FPBGA Halogenfree Cuwire484

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
3.58%
0.0790
Mold
25.52%
0.5640
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.50%
0.19%
21.30%
19.19%
29.72%
484 fpBGA
2.21
Grams
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
(90nm and 65nm products)
Copper Bond Wire version - Halogen Free
MSL: 3 Peak Reflow Temp: 250°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 9.63 x 11.36 mm
Mold Compound composition:
75 to 95% Silica (LSC uses 87.6% in our calculation)
5 to 10% Epoxy Resin (LSC uses 7% in our calculation)
3 to 8% Phenol Resin (LSC uses 5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.4% in our calculation)
Mold Compound Density ranges between 1.85 and 2.15 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
22.36%
1.79%
1.28%
0.10%
0.4941
0.0395
0.0282
0.0023
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
60676-86-0
Trade secret
Trade secret
1333-86-4
0.40%
0.10%
0.0089
0.0022
Silver (Ag)
Organic esters and resins
7440-22-4
Trade secret
0.414%
0.006%
0.00187
0.00003
Copper
Palladium
7440-50-8
7440-05-3
0.8 mil diameter; 1 wire per solder ball
98.5%
1.5%
20.45%
0.75%
0.11%
0.454
0.0141
0.0024
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
SAC305
96.5% Sn
3% Ag
0.5% Cu
13.05%
6.14%
0.288
0.136
Glass fiber
BT Resins
65997-17-3
Trade secret
Copper (Cu)
7440-50-8
0.0111
0.0042
0.471
0.424
0.657
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. E1