Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight August, 2008 % of Total Pkg. Wt. Weight (g) Die 1.80% 0.103 Mold 89.35% 5.093 D/A Epoxy 0.12% 208 PQFP 5.70 Grams with matte Sn Plating % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 245°C Substance CAS # Silicon chip 7440-21-3 78.36% 6.25% 4.47% 0.27% 4.467 0.357 0.255 0.015 Silica Fused Epoxy Resin Phenol Resin Carbon black 60676-86-0 129915-35-1 26834-02-6 1333-86-4 0.10% 0.02% 0.006 0.0014 Silver (Ag) other 7440-22-4 - 0.007 Notes / Assumptions: Die size: 7.4 x 9.3 x 0.64 mm Mold Compound Density varies between 1.7 and 2.3 grams/cc 75 to 95% Silica Fused (LSC uses 87.7% in our calculation) 5 to 10% Epoxy Resin (LSC uses 7% in our calculation). 3 to 8% Phenol Resin (LSC uses 5% in our calculation). 0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation) Die attach epoxy Density: 4 grams/cc (silver content: 70-90%; LSC uses 80% in our calculation) Wire 0.11% 0.006 Gold (Au) 7440-57-5 1.0 mil wire diameter; 1 wire for each package lead; wire length 3 mm Lead Plating 0.52% 0.030 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 8.10% 0.462 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) 96.2% Cu 3.0% Ni 0.65% Si 0.15% Mg Copper area is fixed at 55% package area 7.790% 0.243% 0.053% 0.012% 0.444 0.0138 0.003 0.0007 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. C1