FPBGA Pbfree Auwire144

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
3.39%
0.0161
Mold
37.51%
0.178
D/A Epoxy
0.34%
0.89%
0.0042
Solder Balls
29.49%
0.1401
22.18%
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
MSL: 3
Peak Reflow Temp: 250°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 5.53 x 3.29 mm
33.08%
1.88%
1.88%
0.56%
0.11%
0.157
0.0089
0.0089
0.0027
0.0005
Silica (Fused or Amorphous)
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
0.27%
0.07%
0.0013
0.0003
Silver (Ag)
Organic Esters and Resins
7440-22-4
-
Mold Compound composition:
75 to 95% Silica Fused or Amorphous (LSC uses 88.2% in our calculation)
2 to 10% Epoxy resin (LSC uses 5% in our calculation)
2 to 10% Phenol resin (LSC uses 5% in our calculation)
0.5 to 2.5% Metal Hydroxide (LSC uses 1.5% in our calculation)
0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation)
Mold Compound Density between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball; wire length 3 mm
Qualified Solder ball compositions:
Sn95.5/Ag4/Cu0.5
Sn96.5/Ag3/Cu0.5
LSC uses: Sn96/Ag3.5/Cu0.5 for calculations
0.0016
Wire
Substrate
144 fpBGA
0.475
Grams
28.31%
1.03%
0.15%
0.1345
0.0049
0.0007
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
15.09%
7.10%
0.0717
0.0337
Glass fiber
BT Resins
65997-17-3
-
Copper (Cu)
7440-50-8
Nickel (Ni)
Gold (Au)
7440-02-0
7440-57-5
0.1054
Foil
5.79%
0.0275
Underplating
0.41%
0.0019
0.28%
0.12%
0.0014
0.0006
60 to 75% glass fiber (LSC uses 68% in our calculation)
Solder pad opening and Bond Fingers
Underplating thickness: Ni 5.0um / Au 1.0um (nominal)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. B4