Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight July, 2012 % of Total Pkg. Wt. Weight (g) Die 1.82% 0.0389 Mold 27.92% 0.5974 D/A Epoxy 0.26% 0.25% 0.0053 Solder Balls 20.89% 0.4471 Foil 23.47% 25.40% with SnPb Solder Balls Copper Bond Wire version MSL: 3 Peak Reflow Temp: 225°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 7.8 x 6.9 mm 21.91% 3.91% 0.28% 0.70% 0.28% 0.70% 0.14% 0.4689 0.0836 0.0060 0.0149 0.0060 0.0149 0.0030 Silica (Fused or Amorphous) Epoxy/Phenol Resin Brominated Epoxy Resin Antimony Trioxide Antimony Pentoxide Siloxanes Carbon Black 60676-86-0 68928-70-1 1309-64-4 1314-60-9 1333-86-4 0.20% 0.05% 0.0044 0.0011 Silver (Ag) Organic esters and resins 7440-22-4 - Mold Compound composition: 65 to 95% Silica (LSC uses 78.5% in our calculation) 5 to 22% Epoxy/Phenol Resin (LSC uses 14% in our calculation) 0 to 2% Brominated Epoxy Resin (LSC uses 1% in our calculation) 0 to 5% Antimony Trioxide (LSC uses 2.5% in our calculation) 0 to 1.5% Antimony Pentoxide (LSC uses 1% in our calculation) 0 to 5% Siloxanes (LSC uses 2.5% in our calculation) 0 to 1% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 7 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) Copper (Cu) 7440-50-8 1 wire per solder ball 0.0055 Wire Substrate 388 fpBGA 2.14 Grams 13.16% 7.73% 0.2817 0.1654 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 Solder ball composition Sn63/Pb37 15.96% 7.51% 0.3416 0.1607 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.5023 0.5436 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B4