Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight 1152 fpBGA 5.50 Grams with SnAgCu Solder Balls Copper Bond Wire version MSL: 3 December, 2012 % of Total Pkg. Wt. Weight (g) Die 4.04% 0.2223 Mold 34.46% 1.8951 D/A Epoxy Wire Solder Balls Substrate Foil 0.57% 0.18% 20.33% 19.32% 21.10% % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Peak Reflow Temp: 250°C Notes / Assumptions: Die size: 17.25 x 17.72 mm 30.18% 2.41% 1.72% 0.14% 1.6601 0.1327 0.0948 0.0076 Silica Fused Epoxy Resin Phenol Resin Carbon Black 60676-86-0 Trade secret Trade secret 1333-86-4 0.45% 0.11% 0.0250 0.0063 Silver Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Silica (LSC uses 87.6% in our calculation) 5 to 10% Epoxy Resin (LSC uses 7% in our calculation) 3 to 8% Phenol Resin (LSC uses 5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.4% in our calculation) Mold Compound Density ranges between 1.95 and 2.05 grams/cc Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) 0.98% 0.01% 0.0018 0.0000 Copper Palladium 7440-50-8 7440-05-3 0.8 mil diameter; 1 wire per solder ball 98.5% 1.5% 19.62% 0.61% 0.10% 1.0790 0.0335 0.0056 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Qualified Solder ball compositions: Sn96.5/Ag3/Cu0.5 13.14% 6.18% 0.7227 0.3401 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.0313 0.0100 1.1181 1.0628 1.1604 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. E