEW BAL 1 -IN 2 +IN 3 V- 4 + 8 COMP 7 V+ 6 OUT 5 BAL HA-2520, HA-2522, HA-2525 (8 LD METAL CAN) TOP VIEW COMP NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. 8 BAL IN- 1 - 2 IN+ 7 V+ 6 + 5 3 OUT BAL 4 V- 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 1999, 2004, 2005, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. HA-2520, HA-2522, HA-2525 Absolute Maximum Ratings Thermal Information Supply Voltage (Between V+ and V- Terminals) . . . . . . . . . . . . 40V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA Thermal Resistance (Typical, Note 1) θJA (°C/W) θJC (°C/W) Metal Can Package . . . . . . . . . . . . . . . 165 80 PDIP Package* . . . . . . . . . . . . . . . . . . 96 N/A CERDIP Package. . . . . . . . . . . . . . . . . 135 50 SOIC Package . . . . . . . . . . . . . . . . . . . 157 N/A Maximum Junction Temperature (Hermetic Packages) . . . . . +175°C Maximum Junction Temperature (Plastic Package) . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C Operating Conditions Temperature Range HA-2520/2522-2 . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C HA-2525-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +75°C *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications VSUPPLY = ±15V HA-2520-2 HA-2522-2 HA-2525-5 TEMP (°C) MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS 25 - 4 8 - 5 10 - 5 10 mV Full - - 11 - - 14 - - 14 mV Offset Voltage Drift Full - 20 - - 25 - - 30 - mV/°C Bias Current 25 - 100 200 - 125 250 - 125 250 nA Full - - 400 - - 500 - - 500 nA 25 - 10 25 - 20 50 - 20 50 nA Full - - 50 - - 100 - - 100 nA Input Resistance (Note 2) 25 50 100 - 40 100 - 40 100 - MW Common Mode Range Full ±10.0 - - ±10.0 - - ±10.0 - - V 25 10 15 - 7.5 15 - 7.5 15 - kV/V Full 7.5 - - 5 - -- 5 - - kV/V Common Mode Rejection Ratio (Note 4) Full 80 90 - 74 90 - 74 90 - dB Gain Bandwidth (Notes 2, 5) 25 10 20 - 10 20 - 10 20 - MHz Minimum Stable Gain 25 3 - - 3 - - 3 - - V/V Output Voltage Swing (Note 3) Full ±10.0 ±12.0 - ±10.0 ±12.0 - ±10.0 ±12.0 - V Output Current (Note 6) 25 ±10 ±20 - ±10 ±20 - ±10 ±20 - mA Full Power Bandwidth (Notes 6, 11) 25 1.5 2.0 - 1.2 2.0 - 1.2 2.0 - MHz Rise Time (Notes 3, 7, 8, 10) 25 - 25 50 - 25 50 - 25 50 ns Overshoot (Notes 3, 7, 8, 10) 25 - 25 40 - 25 50 - 25 50 % Slew Rate (Notes 3, 7, 10, 12) 25 ±100 ±120 - ±80 ±120 - ±80 ±120 - V/μs Settling Time (Notes 3, 7, 10, 12) 25 - 0.20 - - 0.20 - - 0.20 - μs PARAMETER INPUT CHARACTERISTICS Offset Voltage Offset Current TRANSFER CHARACTERISTICS Large Signal Voltage Gain (Notes 3, 6) OUTPUT CHARACTERISTICS TRANSIENT RESPONSE (AV = +3) 2 FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Electrical Specifications VSUPPLY = ±15V (Continued) HA-2520-2 HA-2522-2 HA-2525-5 TEMP (°C) MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS Supply Current 25 - 4 6 - 4 6 - 4 6 mA Power Supply Rejection Ratio (Note 9) Full 80 90 - 74 90 - 74 90 - dB PARAMETER POWER SUPPLY CHARACTERISTICS NOTES: 2. This parameter value is based on design calculations. 