AOS Semiconductor Product Reliability Report AOI418, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOI418. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOI418 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOI418 uses advanced trench technology to provide excellent RDS(ON), low gate charge and low gate resistance. With the excellent thermal resistance of the IPAK (TO251A) package, this device is well suited for high current load applications. -RoHS Compliant -Halogen Free Detailed refer to the datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Moisture Level AOI418 Standard sub-micron Low voltage N channel process 3 leads TO251A Bare Cu Soft solder Al & Au wire Epoxy resin with silica filler Up to Level 1 * Note * based on info provided by assembler and mold compound supplier 2 III. Result of Reliability Stress for AOI418 Test Item Test Condition Time Point Lot Attribution Total Sample size Number of Failures Solder Reflow Precondition HTGB 168hr 85°°c /85%RH +3 cycle reflow@260°°c - 3 lots 495pcs 0 JESD22A113 Temp = 150°°c , Vgs=100% of Vgsmax 168hrs 500 hrs 1000 hrs 2 lots 1 lot 1 lot 308pcs 0 JESD22A108 HTRB Temp = 150°°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs (Note A*) 2 lots 1 lot 1 lot 77 pcs / lot 308pcs 0 JESD22A108 HAST 130 +/- 2°°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121°°c , 29.7psi, RH=100% 100 hrs (Note A*) 3 lots 77 pcs / lot 165pcs 0 JESD22A110 (Note A*) 55 pcs / lot 0 JESD22A102 0 JESD22A104 Pressure Pot 96 hrs 3 lots (Note A*) Temperature Cycle -65°°c to 150°°c , air to air 250 / 500 cycles 3 lots (Note A*) 165pcs Standard 55 pcs / lot 165pcs 55 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 13 MTTF = 9101 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOI418). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (2x77x168+2x2x77x500) x258] = 13 9 7 MTTF = 10 / FIT = 7.97 x 10 hrs = 9101 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10 -5eV / K 3