FTBGA Pbfree Cuwire256V2

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
256 ftBGA
1.234
Grams
with SnAgCu Solder Balls
Option 2 (ECP3 Products)
Copper Bond Wire Version
MSL: 3
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
1.22%
0.0151
Mold
37.10%
0.4578
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.17%
0.33%
20.18%
21.36%
19.64%
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Peak Reflow Temp: 260°C
Notes / Assumptions:
Die size: 4.64 x 5.16 mm
33.39%
2.23%
1.48%
0.07%
0.4121
0.0275
0.0183
0.0009
Silica
Epoxy Resin
Phenol Resin
Carbon Black
60676-86-0
1333-86-4
0.14%
0.03%
0.0017
0.0004
Silver-filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
86 to 93% Silica Fused or Amorphous (LSC uses 90% in our calculation)
1.5 to 7% Epoxy resin (LSC uses 6% in our calculation)
1 to 6% Phenol resin (LSC uses 4% in our calculation)
0.2% Carbon Black
Mold Compound Density ranges between 1.99 and 2.09 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
0.325%
0.005%
0.0040
0.0001
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5%
1.5%
19.37%
0.71%
0.10%
0.2390
0.0087
0.0012
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn96.5/Ag3/Cu0.5
14.52%
6.83%
0.1792
0.0843
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0021
0.0041
0.2490
0.2636
0.2423
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. K