3. RL = 2kΩ. 4. VCM = ±10V. 5. AV > 10. 6. VO = ±10.0V. 7. CL = 50pF. 8. VO = ±200mV. 9. DV = ±5.0V. 10. See Transient Response Test Circuits and Waveforms. Slew Rate 11. Full Power Bandwidth guaranteed based on slew rate measurement using: FPBW = ----------------------------- . 2πV PEAK 12. VOUT = ±5V. Test Circuits and Waveforms ±67mV +1.67V INPUT -1.67V +5V INPUT 0V 75% OUTPUT OVERSHOOT ΔV 25% -5V SLEW RATE = ΔV/Δt Δt ERROR BAND ±10mV FROM FINAL VALUE ±200mV 90% OUTPUT 10% 0V RISE TIME SETTLING TIME NOTE: Measured on both positive and negative transitions from 0V to +200mV and 0V to -200mV at the output. FIGURE 1. SLEW RATE AND SETTLING TIME FIGURE 2. TRANSIENT RESPONSE 1μF V+ INPUT 2 0.001μF 7 - 3 + 667.2Ω OUTPUT 6 4 1μF 100pF IN 1667Ω + V- OUT 2001Ω 5pF 1333Ω 50pF 0.001μF D 2N4416 G 4999.9Ω SETTLING TIME TEST POINT S 667Ω 2000Ω CR1 CR2 NOTES: 13. AV = -3. 14. Feedback and summing resistor ratios should be 0.1% matched. 15. Clipping diodes CR1 and CR2 are optional. HP5082-2810 recommended. FIGURE 3. SLEW RATE AND TRANSIENT RESPONSE 3 FIGURE 4. SETTLING TIME TEST CIRCUIT FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Test Circuits and Waveforms (Continued) V+ 20kΩ IN OUT BAL. COMP CC V- NOTE: Tested offset adjustment range is |VOS + 1mV| minimum referred to output. Typical ranges are ±20mV with RT = 20kΩ. FIGURE 5. SUGGESTED VOS ADJUSTMENT AND COMPENSATION HOOK-UP Schematic Diagram OFFSETPIN 1 BAL 1 200 R21 Q29 R11 R13 R10 440 1.8K R2A 440 R12 1.8K R2B Q3B Q3A Q16 Q28 V+ 200 R2BB R2AA Q30 COMP OFFSET+ BAL 2 C1 1pF R16 Q23 R9 Q4B Q4A Q27 Q15 D138 R15 +INPUT Q1A Q1B Q17 R1A Q11B Q2B Q2A OUTPUT Q12B R18 30 D13A Q6 Q19 Q20 R17 50 Q7 R1B Q24 Q18 Q31 Q12A Q8 Q11A Q9 Q21A Q26 Q21B Q25 R6A Q22 R6B Q5B Q5A Q10 D14 R3A R3B R19 R10 V- -INPUT 4 FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Typical Application 10K 15 10 5 GAIN (dB) Figure 6 shows a Compensation Circuit for an inverting unity gain amplifier. The circuit was tested for functionality with supply voltages from ±4V to ±15V, and the performance as tested was: Slew Rate ≈ 120V/μs; Bandwidth ≈ 10MHz; and Settling Time (0.1%) ≈ 500ns. Figure 7 illustrates the amplifier’s frequency response, and it is important to note that capacitance at pin 8 must be minimized for maximum bandwidth. GAIN 0 0 -5 -45 PHASE -10 -90 -15 -135 10k - IN OUT + 2K -180 HA-2520 5k 500pF 10k Typical Performance Curves 100k 1M 10M FIGURE 7. FREQUENCY RESPONSE FOR INVERTING UNITY GAIN CIRCUIT FIGURE 6. INVERTING UNITY GAIN CIRCUIT VS = ±15V, TA = 25°C, Unless Otherwise Specified 6 -40 5 -50 -60 4 BIAS CURRENT (nA) OFFSET VOLTAGE (mV) PHASE SHIFT (DEGREES) Inverting Unity Gain Circuit 3 2 1 0 -1 -70 -80 -90 -100 -110 -120 -130 -140 -2 -150 -3 -60 -40 -20 0 20 40 60 80 100 120 -160 -60 -40 -20 0 TEMPERATURE (°C) FIGURE 8. OFFSET VOLTAGE vs