Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight July, 2009 % of Total Pkg. Wt. Weight (g) Die 1.74% 0.009 Mold 47.10% 0.251 D/A Epoxy 0.28% 1.41% 0.0075 Solder Balls 21.58% 0.115 Foil 21.57% 6.31% with SnPb Solder Balls MSL: 3 Peak Reflow Temp: 240°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 3.53 x 4.17 mm 34.85% 9.42% 0.24% 0.47% 0.47% 1.41% 0.24% 0.1854 0.0501 0.0013 0.0025 0.0025 0.0075 0.0013 Silica (fused or amorphous) Epoxy/Phenol Resins Antimony Trioxide Antimony Pentoxide Brominated Epoxy Resin Siloxanes Carbon Black 60676-86-0 1309-64-4 1314-60-9 1333-86-4 0.22% 0.06% 0.0012 0.0003 Silver filled epoxy Silver (Ag) Organic esters and resins 7440-22-4 - Mold Compound composition: 67 to 85% Fused silica filler (LSC uses 74% in our calculation) 15 to 28% Epoxy/Phenol resins (LSC uses 20% in our calculation) 0.1 to 1% Antimony Trioxide (LSC uses 0.5% in our calculation) 1% Antimony Pentoxide (LSC uses 1% in our calculation) <2% Brominated Epoxy Resin (LSC uses 1% in our calculation) 1 to 5% Siloxanes (LSC uses 3% in our calculation) 0.1 to 1% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density ranges between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 1.00 mil diameter; 1 wire per solder ball Solder ball composition Sn63/Pb37% 0.0015 Wire Substrate 256 caBGA 0.532 Grams 13.60% 7.99% 0.0723 0.0425 Tin (Sn) Lead (Pb) 7440-31-5 7440-50-8 14.67% 6.90% 0.0780 0.0367 BT Resin Fibrous-glass-wool Resins 65997-17-3 - Copper (Cu) 7440-50-8 0.1148 0.0336 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B