Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: 48 TQFP (1.0mm) with matte Sn Plating Total Device Weight 0.14 Grams November, 2010 % of Total Pkg. Wt. Weight (g) Die 2.12% 0.003 Mold 70.17% 0.0982 D/A Epoxy 0.32% % of Total Weight (g) Pkg. Wt. Halogen Free MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 2.00 x 2.20 mm 59.64% 4.21% 3.51% 0.28% 2.53% 0.0835 0.0059 0.0049 0.0004 0.0035 Silica Fused Epoxy Resin Phenol Resin Carbon black Other (trade secret) 60676-86-0 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 75 to 95% (LSC uses 85% in our calculation) 3 to 10% (LSC uses 6% in our calculation) 2 to 8% (LSC uses 5% in our calculation) 0.1 to 0.5% (LSC uses 0.4% in our calculation) 0 to 5% (LSC uses 3.6% in our calculation) 0.26% 0.06% 0.0004 0.0001 Silver (Ag) Other 7440-22-4 - Die attach epoxy Density: 4 grams/cc (silver content: 70-90%; LSC uses 80% in our calculation) 0.0004 Wire 1.01% 0.0014 Gold (Au) 7440-57-5 1.00 mil diameter; 1 wire per package lead; wire length 3 mm Lead Plating 4.06% 0.0057 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 22.32% 0.0313 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) 96.2% Cu 3% Ni 0.65% Si 0.15% Mg 21.47% 0.67% 0.15% 0.03% 0.0301 0.0009 0.00020 0.00005 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A