Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: 48 TQFP (1.4mm) with matte Sn Plating Total Device Weight 0.18 Grams June, 2012 % of Total Pkg. Wt. Weight (g) Die 2.05% 0.0037 Mold 77.00% 0.1386 D/A Epoxy 0.25% % of Total Weight (g) Pkg. Wt. Copper wire version MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 2.00 x 2.20 mm 65.45% 4.62% 3.85% 0.31% 2.77% 0.1178 0.0083 0.0069 0.0006 0.0050 Silica Fused Epoxy Resin Phenol Resin Carbon black Other (trade secret) 60676-86-0 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 80 to 90% Silica Fused (LSC uses 85% in our calculation) 5 to 10% Epoxy Resin (LSC uses 6% in our calculation). 5 to 10% Phenol Resin (LSC uses 5% in our calculation). 0.1 to 1% Carbon black (LSC uses 0.4% in our calculation) 1 to 4% Other (LSC uses 3.6% in our calculation) 0.20% 0.05% 0.00036 0.00009 Silver (Ag) other 7440-22-4 - (silver content: 70-90%; LSC uses 80% in our calculation) Die attach epoxy Density: 4 grams/cc 0.0004 Wire 0.36% 0.0007 Copper (Cu) 7440-50-8 1 wire for each package lead; wire length 3 mm Lead Plating 2.98% 0.0054 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 17.36% 0.0313 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Leadframe thickness is nominal (per Case Outline) 96.2% Cu 3% Ni 0.65% Si 0.15% Mg 16.70% 0.52% 0.11% 0.03% 0.0301 0.00094 0.00020 0.00005 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A