FPBGA Pbfree Cuwire256

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
1.82%
0.0191
Mold
28.64%
0.3008
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.22%
0.21%
23.71%
25.20%
20.18%
256 fpBGA
1.05
Grams
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
Copper Bond Wire version
MSL: 3
Peak Reflow Temp: 250°C
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 5.30 x 5.00
25.26%
1.43%
1.43%
0.43%
0.09%
0.2653
0.0150
0.0150
0.0045
0.0009
Silica (Fused or Amorphous)
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
75 to 95% Silica Fused or Amorphous (LSC uses 88.2% in our calculation)
2 to 10% Epoxy resin (LSC uses 5% in our calculation)
2 to 10% Phenol resin (LSC uses 5% in our calculation)
0 to 2.5% Metal Hydroxide (LSC uses 1.5% in our calculation)
0 to 0.5% Carbon black (LSC uses 0.3% in our calculation)
0.18%
0.05%
0.0019
0.0005
Silver
Organic esters and resins
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
0.208%
0.003%
0.00219
0.00003
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5%
1.5%
22.88%
0.71%
0.12%
0.2403
0.0075
0.0012
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
17.14%
8.06%
0.1799
0.0847
Glass fiber
BT Resins
65997-17-3
-
Copper (Cu)
7440-50-8
0.0024
0.0022
0.2490
Qualified Solder ball compositions:
Sn96.5/Ag3/Cu0.5
0.2646
0.2119
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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