Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight August, 2012 % of Total Pkg. Wt. Weight (g) Die 1.08% 0.0012 Mold 45.69% 0.0526 D/A Tape Wire 0.05% 0.68% 84 QFN 0.110 Grams % of Total Pkg. Wt. Weight (g) with matte Sn Plating Halogen-Free MSL: 1 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 0.04558 0.00151 0.00075 0.00151 0.00075 0.00015 Silica (fused) Epoxy Resin A Epoxy Resin B Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 Trade Secret Trade Secret Trade Secret Trade Secret 1333-86-4 Mold Compound: G770HJ 85 to 95% Fused silica filler (LSC uses 90.7% in our calculation) 1 to 5% Epoxy resin A (LSC uses 3% in our calculation) 0.5 to 2.5% Epoxy resin B (LSC uses 1.5% in our calculation) 1 to 5% Phenol resin (LSC uses 3% in our calculation) 0.5 to 2.5% Metal Hydroxide (LSC uses 1.5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.3% in our calculation) 0.008% 0.008% 0.000% 0.035% 0.00001 0.00001 0.00000 0.00004 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer Trade Secret Trade Secret Trade Secret Trade Secret TAPE FH-900T-25_HR9004 10 to 20% (LSC uses 15% in our calculation) 10 to 20% (LSC uses 15% in our calculation) 1 to 10% (LSC uses 2.75% in our calculation) 65 to 75% (LSC uses 67.25% in our calculation) 0.659% 0.018% 0.00072 0.00002 Copper (Cu) Palladium (Pd) 7440-50-8 7440-05-3 EX1 0.8MIL Pd COATED Cu 97.30% 2.70% Tin (Sn) 7440-31-5 100% Matte Sn Copper (Cu) Nickel Silicon Magnesium Silver Conducting salts 7440-50-8 7440-02-0 7440-21-3 7439-95-4 7440-22-4 Trade Secret 0.00074 4.50% 0.00495 Leadframe 48.00% 0.0528 Die size: 58 x 55 mils 41.44% 1.37% 0.69% 1.37% 0.69% 0.14% 0.00006 Plating Notes / Assumptions: C7025 45.90% 1.536% 0.348% 0.084% 0.091% 0.043% 0.05049 0.00169 0.00038 0.00009 0.00010 0.00005 2.2 to 4.2% 0.25 to 1.2% 0.05 to 0.30% <0.2% <0.1% Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A