Plastic Packages for Integrated Circuits Package Outline Drawing L20.5.5x4.0 20 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 3, 3/15 0.10 2.10 5.5 0.300 A B 10 X 0.50 10X 0.50 0.66 0.30 11 R0.0750 20 2X1.30 4.0 R0.0750 2.20 PIN #1 INDEX AREA 6 0.10 10 18X 0.50 2X PIN 1 INDEX AREA TOP VIEW 0.20 2.25 0.10M C A B 10 x 0.25 4 1 10X 0.25 0.35 2.45 (4.95) BOTTOM VIEW (2X 0.20) (4.50 ) 10X 0.45 10X 0.50 10X 0.50 10 X 0.25 10X 0.70 SEE DETAIL "X" PACKAGE BOUNDARY 2X 1.50 (2.20) (4.40) (3.0) 0.10 C 1.30 SEATING PLANE 0.08 C C SIDE VIEW 0.68 0.16 10X 0.25 2X 2.45 0.30 2.10 (0.10) (4.85) C 0.2 REF 5 (4.95) 0-0.05 DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSEY14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 Angular ±2° 4. Dimension applies to the metallized terminal and is measured between 0.015mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. 7. No other electrical connection allowed under backside of X1 or X2 areas. 8. Soldering required to PCB for X1 and X2 pads to separate and non-connected metal pads. 1