INTERSIL ISL28290FUZ

ISL28190, ISL28290
®
Data Sheet
August 11, 2008
Single and Dual Single Supply Ultra-Low
Noise, Ultra-Low Distortion, Rail-to-Rail
Output, Op Amp
The ISL28190 and ISL28290 are tiny single and dual
ultra-low noise, ultra-low distortion operational amplifiers.
Fully specified to operated down to +3V single supply. These
amplifiers have outputs that swing rail-to-rail, and an input
common mode voltage that extends below ground (ground
sensing).
The ISL28190 and ISL28290 are unity gain stable with an
input referred voltage noise of 1nV/√Hz. Both parts feature
0.00017% THD+N @ 1kHz.
FN6247.8
Features
• 1nV/√Hz input voltage noise
• 1kHz THD+N typical 0.00017% at 2VP-P VOUT
• Harmonic Distortion -87dBc, -90dBc, fo = 1MHz
• 170MHz -3dB bandwidth
• 50V/µs slew rate
• 700µV maximum offset voltage
• 10µA typical input bias current
• 103dB typical CMRR
• 3V to 5.5V single supply voltage range
The ISL28190 is available in the space-saving 6 Ld µTDFN
(1.6mmx1.6mm) and 6 Ld SOT-23 packages. The ISL28290
is available in the 10 Ld µTQFN (1.8mmx1.4mm) and 10 Ld
MSOP packages. All devices are guaranteed over -40°C to
+125°C.
Ordering Information
PART
NUMBER
PART
MARKING
• Rail-to-rail output
• Ground sensing
• Enable pin (not available in the 8 Ld SOIC package
option)
• Pb-free (RoHS compliant)
PACKAGE
(Pb-free)
PKG.
DWG. #
Applications
• Low noise signal processing
ISL28190FHZ-T7* (Note 1) GABH
6 Ld SOT-23 MDP0038
ISL28190FRUZ-T7* (Note 2) M7
6 Ld µTDFN
ISL28290FUZ (Note 1)
8290Z
10 Ld MSOP MDP0043
• ADC buffers
ISL28290FUZ-T7* (Note 1) 8290Z
10 Ld MSOP MDP0043
• DAC output amplifiers
ISL28290FRUZ-T7* (Note 2) E
10 Ld µTQFN L10.1.8x1.4A
• Digital scales
L6.1.6x1.6A
• Low noise microphones/preamplifiers
28290 FBZ 8 Ld SOIC
MDP0027
• Strain gauges/sensor amplifiers
ISL28290FBZ-T7* (Note 1) 28290 FBZ 8 Ld SOIC
MDP0027
• Radio systems
ISL28290FBZ (Note 1)
ISL28290EVAL1Z
Evaluation Board
• Portable equipment
*Please refer to TB347 for details on reel specifications.
NOTES:
• Infrared detectors
1. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets, molding compounds/die attach materials,
and 100% matte tin plate plus anneal (e3 termination finish, which
is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations). Intersil Pb-free products are MSL classified
at Pb-free peak reflow temperatures that meet or exceed the Pbfree requirements of IPC/JEDEC J STD-020.
2. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets; molding compounds/die attach materials
and NiPdAu plate - e4 termination finish, which is RoHS
compliant and compatible with both SnPb and Pb-free soldering
operations. Intersil Pb-free products are MSL classified at Pb-free
peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2006-2008. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
ISL28190, ISL28290
Pinouts
ISL28190
(6 LD 1.6X1.6X0.5 µTDFN)
TOP VIEW
ISL28190
(6 LD SOT-23)
TOP VIEW
OUT 1
6 V+
IN- 2
4 IN-
IN+ 3
OUT_B
10
9
8
9 OUT_B
+
+
V- 4
ENABLE_A 5
8 IN-_B
IN-_A
7 IN+_B
7
1
6 ENABLE_B
IN+_A
IN-_B
+
+
6 IN+_B
2
3
4
5
ENABLE_B
IN+_A 3
10 V+
ENABLE_A
IN-_A 2
4 V-
ISL28290
(10 LD µTQFN)
TOP VIEW
ISL28290
(10 LD MSOP)
TOP VIEW
OUT_A 1
5 ENABLE
V+
IN+ 3
5 ENABLE
- +
+ -
V-
V- 2
6 V+
OUT_A
OUT 1
ISL28290
(8 LD SOIC)
TOP VIEW
OUT_A 1
IN-_A 2
IN+_A 3
V- 4
2
8 V+
7 OUT_B
+
+
6 IN-_B
5 IN+_B
FN6247.8
August 11, 2008
ISL28190, ISL28290
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V
Supply Turn On Voltage Slew Rate . . . . . . . . . . . . . . . . . . . . . 1V/µs
Differential Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . V- - 0.5V to V+ + 0.5V
ESD Tolerance
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .300V
Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1200V
Thermal Resistance (typical, Note 3)
θJA (°C/W)
