datasheet

SKM25GAH125D
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
IGBT
VCES
IC
Tj = 25 °C
Tj = 150 °C
1200
V
Tc = 25 °C
39
A
Tc = 80 °C
27
A
25
A
ICnom
ICRM
SEMITRANS® 6
IGBT Modules
SKM25GAH125D
tpsc
Tj
ICRM = 2xICnom
VCC = 600 V
VGE ≤ 15 V
VCES ≤ 1200 V
50
A
-20 ... 20
V
10
µs
-55 ... 150
°C
Tc = 25 °C
47
A
Tc = 80 °C
32
A
40
A
Tj = 125 °C
Inverse diode
IF
Tj = 150 °C
IFnom
Target Data
Features
• VCE(sat) with positive temperature
coefficient
• High short circuit capability, self limiting
to 6 x Icnom
• Fast & soft inverse CAL diodes
• Large clearance (10 mm) and
creepage distances (20 mm)
• Isolated copper baseplate using DBC
Technology (Direct Copper Bonding)
• UL recognized, file no. E63532
Typical Applications*
•
•
•
•
VGES
DC/DC – converter
Brake chopper
Switched reluctance motor
DC – motor
IFRM
IFRM = 2xIFnom
80
A
IFSM
tp = 10 ms, sin 180°, Tj = 25 °C
410
A
-40 ... 150
°C
Tc = 25 °C
47
A
Tc = 80 °C
32
A
40
A
Tj
Freewheeling diode
IF
Tj = 150 °C
IFnom
IFRM
IFRM = 2xIFnom
80
A
IFSM
tp = 10 ms, sin 180°, Tj = 25 °C
410
A
-40 ... 150
°C
Tj
Module
It(RMS)
Tterminal = 80 °C
Tstg
Visol
AC sinus 50 Hz, t = 1 min
100
A
-40 ... 125
°C
4000
V
Characteristics
Symbol
IGBT
VCE(sat)
VCE0
Conditions
IC = 25 A
VGE = 15 V
chiplevel
chiplevel
rCE
VGE = 15 V
chiplevel
VGE(th)
VGE=VCE, IC = 1 mA
ICES
VGE = 0 V
VCE = 1200 V
Cies
Coes
Cres
VCE = 25 V
VGE = 0 V
min.
typ.
max.
Unit
Tj = 25 °C
3.20
3.70
V
Tj = 125 °C
3.60
4.20
V
Tj = 25 °C
1.5
1.75
V
Tj = 125 °C
1.7
1.95
V
Tj = 25 °C
68.00
78.00
m
76.00
90.00
m
5.5
6.5
V
Tj = 25 °C
0.1
0.3
mA
f = 1 MHz
1.65
nF
f = 1 MHz
0.25
nF
f = 1 MHz
Tj = 125 °C
4.5
mA
0.11
nF
QG
VGE = - 8 V...+ 20 V
221
nC
RGint
Tj = 25 °C
0.00

GAH
© by SEMIKRON
Rev. 1 – 05.12.2012
1
SKM25GAH125D
Characteristics
Symbol
td(on)
tr
Eon
td(off)
tf
Conditions
VCC = 600 V
IC = 25 A
VGE = ±15 V
RG on = 16 
RG off = 16 
Eoff
SEMITRANS® 6
IGBT Modules
SKM25GAH125D
Target Data
Rth(j-c)
IRRM
Features
• VCE(sat) with positive temperature
coefficient
• High short circuit capability, self limiting
to 6 x Icnom
• Fast & soft inverse CAL diodes
• Large clearance (10 mm) and
creepage distances (20 mm)
• Isolated copper baseplate using DBC
Technology (Direct Copper Bonding)
• UL recognized, file no. E63532
Qrr
Err
Rth(j-c)
rF
•
•
•
•
IRRM
DC/DC – converter
Brake chopper
Switched reluctance motor
DC – motor
chiplevel
IF = 25 A
VGE = ±15 V
VCC = 600 V
per diode
Freewheeling diode
VF = VEC IF = 40 A
VGE = 0 V
chiplevel
VF0
chiplevel
Typical Applications*
Qrr
Err
Rth(j-c)
typ.
chiplevel
max.
Unit
25
Tj = 125 °C
19
ns
Tj = 125 °C
3.9
mJ
Tj = 125 °C
184
ns
Tj = 125 °C
8
ns
Tj = 125 °C
1.6
mJ
per IGBT
Inverse diode
VF = VEC IF = 40 A
VGE = 0 V
chiplevel
VF0
chiplevel
rF
min.
Tj = 125 °C
ns
0.56
K/W
Tj = 25 °C
2.13
2.65
V
Tj = 125 °C
1.94
2.46
V
Tj = 25 °C
1.1
1.45
V
Tj = 125 °C
0.85
1.2
V
Tj = 25 °C
25.7
30.0
m
Tj = 125 °C
27.1
31.4
m
Tj = 125 °C
A
Tj = 125 °C
µC
Tj = 125 °C
mJ
1
K/W
Tj = 25 °C
2.00
2.5
V
Tj = 125 °C
1.8
2.3
V
Tj = 25 °C
1.1
1.45
V
Tj = 125 °C
1.18
1.2
V
Tj = 25 °C
22.5
30.0
m
27.1
31.4
m
Tj = 125 °C
IF = 25 A
Tj = 125 °C
di/dtoff = 2500 A/µs T = 125 °C
j
VGE = ±15 V
Tj = 125 °C
VCC = 600 V
per Diode
50
A
4
µC
1.1
mJ
1
K/W
60
nH
Module
LCE
RCC'+EE'
terminal-chip
Rth(c-s)
per module
Ms
to heat sink M6
TC = 25 °C
m
TC = 125 °C
m
4
0.05
K/W
5
Nm
Mt
Nm
Nm
w
175
g
GAH
2
Rev. 1 – 05.12.2012
© by SEMIKRON
SKM25GAH125D
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 6: Typ. gate charge characteristic
Fig. 7: Typ. switching times vs. IC
© by SEMIKRON
Rev. 1 – 05.12.2012
3
SKM25GAH125D
Fig. 8: Typ. switching times vs. gate resistor RG
4
Fig. 10: Typ. CAL diode forward charact., incl. RCC'+ EE'
Rev. 1 – 05.12.2012
© by SEMIKRON
SKM25GAH125D
SEMITRANS 6
GAH
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff.
© by SEMIKRON
Rev. 1 – 05.12.2012
5