FPBGA SNPB Auwire680

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
Package:
Total Device Weight
January, 2004
% of Total
Pkg. Wt.
Weight (g)
Die
4.28%
0.221
Mold
36.85%
1.901
680 fpBGA
5.16
Grams
with SnPb Solder Balls
% of Total
Weight (g)
Pkg. Wt.
28.92%
4.61%
0.55%
0.74%
0.92%
0.92%
0.18%
1.493
0.238
0.029
0.038
0.048
0.048
0.010
Substance
CAS #
Notes / Assumptions:
Silicon
7440-21-3
Die size: 17.25 x 17.72 mm
Silica
Epoxy resin
Phenolic resin
Brominated resin
Mixed siloxanes
Antimony Pent/Trioxide
Carbon black
60676-86-0
129915-35-1
26834-02-6
68928-70-1
1309-64-4
1333-86-4
Mold Compound composition:
65 to 95% silica filler (LSC uses 78.5% in our calculation)
5 to 20% Epoxy resin (LSC uses 12.5% in our calculation)
0 to 3% Phenolic resin (LSC uses 1.5% in our calculation)
2% to unspecified maximum Brominated resin (LSC uses 2% in our calculation)
0 to 5% Mixed siloxanes (LSC uses 2.5% in our calculation)
0.6 to 5% Antimony Pent/Trioxide (LSC uses 2.5% in our calculation)
0.1 to1% Carbon black (LSC uses 0.5% in our calculation)
Mold Compound Density between 1.8 and 2.1 grams/cc
7440-22-4 Die attach epoxy Density: 4 grams/cc
D/A Epoxy
0.60%
0.031
Silver filled epoxy
Wire
0.39%
0.020
Gold (Au)
7440-57-5
Solder Balls
15.55%
0.802
Tin (Sn)
Lead (Pb)
7440-31-5 Solder ball composition Sn63/Pb37
7439-92-1
8.14%
7.41%
Substrate
19.85%
1.024
Foil
22.49%
1.160
0.420
0.383
129915-35-1 BT Resin
Copper (Cu)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
1.00 mil diameter; 1 wire per solder ball
7440-50-8