TEMPERATURE (6 TYPICAL UNITS FROM 3 LOTS) 20 AVOL (kV/ V) OFFSET BIAS CURRENT (nA) 30 10 0 -10 -20 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 10. OFFSET CURRENT vs TEMPERATURE (5 TYPICAL UNITS FROM 3 LOTS) 5 40 60 80 100 120 FIGURE 9. BIAS CURRENT vs TEMPERATURE (6 TYPICAL UNITS FROM 3 LOTS) 40 -30 -60 20 TEMPERATURE (°C) 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 -60 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 11. OPEN LOOP GAIN vs TEMPERATURE (6 TYPICAL UNITS FROM 3 LOTS) FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Typical Performance Curves VS = ±15V, TA = 25°C, Unless Otherwise Specified (Continued) 14 50 OUTPUT VOLTAGE SWING (±V) 30 20 10 0 -10 -20 -30 10 8 6 4 2 0 -2 -4 -6 -8 -10 -40 -12 6 8 10 12 14 4 6 8 SUPPLY VOLTAGE (±V) FIGURE 12. OUTPUT CURRENT vs SUPPLY VOLTAGE 12 14 5.4 5.2 5.0 4.8 4.6 4.4 4.2 4.0 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 FIGURE 13. OUTPUT VOLTAGE SWING vs SUPPLY VOLTAGE 100 125°C 25°C -55°C 80 GAIN (dB) SUPPLY CURRENT (mA) 10 SUPPLY VOLTAGE (±V) OPEN LOOP GAIN 60 GAIN AT A = 100 V 40 20 PHASE AT AV = 100 0 0 -45 -90 OPEN LOOP PHASE 4 6 8 10 12 SUPPLY VOLTAGE (±V) 100 14 FIGURE 14. SUPPLY CURRENT vs SUPPLY VOLTAGE 80 0pF 10pF 30pF 50pF 60 40 20 100pF 300pF 0 -20 100 1k 10k 100k 1M 10M 100M FREQUENCY (Hz) FIGURE 16. OPEN LOOP FREQUENCY RESPONSE FOR VARIOUS VALUES OF CAPACITORS FROM COMP PIN TO GROUND 6 10k 100k 1M FREQUENCY (Hz) 10M -180 100M FIGURE 15. FREQUENCY RESPONSE 1000 100 500 50 INPUT NOISE VOLTAGE (nV/√Hz) 100 1k -135 PHASE ANGLE (DEGREES) 4 INPUT NOISE CURRENT 10 100 5 50 INPUT NOISE VOLTAGE 1 10 5 0.5 1 1 10 100 1k FREQUENCY (Hz) 10k INPUT NOISE CURRENT (pA/√Hz) OUTPUT CURRENT (±mA) RL = 2kΩ 12 40 0.1 100k FIGURE 17. INPUT NOISE CHARACTERISTICS FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Typical Performance Curves 1.2 VSUPPLY = ±20V RL = 2kΩ 1.1 30 25 NORMALIZED TO ±15V DATA OUTPUT VOLTAGE SWING (VP-P) 35 VS = ±15V, TA = 25°C, Unless Otherwise Specified (Continued) VSUPPLY = ±15V 20 15 VSUPPLY = ±10V 10 5 0 10k CL = 50pF 1.0 BANDWIDTH 0.9 NEGATIVE SLEW RATE 0.8 0.7 POSITIVE SLEW RATE 0.6 0.5 0.4 100k 1M 5 10M 7 9 11 13 15 17 19 20 SUPPLY VOLTAGE (±V) FREQUENCY (Hz) FIGURE 18. OUTPUT VOLTAGE SWING vs FREQUENCY FIGURE 19. NORMALIZED AC PARAMETERS vs SUPPLY VOLTAGE Die Characteristics SUBSTRATE POTENTIAL: Unbiased PROCESS: Bipolar Dielectric Isolation TRANSISTOR COUNT: 40 Metallization Mask Layout 7 HA-2520, HA-2522, HA-2525 COMP V+ OUT BAL -IN +IN BAL V- FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Metal Can Packages (Can) T8.C MIL-STD-1835 MACY1-X8 (A1) REFERENCE PLANE A 8 LEAD METAL CAN PACKAGE e1 L L2 L1 INCHES SYMBOL ØD2 0.185 4.19 4.70 - 0.019 0.41 0.48 1 Øb1 0.016 0.021 0.41 0.53 1 N Øb2 0.016 0.024 0.41 0.61 - ØD 0.335 0.375 8.51 9.40 - α ØD1 0.305 0.335 7.75 8.51 - ØD2 0.110 0.160 2.79 4.06 - 1 β Øb k C L e BASE AND SEATING PLANE Q BASE METAL Øb1 NOTES 0.165 k1 Øb1 MAX 0.016 Øe F MIN A A 2 MILLIMETERS MAX Øb A ØD ØD1 MIN LEAD FINISH Øb2 SECTION A-A NOTES: 1. (All leads) Øb applies between L1 and L2. Øb1 applies between L2 and 0.500 from the reference plane. Diameter is uncontrolled in L1 and beyond 0.500 from the reference plane. 