6 Ld SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . .
230
6 Ld µTDFN Package . . . . . . . . . . . . . . . . . . . . . . .
125
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . .
150
10 Ld µTQFN Package . . . . . . . . . . . . . . . . . . . . . .
180
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
125
Ambient Operating Temperature Range . . . . . . . . .-40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . +125°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
3. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
V+ = 5.0V, V- = GND, RL = Open, RF = 1kΩ, AV = -1 unless otherwise specified. Parameters are per amplifier.
Typical values are at V+ = 5V, TA = +25°C. Boldface limits apply over the operating temperature range,
-40°C to +125°C, temperature data established by characterization.
DESCRIPTION
CONDITIONS
MIN
(Note 4)
TYP
-1100
240
MAX
(Note 4)
UNIT
DC SPECIFICATIONS
VOS
Input Offset Voltage
ΔV OS
--------------ΔT
Input Offset Drift vs Temperature
IIO
Input Offset Current
40
500
900
nA
IB
Input Bias Current
10
16
18
µA
VCM
Common-Mode Voltage Range
3.8
V
CMRR
Common-Mode Rejection Ratio
VCM = 0V to 3.8V
78
103
dB
PSRR
Power Supply Rejection Ratio
VS = 3V to 5V
74
80
dB
AVOL
Large Signal Voltage Gain
VO = 0.5V to 4V, RL = 1kΩ
94
90
102
dB
VOUT
Maximum Output Voltage Swing
Output low, RL = 1kΩ
See Figure 21
1.9
0
Output high, RL = 1kΩ, V+ = 5V
700
900
20
4.95
4.92
µV
µV/°C
50
80
4.97
mV
V
IS,ON
Supply Current per Channel,
Enabled
8.5
11
13
mA
IS,OFF
Supply Current, Disabled
26
35
52
µA
IO+
Short-Circuit Output Current
RL = 10Ω
95
90
144
mA
IO-
Short-Circuit Output Current
RL = 10Ω
95
90
135
mA
VSUPPLY
Supply Operating Range
V+ to V-
3
VENH
EN High Level
Referred to V-
2
3
5.5
V
V
FN6247.8
August 11, 2008
ISL28190, ISL28290
Electrical Specifications
PARAMETER
V+ = 5.0V, V- = GND, RL = Open, RF = 1kΩ, AV = -1 unless otherwise specified. Parameters are per amplifier.
