Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 2.46% 0.003 Mold 48.81% 0.062 D/A Epoxy 0.40% 1.14% 0.0014 Solder Balls 17.44% 0.022 Foil 23.08% 6.66% with SnPb Solder Balls % of Total Weight (g) Pkg. Wt. Substance Silicon chip Notes / Assumptions: 7440-21-3 Die size: 1.7 x 2.9 mm Mold Compound composition: 65 to 95% Fused silica filler (LSC uses 84% in our calculation) 4 to 28% Epoxy/Phenol resins (LSC uses 8.5% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation) 0.1 to 1.0% Carbon Black (LSC uses 0.5% in our calculation) 1-5% Siloxanes (LSC uses 3% in our calculation) <2% Brominated Epoxy Resin (LSC uses 1% in our calculation) 0.1-1% Antimony Trioxide (LSC uses 0.5% in our calculation) 1% Antimony Pentoxide (LSC uses 1% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc 0.052 0.005 0.0009 0.0031 0.0018 0.0006 0.0003 0.0006 Silica Epoxy/Phenol Resin Metal hydroxide Carbon black Siloxanes Brominated Epoxy Resin Antimony Trioxide Antimony Pentoxide 60676-86-0 1333-86-4 68928-70-1 1344-28-1 1314-60-9 0.32% 0.08% 0.0004 0.0001 Silver filled epoxy Silver (Ag) Organic esters and resins 7440-22-4 Die attach epoxy Density: 4 grams/cc - Gold (Au) 7440-57-5 1.00 mil diameter; 1 wire per solder ball 10.99% 6.45% 0.014 0.008 Tin (Sn) Lead (Pb) 7440-31-5 Solder ball composition Sn63/Pb37 7439-92-1 15.70% 7.39% 0.0198 0.0093 Glass fiber BT Resins 65997-17-3 60 to 75% glass fiber (LSC uses 68% in our calculation) - 0.029 0.008 Copper (Cu) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com CAS # 41.00% 4.15% 0.73% 2.44% 1.46% 0.49% 0.24% 0.49% 0.0005 Wire Substrate 49 caBGA 0.126 Grams 7440-50-8