SKM200GBD126D Absolute Maximum Ratings Symbol Conditions Values Unit IGBT VCES IC Tj = 25 °C Tj = 150 °C 1200 V Tc = 25 °C 264 A Tc = 80 °C 186 A 150 A ICnom ICRM SEMITRANS® 3 Trench IGBT Modules SKM200GBD126D Preliminary Data Features • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • High short circuit capability, self limiting to 6 x IC • UL recognized, file no. E63532 Typical Applications* • Current source inverter Remarks • The Fig.1 to Fig.9 are based on measurements of the SKM200GB126D • The series diodes (FWD) have the data of the inverse diodes of the SKM300GB126D VGES tpsc Tj ICRM = 2xICnom VCC = 900 V VGE ≤ 15 V VCES ≤ 1200 V 300 A -20 ... 20 V 10 µs -40 ... 150 °C Tc = 25 °C 34 A Tc = 80 °C 23 A 30 A Tj = 125 °C Inverse diode IF Tj = 150 °C IFnom IFRM IFRM = 2xIFnom 60 A IFSM tp = 10 ms, sin 180°, Tj = 25 °C 414 A -40 ... 150 °C Tc = 25 °C 250 A Tc = 80 °C 169 A 200 A Tj Freewheeling diode IF Tj = 150 °C IFnom IFRM IFRM = 2xIFnom 400 A IFSM tp = 10 ms, sin 180°, Tj = 25 °C 1656 A -40 ... 150 °C Tj Module It(RMS) Tstg Visol AC sinus 50 Hz, t = 1 min 500 A -40 ... 125 °C 4000 V Characteristics Symbol IGBT VCE(sat) VCE0 Conditions IC = 150 A VGE = 15 V chiplevel chiplevel rCE VGE = 15 V chiplevel VGE(th) VGE=VCE, IC = 6 mA ICES VGE = 0 V VCE = 1200 V Cies Coes Cres VCE = 25 V VGE = 0 V QG VGE = - 8 V...+ 20 V RGint Tj = 25 °C min. typ. max. Unit Tj = 25 °C 1.71 2.10 V Tj = 125 °C 2.00 2.45 V Tj = 25 °C 1 1.2 V Tj = 125 °C 0.9 1.1 V Tj = 25 °C 4.7 6.0 mΩ 7.3 9.0 mΩ 5.8 6.5 V 2.0 mA Tj = 125 °C 5 Tj = 25 °C Tj = 125 °C mA f = 1 MHz 10.7 nF f = 1 MHz 0.56 nF f = 1 MHz 0.48 nF 1530 nC 5.0 Ω GBD © by SEMIKRON Rev. 1.0 – 06.08.2015 1 SKM200GBD126D Characteristics Symbol td(on) tr Eon td(off) tf Conditions VCC = 600 V IC = 150 A VGE = +15/-15 V RG on = 1.5 Ω RG off = 1.5 Ω Eoff SEMITRANS® 3 Rth(j-c) SKM200GBD126D Preliminary Data rF Features • Trench = Trenchgate technology • VCE(sat) with positive temperature coefficient • High short circuit capability, self limiting to 6 x IC • UL recognized, file no. E63532 Typical Applications* • Current source inverter Remarks • The Fig.1 to Fig.9 are based on measurements of the SKM200GB126D • The series diodes (FWD) have the data of the inverse diodes of the SKM300GB126D IRRM Qrr Err Rth(j-c) chiplevel IF = 15 A di/dtoff = 150 A/µs VGE = -15 V VCC = 600 V per diode Freewheeling diode VF = VEC IF = 200 A VGE = 0 V chiplevel VF0 chiplevel rF IRRM Qrr Err Rth(j-c) typ. chiplevel max. Unit 260 ns Tj = 125 °C 40 ns Tj = 125 °C 18 mJ Tj = 125 °C 540 ns Tj = 125 °C 110 ns Tj = 125 °C 24 mJ per IGBT Inverse diode VF = VEC IF = 30 A VGE = 0 V chiplevel VF0 chiplevel Trench IGBT Modules min. Tj = 125 °C 0.13 K/W Tj = 25 °C 2.00 2.50 V Tj = 125 °C 1.80 2.30 V Tj = 25 °C 1.1 1.45 V Tj = 125 °C 0.85 1.2 V Tj = 25 °C 30 35 mΩ 37 mΩ Tj = 125 °C 32 Tj = 125 °C 12 Tj = 125 °C 1 A µC Tj = 125 °C mJ 1.5 K/W Tj = 25 °C 1.60 1.80 V Tj = 125 °C 1.60 1.80 V Tj = 25 °C 1 1.1 V Tj = 125 °C 0.8 0.9 V Tj = 25 °C 3.0 3.5 mΩ Tj = 125 °C 4.0 4.5 mΩ IF = 200 A Tj = 125 °C di/dtoff = 6200 A/µs T = 125 °C j VGE = ±15 V T j = 125 °C VCC = 600 V per Diode 290 A 44 µC 18 mJ 15 nH TC = 25 °C 0.35 mΩ TC = 125 °C 0.5 mΩ 0.25 K/W Module LCE RCC'+EE' terminal-chip Rth(c-s) per module Ms to heat sink M6 Mt 0.02 to terminals M6 0.038 K/W 3 5 Nm 2.5 5 Nm Nm w 325 g GBD 2 Rev. 1.0 – 06.08.2015 © by SEMIKRON SKM200GBD126D Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC) Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG) Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic © by SEMIKRON Rev. 1.0 – 06.08.2015 3 SKM200GBD126D Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG Fig. 9: Transient thermal impedance of IGBT Zthp(j-c) = f (tp); D = tp/tc = tp*f Fig. 10: Transient thermal impedance of FWD Zthp(j-c)=f(tp): D=tp/tc=tp*f Fig. 11: CAL diode forward characteristic Fig. 12: Typ. CAL diode peak reverse recovery current 4 Rev. 1.0 – 06.08.2015 © by SEMIKRON SKM200GBD126D SEMITRANS 3 GBD This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff. © by SEMIKRON Rev. 1.0 – 06.08.2015 5