Typical values are at V+ = 5V, TA = +25°C. Boldface limits apply over the operating temperature range,
-40°C to +125°C, temperature data established by characterization. (Continued)
DESCRIPTION
CONDITIONS
MIN
(Note 4)
TYP
MAX
(Note 4)
UNIT
0.8
V
VENL
EN Low Level
Referred to V-
IENH
EN Pin Input High Current
VEN = V+
0.8
1.2
1.4
µA
IENL
EN Pin Input Low Current
VEN = V-
20
80
100
nA
RF = 0Ω CL = 20pF, AV = 1, RL = 10kΩ
170
MHz
0.00017
%
-87
dBc
-90
dBc
AC SPECIFICATIONS
GBW
-3dB Unity Gain Bandwidth
THD+N
Total Harmonic Distortion + Noise f = 1kHz, VOUT + 2VP-P, AV = +1, RL = 10kΩ
HD
(1MHz)
2nd Harmonic Distortion
VOUT = 2VP-P, AV = 1
3rd Harmonic Distortion
ISO
Off-state Isolation
fO = 100kHz
AV = +1; VIN = 100mVP-P; RF = 0Ω, CL = 20pF,
AV = 1, RL = 10kΩ
-38
dB
X-TALK
ISL28290
Channel-to-Channel Crosstalk
fO = 100kHz
VS = ±2.5V; AV = +1; VIN = 1VP-P, RF = 0Ω,
CL = 20pF, AV = 1, RL = 10kΩ
-105
dB
PSRR
Power Supply Rejection Ratio
fO = 100kHz
VS = ±2.5V; AV = +1; VSOURCE = 1VP-P, RF = 0Ω,
CL = 20pF, AV = 1, RL = 10kΩ
-70
dB
CMRR
Common Mode Rejection Ratio
fO = 100kHz
VS = ±2.5V; AV = +1; VCM = 1VP-P, RF = 0Ω,
CL = 20pF, AV = 1, RL = 10kΩ
-65
dB
en
Input Referred Voltage Noise
fO = 1kHz
1
nV/√Hz
in
Input Referred Current Noise
fO = 10kHz
2.1
pA/√Hz
50
V/µs
TRANSIENT RESPONSE
SR
Slew Rate
30
25
tpd
Propagation Delay
10% VIN - 10% VOUT
AV = 1, VOUT = 100mVP-P, RF = 0Ω, CL = 1.2pF
1.0
ns
tr, tf, Small
Signal
Rise Time, tr 10% to 90%
AV = +1, VOUT = 0.1VP-P, RF = 0Ω, CL = 1.2pF
3.3
ns
6.3
ns
tr, tf Large
Signal
Rise Time, tr 10% to 90%
AV = +2, VOUT = 1VP-P, RF = RG = 499Ω, RL = 10kΩ,
CL = 1.2pF
44
ns
51
ns
AV = +2, VOUT = 4.7VP-P, RF = RG = 499Ω,
RL = 10kΩ, CL = 1.2pF
190
ns
187
ns
45
ns
Fall Time, tf 10% to 90%
Fall Time, tf 10% to 90%
Rise Time, tr 10% to 90%
Fall Time, tf 10% to 90%
AV = 1, VOUT = 1VP-P, RF = 0Ω, CL = 1.2pF
ts
Settling Time to 0.1%
90% VOUT to 0.1% VOUT
tEN
ENABLE to Output Turn-on Delay AV = 1, VOUT = 1VDC, RL = 10kΩ, CL = 1.2pF
Time; 10% EN - 10% VOUT
330
ns
ENABLE to Output Turn-off Delay AV = 1, VOUT = 0VDC, RL = 10kΩ, CL = 1.2pF
Time; 10% EN - 10% VOUT
50
ns
NOTE:
4. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
4
FN6247.8
August 11, 2008
ISL28190, ISL28290
Typical Performance Curves
10
2
CLOSED LOOP GAIN (dB)
0
CLOSED LOOP GAIN (dB)
RL = 100k
1
RL = 10k
-1
RL = 100
-2
-3
-4
RL = 1k
-5
V+ = 5V
-6 AV = +1
C = 10pF
-7 V L
OUT = 10mVP-P
-8
100k
1M
100M
10M
1G
8
CL = 110pF
6
CL = 92pF
4
CL = 57pF
2
CL = 32pF
0
CL = 20pF
-2
-4
V+ = 5V
-6 AV = +1
R = 10kΩ
-8 V L
OUT = 10mVP-P
-10
10k
100k
FIGURE 1. GAIN vs FREQUENCY FOR VARIOUS RLOAD
VOUT = 1VP-P
GAIN (dB)
CLOSED LOOP GAIN (dB)
60
-2
VOUT = 100mVP-P
-3
-4
-5
-6
-7
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
AV = 10, RF = 4.42k, RG = 499
