QFN halogenfree84

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
August, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
1.08%
0.0012
Mold
45.69%
0.0526
D/A Tape
Wire
0.05%
0.68%
84 QFN
0.110
Grams
% of Total
Pkg. Wt.
Weight (g)
with matte Sn Plating
Halogen-Free
MSL: 1
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
0.04558
0.00151
0.00075
0.00151
0.00075
0.00015
Silica (fused)
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Metal Hydroxide
Carbon Black
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Mold Compound: G770HJ
85 to 95% Fused silica filler (LSC uses 90.7% in our calculation)
1 to 5% Epoxy resin A (LSC uses 3% in our calculation)
0.5 to 2.5% Epoxy resin B (LSC uses 1.5% in our calculation)
1 to 5% Phenol resin (LSC uses 3% in our calculation)
0.5 to 2.5% Metal Hydroxide (LSC uses 1.5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.3% in our calculation)
0.008%
0.008%
0.000%
0.035%
0.00001
0.00001
0.00000
0.00004
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
Trade Secret
Trade Secret
Trade Secret
Trade Secret
TAPE FH-900T-25_HR9004
10 to 20% (LSC uses 15% in our calculation)
10 to 20% (LSC uses 15% in our calculation)
1 to 10% (LSC uses 2.75% in our calculation)
65 to 75% (LSC uses 67.25% in our calculation)
0.659%
0.018%
0.00072
0.00002
Copper (Cu)
Palladium (Pd)
7440-50-8
7440-05-3
EX1 0.8MIL Pd COATED Cu
97.30%
2.70%
Tin (Sn)
7440-31-5
100% Matte Sn
Copper (Cu)
Nickel
Silicon
Magnesium
Silver
Conducting salts
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-22-4
Trade Secret
0.00074
4.50%
0.00495
Leadframe
48.00%
0.0528
Die size: 58 x 55 mils
41.44%
1.37%
0.69%
1.37%
0.69%
0.14%
0.00006
Plating
Notes / Assumptions:
C7025
45.90%
1.536%
0.348%
0.084%
0.091%
0.043%
0.05049
0.00169
0.00038
0.00009
0.00010
0.00005
2.2 to 4.2%
0.25 to 1.2%
0.05 to 0.30%
<0.2%
<0.1%
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A