Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 Package: [email protected] Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 1.82% 0.0389 Mold 27.64% 0.591 D/A Epoxy 0.26% 0.53% 0.0114 Solder Balls 17.60% 0.377 Foil 22.52% 29.64% with SnAgCu Solder Balls MSL: 3 Peak Reflow Temp: 250°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 7.8 x 6.9 mm 24.32% 1.66% 1.66% 0.520 0.0355 0.0355 Silica (Fused or Amorphous) Epoxy resin Phenol resin 60676-86-0 - 0.20% 0.05% 0.0044 0.0011 Silver Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Silica Fused (LSC uses 88% in our calculation) 1 to 10% Epoxy resin (LSC uses 6% in our calculation) 2 to 7% Phenol resin (LSC uses 6% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 7 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per solder ball Qualified Solder ball compositions: Sn95.5/Ag4/Cu0.5 Sn96.5/Ag3/Cu0.5 LSC uses: Sn96/Ag3.5/Cu0.5 for calculations 0.0055 Wire Substrate 388 fpBGA 2.14 Grams 16.89% 0.62% 0.09% 0.362 0.0132 0.0019 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 15.32% 7.21% 0.328 0.154 Glass fiber BT Resins 65997-17-3 - Copper (Cu) 7440-50-8 0.482 0.634 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B4