10
0
1M
100k
10M
100M
AV = 1, RF = 0, RG = INF
-10
10k
1G
100k
1M
10M
100M
FREQUENCY (Hz)
FIGURE 3. -3dB BANDWIDTH vs VOUT
FIGURE 4. FREQUENCY RESPONSE vs CLOSED LOOP GAIN
1M
1M
100k
OUTPUT IMPEDANCE (Ω)
INPUT IMPEDANCE (Ω)
VOUT = 100mVP-P
30
FREQUENCY (Hz)
10k
1k
100
1G
AV = 1000, RF = 499k, RG = 499 V+ = 5V
RL = 10k
50 AV = 100,
RF = 49.9k, RG = 499
40
20
VOUT = 10mVP-P
-8
10k
100M
70
0
-1
10M
FIGURE 2. GAIN vs FREQUENCY FOR VARIOUS CLOAD
VOUT = 1mVP-P
1
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
2
CL = 1pF
V+ = 5V, 3V
ENABLED AND
DISABLED
VSOURCE = 1VP-P
10
100k
1M
100k
10k
1k
100
V+ = 5V, 3V
VSOURCE = 1VP-P
10M
100M
1G
FREQUENCY (Hz)
FIGURE 5. INPUT IMPEDANCE vs FREQUENCY
5
10
100k
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 6. DISABLED OUTPUT IMPEDANCE vs FREQUENCY
FN6247.8
August 11, 2008
ISL28190, ISL28290
Typical Performance Curves (Continued)
0
100
V+ = 5V, 3V
-10
OUTPUT IMPEDANCE (Ω)
-20
10
-30
CMRR (dB)
-40
1
-50
-60
-70
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
VCM = 100mVP-P
-80
0.1
-90
-100
0.01
100k
1M
10M
100M
-110
1k
1G
10k
100k
0
PSRR (dB)
-30
-10
-40
PSRR+
-50
-60
-70
VP-P = 100mV
-30
-40
-50
-60
-80
10k
100k
1M
FREQUENCY (Hz)
10M
-80
10k
100M
FIGURE 9. PSRR vs FREQUENCY
VP-P = 10mV
100k
1M
10M
FREQUENCY (Hz)
100M
1G
FIGURE 10. OFF ISOLATION vs FREQUENCY
0.1
-20
V+ = 5V
RL = 10k
-30
THD + NOISE (%)
-40
CROSSTALK (dB)
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
-70
-90
1k
100M
VP-P = 1V
-20
PSRR-
OFF ISOLATION (dB)
-20
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
VSOURCE = 100mVP-P
10M
FIGURE 8. CMRR vs FREQUENCY
FIGURE 7. ENABLED OUTPUT IMPEDANCE vs FREQUENCY
-10
1M
FREQUENCY (Hz)
FREQUENCY (Hz)
-50
-60
-70
VP-P = 1V
-80
RF = 0, AV = 1
VOUT = 2VP-P
400Hz TO 22kHz FILTER
0.01
0.001
-90
-100
-110
-120
10k
100k
1M
10M
FREQUENCY (Hz)
100M
FIGURE 11. CHANNEL-TO-CHANNEL CROSSTALK vs
FREQUENCY
6
1G
0.0001
0
2k
4k
6k
8k 10k 12k 14k 16k 18k 20k
FREQUENCY (Hz)
FIGURE 12. THD+N vs FREQUENCY
FN6247.8
August 11, 2008
ISL28190, ISL28290
Typical Performance Curves (Continued)
10
V+ = 5V
RL = 10k
RF = 0, AV = 1
FREQUENCY= 1kHz
400Hz TO 22kHz FILTER
1
THD + NOISE (%)
INPUT VOLTAGE NOISE (nV/√Hz)
10
0.1
0.01
0.001
0.0001
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
1
0.1
0.1
4.0
1
10
1k
10k
100k
FIGURE 14. INPUT REFERRED NOISE VOLTAGE vs
FREQUENCY
FIGURE 13. THD+N @ 1kHz vs VOUT
1000
5
V+ = 5V
AV = +1
RL = 10kΩ
CL = 10pF
VIN = 1VDC
EN INPUT
4
100
VOLTS (V)
CURRENT NOISE (pA/√Hz)
100
FREQUENCY (Hz)
VOUT (VP-P)
3
2
10
ENABLE
DISABLE
ENABLE
1
OUTPUT
1
0.1
1
10
100
1k
10k
0
100k
-1
0
1
0.08
0.8
0.06
0.6
VOUT
0.02
VIN
0
-0.02
V+ = ±2.5V
AV = +1
RL = 10kΩ
VOUT = 100mVP-P
-0.04
-0.06
-0.08
0
20
40
60
80
100 120 140 160 180 200
TIME (ns)
