Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: 100 TQFP (1.0 mm) with matte Sn Plating Total Device Weight 0.50 Grams August, 2012 % of Total Pkg. Wt. Weight (g) Die 0.26% 0.0013 Mold 71.77% 0.3558 D/A Tape 0.01% % of Total Pkg. Wt. Weight (g) Halogen Free MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 58 x 55 mil 2.33% 2.15% 3.23% 0.14% 62.47% 1.44% 0.01156 0.01068 0.01601 0.00071 0.30976 0.00712 Epoxy Resin-1 Epoxy Resin-2 Phenol Resin Carbon black Silica Fused Other (trade secret) Trade Secret Trade Secret Trade Secret 1333-86-4 60676-86-0 - Mold Compound: CEL 9240HF 0.5 to 6% (LSC uses 3.25% in our calculation) 1 to 5% (LSC uses 3% in our calculation) 3 to 6% (LSC uses 4.5% in our calculation) 0.20% 82 to 94% (LSC uses 87.05% in our calculation) <2% (LSC uses 2% in our calculation) 0.0017% 0.0017% 0.0003% 0.0078% 0.000008 0.000008 0.000001 0.000039 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer Trade Secret Trade Secret Trade Secret Trade Secret TAPE: FH-900T-25_HR9004 10-20%; LSC uses 15% in our calculation 10-20%; LSC uses 15% in our calculation 1-10%; LSC uses 7.25% in our calculation 65-75%; LSC uses 67.25% in our calculation 0.00006 Wire 0.15% 0.00074 Copper (Cu) 7440-50-8 0.7 MIL COPPER WIRE Lead Plating 1.20% 0.0059 Tin (Sn) 7440-31-5 Plating is 100% Matte Sn Leadframe 26.61% 0.1319 Copper (Cu) Nickel (Ni) Silicon (Si) Magnesium (Mg) 7440-50-8 7440-02-0 7440-21-3 7439-95-4 C7025 25.52% 0.850% 0.190% 0.050% 0.12653 0.00421 0.00094 0.00025 2.2 to 4.2% Ni 0.25 to 1.2% Si 0.05 to 0.30% Mg Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A