FPBGA Pbfree Cuwire1152

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
1152 fpBGA
5.50
Grams
with SnAgCu Solder Balls
Copper Bond Wire version
MSL: 3
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
4.04%
0.2223
Mold
34.46%
1.8951
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.57%
0.18%
20.33%
19.32%
21.10%
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Peak Reflow Temp: 250°C
Notes / Assumptions:
Die size: 17.25 x 17.72 mm
30.18%
2.41%
1.72%
0.14%
1.6601
0.1327
0.0948
0.0076
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
60676-86-0
Trade secret
Trade secret
1333-86-4
0.45%
0.11%
0.0250
0.0063
Silver
Organic esters and resins
7440-22-4
-
Mold Compound composition:
75 to 95% Silica (LSC uses 87.6% in our calculation)
5 to 10% Epoxy Resin (LSC uses 7% in our calculation)
3 to 8% Phenol Resin (LSC uses 5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.4% in our calculation)
Mold Compound Density ranges between 1.95 and 2.05 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
0.98%
0.01%
0.0018
0.0000
Copper
Palladium
7440-50-8
7440-05-3
0.8 mil diameter; 1 wire per solder ball
98.5%
1.5%
19.62%
0.61%
0.10%
1.0790
0.0335
0.0056
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Qualified Solder ball compositions:
Sn96.5/Ag3/Cu0.5
13.14%
6.18%
0.7227
0.3401
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0313
0.0100
1.1181
1.0628
1.1604
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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