FIGURE 17. SMALL SIGNAL STEP RESPONSE
7
4
3
FIGURE 16. ENABLE/DISABLE TIMING
LARGE SIGNAL (V)
SMALL SIGNAL (V)
FIGURE 15. INPUT REFERRED NOISE CURRENT vs
FREQUENCY
0.04
2
TIME (µs)
FREQUENCY (Hz)
VOUT
0.4
VIN
0.2
0
-0.2
V+ = ±2.5V
AV = +2
RF = RG = 499Ω
RL = 10kΩ
VOUT = 1VP-P
-0.4
-0.6
-0.8
0
100
200
300
400 500
TIME (ns)
600
700
800
FIGURE 18. LARGE SIGNAL (1V) STEP RESPONSE
FN6247.8
August 11, 2008
ISL28190, ISL28290
Typical Performance Curves (Continued)
3
6.0
VOUT
VIN
MAX
1
0
V+ = ±2.5V
AV = +2
RF = RG = 499Ω
RL = 10kΩ
VOUT = 4.7VP-P
-1
-2
0
400
800
5.0
CURRENT (mA)
LARGE SIGNAL (V)
2
-3
n = 50
5.5
MEDIAN
4.5
4.0
MIN
3.5
3.0
1200
1600
2.5
-40
2000
-20
0
TIME (ns)
FIGURE 19. LARGE SIGNAL (4.7V) STEP RESPONSE
600
20
40
60
80
TEMPERATURE (°C)
120
FIGURE 20. SUPPLY CURRENT vs TEMPERATURE,
VS = ±2.5V ENABLED, RL = INF
-9
n = 50
n = 50
500
MAX
400
-10
MAX
300
200
MEDIAN
IBIAS+ (µA)
VOS (µV)
100
100
0
-100
-11
-12
MEDIAN
-13
-200
MIN
MIN
-300
-14
-400
-500
-40
-20
0
20
40
60
80
100
-15
-40
120
-20
0
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 21. VOS vs TEMPERATURE VS = ±2.5V
-9
20
FIGURE 22. IBIAS+ vs TEMPERATURE VS = ±2.5V
800
n = 50
n = 50
-10
600
MAX
400
IIO (nA)
IBIAS- (µA)
-11
MEDIAN
-12
-13
MAX
200
0 MEDIAN
MIN
-14
-200
-15
-40
-400
-40
MIN
-20
0
20
40
60
80
TEMPERATURE (°C)
100
120
FIGURE 23. IBIAS- vs TEMPERATURE VS = ±2.5V
8
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 24. IIO vs TEMPERATURE VS = ±2.5V
FN6247.8
August 11, 2008
ISL28190, ISL28290
Typical Performance Curves (Continued)
140
83
n = 50
MEDIAN
81
PSRR (dB)
CMRR (dB)
120
110
100
MIN
90
MAX
80
79
MEDIAN
78
77
MIN
80
70
n = 50
82
MAX
130
76
-40
-20
0
20
40
60
80
100
75
-40
120
-20
0
TEMPERATURE (°C)
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 26. PSRR vs TEMPERATURE ±1.5V TO ±2.5V
FIGURE 25. CMRR vs TEMPERATURE, VCM = 3.8V,
VS = ±2.5V
4.982
50
n = 50
n = 50
4.980
45
4.978
MAX
40
VOUT (mV)
VOUT (V)
4.976
4.974
4.972
MEDIAN
4.970
MAX
35
30
MEDIAN
25
MIN
4.968
MIN
20
4.966
15
4.964
4.962
-40
-20
0
20
40
60
80
100
10
-40
120
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 28. NEGATIVE VOUT vs TEMPERATURE RL = 1k,
VS = ±2.5V
FIGURE 27. POSITIVE VOUT vs TEMPERATURE RL = 1k,
VS = ±2.5V
Pin Descriptions
ISL28190
ISL28190
ISL28290
ISL28290
ISL28290
(6 Ld SOT-23) (6 Ld µTDFN) (10 Ld MSOP) (10 Ld µTQFN) (8 Ld SOIC)
4
2
2 (A)
8 (B)
1 (A)
7 (B)
2 (A)
6 (B)
PIN
NAME
ININ-_A
IN-_B
EQUIVALENT
CIRCUIT
FUNCTION
Inverting input
V+
IN-
IN+
VCircuit 1
3
2
3 (A)
7 (B)
2 (A)
6 (B)
3 (A)
5 (B)
IN+
IN+_A
IN+_B
4
3
4
V-
3
4
9
Non-inverting
input
(See Circuit 1)
Negative supply
FN6247.8
August 11, 2008
ISL28190, ISL28290
Pin Descriptions (Continued)
ISL28190
ISL28190
ISL28290
ISL28290
ISL28290
(6 Ld SOT-23) (6 Ld µTDFN) (10 Ld MSOP) (10 Ld µTQFN) (8 Ld SOIC)