2. Measured from maximum diameter of the product. 3. a is the basic spacing from the centerline of the tab to terminal 1 and b is the basic spacing of each lead or lead position (N -1 places) from a, looking at the bottom of the package. e1 0.200 BSC 5.08 BSC 0.100 BSC - 2.54 BSC - F - 0.040 - 1.02 - k 0.027 0.034 0.69 0.86 - k1 0.027 0.045 0.69 1.14 2 12.70 19.05 1 1.27 1 L 0.500 0.750 L1 - 0.050 L2 0.250 - 6.35 - 1 Q 0.010 0.045 0.25 1.14 - - a 45° BSC 45° BSC 3 b 45° BSC 45° BSC 3 N 8 8 4 Rev. 0 5/18/94 4. N is the maximum number of terminal positions. 5. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 6. Controlling dimension: INCH. 8 FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Ceramic Dual-In-Line Frit Seal Packages (CERDIP) F8.3A MIL-STD-1835 GDIP1-T8 (D-4, CONFIGURATION A) LEAD FINISH c1 8 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL E M -Bbbb S C A-B S -C- S1 0.200 - 5.08 - 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 0.405 - 10.29 5 E 0.220 0.310 5.59 7.87 5 eA ccc M C A-B S e eA/2 c aaa M C A - B S D S D S NOTES - b2 b MAX 0.014 α A A MIN b A L MILLIMETERS MAX A Q SEATING PLANE MIN M (b) D BASE PLANE SYMBOL b1 SECTION A-A D S INCHES (c) NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 6 S1 0.005 - 0.13 - 7 105° 90° 105° - 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. α 90° aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2, 3 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. 5. This dimension allows for off-center lid, meniscus, and glass overrun. N 8 8 8 Rev. 0 4/94 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH 9 FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Dual-In-Line Plastic Packages (PDIP) E8.3 (JEDEC MS-001-BA ISSUE D) N 8 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AD E BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 0.204 C D 0.355 0.400 9.01 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC eA 0.300 BSC 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. eB - L 0.115 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 5 D1 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 0.355 10.16 N 8 2.54 BSC - 7.62 BSC 0.430 - 0.150 2.93 8 6 10.92 7 3.81 4 9 Rev. 0 12/93 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 10 FN2894.8 November 15, 2006 HA-2520, HA-2522, HA-2525 Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) N 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e α B S 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N α NOTES: MILLIMETERS 8 0° 8 8° 0° 7 8° 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 11 FN2894.8 November 15, 2006