Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 1.44% 0.0489 Mold 35.11% 1.194 D/A Epoxy 0.20% 0.58% 0.0197 Solder Balls 22.77% 0.774 Foil 18.32% 21.57% with SnPb Solder Balls MSL: 3 Peak Reflow Temp: 225°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 8.11 x 8.34 mm 28.09% 4.92% 1.05% 0.35% 0.18% 0.35% 0.18% 0.9551 0.1671 0.0358 0.0119 0.0060 0.0119 0.0060 Silica (fused, amorphous) Epoxy/Phenol Resin Siloxanes Brominated Epoxy Resin Antimony Trioxide Antimony Pentoxide Carbon Black 60676-86-0 68928-70-1 1309-64-4 1314-60-9 1333-86-4 0.16% 0.03% 0.01% 0.00% 0.0053 0.0011 0.0003 0.0001 Silver Organic esters and resins Silane Compound Curing Agent and Hardener 7440-22-4 - Mold Compound composition: 65 to 95% Silica (LSC uses 80% in our calculation) 3 to 22% Epoxy/Phenol Resin (LSC uses 14% in our calculation) 1 to 5% Siloxanes (LSC uses 3% in our calculation) 0 to 2% Brominated Epoxy Resin (LSC uses 1% in our calculation) 0.1 to 0.5% Antimony Trioxide (LSC uses 0.5% in our calculation) 0 to 1.5% Antimony Pentoxide (LSC uses 1% in our calculation) 0.1 to 1% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 77% in our calculation) 1 to 35% Organic Esters and Resins (LSC uses 16% in our calculation) 5 to 10% Silane Compound (LSC uses 5% in our calculation) 1 to 5% Curing Agent and Hardener (LSC uses 2% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per solder ball 0.0069 Wire Substrate 672 fpBGA 3.40 Grams 14.35% 8.43% 0.488 0.287 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 Solder ball composition Sn63/Pb37 12.46% 5.86% 0.424 0.199 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.623 0.734 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B4