1
1
1 (A)
9 (B)
10 (A)
8 (B)
1 (A)
7 (B)
PIN
NAME
EQUIVALENT
CIRCUIT
FUNCTION
Output
OUT
OUT_A
OUT_B
V+
OUT
VCircuit 2
6
6
5
5
10
9
5 (A)
6 (B)
4 (A)
5 (B)
8
V+
N/A
EN
EN_A
EN_B
Positive supply
Enable BAR pin
internal pull-down;
Logic “1” selects
the disabled state;
Logic “0” selects
the enabled state.
V+
EN
VCircuit 3
Applications Information
Product Description
The ISL28190 and ISL28290 are voltage feedback operational
amplifiers designed for communication and imaging
applications requiring low distortion, very low voltage and
current noise. Both parts feature high bandwidth while drawing
moderately low supply current. The ISL28190 and ISL28290
use a classical voltage-feedback topology, which allows them to
be used in a variety of applications where current-feedback
amplifiers are not appropriate because of restrictions placed
upon the feedback element used with the amplifier.
Enable/Power-Down
The ISL28190 and ISL28290 amplifiers are disabled by
applying a voltage greater than 2V to the EN pin, with
respect to the V- pin. In this condition, the output(s) will be in
a high impedance state and the amplifier(s) current will be
reduced to 13µA/Amp. By disabling the part, multiple parts
can be connected together as a MUX. The outputs are tied
together in parallel and a channel can be selected by the EN
pin. The EN pin also has an internal pull-down. If left open,
the EN pin will pull to the negative rail and the device will be
enabled by default.
Input Protection
All input terminals have internal ESD protection diodes to both
positive and negative supply rails, limiting the input voltage to
within one diode beyond the supply rails. Both parts have
additional back-to-back diodes across the input terminals
(as shown in Figure 29). In pulse applications where the input
Slew Rate exceeds the Slew Rate of the amplifier, the
possibility exists for the input protection diodes to become
forward biased. This can cause excessive input current and
distortion at the outputs. If overdriving the inputs is necessary,
the external input current must never exceed 5mA. An
10
external series resistor may be used to limit the current, as
shown in Figure 29.
R
+
FIGURE 29. LIMITING THE INPUT CURRENT TO LESS THAN
5mA
Using Only One Channel
The ISL28290 is a Dual channel op amp. If the application
only requires one channel when using the ISL28290, the
user must configure the unused channel to prevent it from
oscillating. Oscillation can occur if the input and output pins
are floating. This will result in higher than expected supply
currents and possible noise injection into the channel being
used. The proper way to prevent this oscillation is to short
the output to the negative input and ground the positive input
(as shown in Figure 30).
+
FIGURE 30. PREVENTING OSCILLATIONS IN UNUSED
CHANNELS
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Low
impedance ground plane construction is essential. Surface
mount components are recommended, but if leaded
components are used, lead lengths should be as short as
possible. The power supply pins must be well bypassed to
FN6247.8
August 11, 2008
ISL28190, ISL28290
reduce the risk of oscillation. The combination of a 4.7µF
tantalum capacitor in parallel with a 0.01µF capacitor has
been shown to work well when placed at each supply pin.
where:
For good AC performance, parasitic capacitance should be
kept to a minimum, especially at the inverting input. When
ground plane construction is used, it should be removed
from the area near the inverting input to minimize any stray
capacitance at that node. Carbon or Metal-Film resistors are
acceptable with the Metal-Film resistors giving slightly less
peaking and bandwidth because of additional series
inductance. Use of sockets, particularly for the SO package,
should be avoided if possible. Sockets add parasitic
inductance and capacitance, which will result in additional
peaking and overshoot.
• PDMAX for each amplifier can be calculated as follows:
• PDMAXTOTAL is the sum of the maximum power
dissipation of each amplifier in the package (PDMAX)
V OUTMAX
PD MAX = 2*V S × I SMAX + ( V S - V OUTMAX ) × ---------------------------RL
(EQ. 2)
where TMAX = Maximum ambient temperature
• θJA = Thermal resistance of the package
• PDMAX = Maximum power dissipation of 1 amplifier
• VS = Supply voltage
• IMAX = Maximum supply current of 1 amplifier
Current Limiting
The ISL28190 and ISL28290 have no internal currentlimiting circuitry. If the output is shorted, it is possible to
exceed the Absolute Maximum Rating for output current or
power dissipation, potentially resulting in the destruction of
the device. This is why output short circuit current is
specified and tested with RL = 10Ω.
• VOUTMAX = Maximum output voltage swing of the
application
• RL = Load resistance
Power Dissipation
It is possible to exceed the +125°C maximum junction
temperatures under certain load and power-supply
conditions. It is therefore important to calculate the
maximum junction temperature (TJMAX) for all applications
to determine if power supply voltages, load conditions, or
package type need to be modified to remain in the safe
operating area. These parameters are related as follows:
T JMAX = T MAX + ( θ JA xPD MAXTOTAL )
11
(EQ. 1)
FN6247.8
August 11, 2008
ISL28190, ISL28290
SOT-23 Package Family
MDP0038
SOT-23 PACKAGE FAMILY
e1
MILLIMETERS
D
SYMBOL
A
6
N
4
E1
2
E
3
0.15 C D
1
2X
2
3
0.20 C
5
2X
e
0.20 M C A-B D
B
b
NX
0.15 C A-B
1
SOT23-6
TOLERANCE
A
1.45
1.45
MAX
A1
0.10
0.10
±0.05
A2
1.14
1.14
±0.15
b
0.40
0.40
±0.05
c
0.14
0.14
±0.06
D
2.90
2.90
Basic
E
2.80
2.80
Basic
E1
1.60
1.60
Basic
e
0.95
0.95
Basic
e1
1.90
1.90
Basic
L
0.45
0.45
±0.10
L1
0.60
0.60
Reference
N
5
6
Reference
Rev. F 2/07
3
NOTES:
D
2X
SOT23-5
1. Plastic or metal protrusions of 0.25mm maximum per side are not
included.
C
A2
SEATING
PLANE
2. Plastic interlead protrusions of 0.25mm maximum per side are not
included.
3. This dimension is measured at Datum Plane “H”.
A1
0.10 C
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Index area - Pin #1 I.D. will be located within the indicated zone
(SOT23-6 only).
NX
6. SOT23-5 version has no center lead (shown as a dashed line).
(L1)
H
A
GAUGE
PLANE
c
L
12
0.25
0° +3°
-0°
FN6247.8
August 11, 2008
ISL28190, ISL28290
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
A
A
E
6
B
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
4
MILLIMETERS
D
PIN 1
REFERENCE
2X
0.15 C
1
2X
L6.1.6x1.6A
3
MIN
NOMINAL
MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
0.127 REF
A3
0.15 C
A1
TOP VIEW
e
1.00 REF
4
6
L
CO.2
D2
SYMBOL
b
0.15
0.20
0.25
-
D
1.55
1.60
1.65
4
D2
0.40
0.45
0.50
-
E
1.55
1.60
1.65
4
E2
0.95
1.00
1.05
-
0.50 BSC
e
DAP SIZE 1.30 x 0.76
L
3
1
b 6X
0.10 M C A B
E2
-
0.25
0.30
0.35
Rev. 1 6/06
NOTES:
1. Dimensions are in mm. Angles in degrees.
BOTTOM VIEW
2. Coplanarity applies to the exposed pad as well as the terminals.
Coplanarity shall not exceed 0.08mm.
DETAIL A
6X
0.10 C
3. Warpage shall not exceed 0.10mm.
0.08 C
4. Package length/package width are considered as special
characteristics.
5. JEDEC Reference MO-229.
A3
SIDE VIEW
C
SEATING
PLANE
6. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
0.127±0.008
0.127 +0.058
-0.008
TERMINAL THICKNESS
A1
DETAIL A
0.25
0.50
1.00
0.45
1.00
2.00
0.30
1.25
LAND PATTERN
13
6
FN6247.8
August 11, 2008
ISL28190, ISL28290
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
6
INDEX AREA
A
L10.1.8x1.4A
B
N
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
MILLIMETERS
E
SYMBOL
2X
MIN
NOMINAL
MAX
NOTES
0.10 C
1
2X
2
0.10 C
TOP VIEW
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.10 C
C
A
0.05 C
A
0.127 REF
0.15
0.20
0.25
5
D
1.75
1.80
1.85
-
E
1.35
1.40
1.45
-
e
SEATING PLANE
A1
SIDE VIEW
(DATUM A)
PIN #1 ID
NX L
1
NX b 5
10X
0.10 M C A B
0.05 M C
2
L1
5
(DATUM B)
7
-
b
0.40 BSC
-
L
0.35
0.40
0.45
L1
0.45
0.50
0.55
-
N
10
2
Nd
2
3
Ne
3
3
θ
0
-
12
4
Rev. 3 6/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
e
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
BOTTOM VIEW
4. All dimensions are in millimeters. Angles are in degrees.
NX (b)
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
CL
(A1)
5
L
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
SECTION "C-C"
e
8. Maximum allowable burrs is 0.076mm in all directions.
TERMINAL TIP
C C
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
2.20
1.00
0.60
1.00
0.50
1.80
0.40
0.20
0.20
0.40
10 LAND PATTERN
14
FN6247.8
August 11, 2008
ISL28190, ISL28290
Small Outline Package Family (SO)
A
D
h X 45°
(N/2)+1
N
A
PIN #1
I.D. MARK
E1
E
c
SEE DETAIL “X”
1
(N/2)
B
L1
0.010 M C A B
e
H
C
A2
GAUGE
PLANE
SEATING
PLANE
A1
0.004 C
0.010 M C A B
L
b
0.010
4° ±4°
DETAIL X
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
INCHES
SYMBOL
SO-14
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
TOLERANCE
NOTES
A
0.068
0.068
0.068
0.104
0.104
0.104
0.104
MAX
-
A1
0.006
0.006
0.006
0.007
0.007
0.007
0.007
±0.003
-
A2
0.057
0.057
0.057
0.092
0.092
0.092
0.092
±0.002
-
b
0.017
0.017
0.017
0.017
0.017
0.017
0.017
±0.003
-
c
0.009
0.009
0.009
0.011
0.011
0.011
0.011
±0.001
-
D
0.193
0.341
0.390
0.406
0.504
0.606
0.704
±0.004
1, 3
E
0.236
0.236
0.236
0.406
0.406
0.406
0.406
±0.008
-
E1
0.154
0.154
0.154
0.295
0.295
0.295
0.295
±0.004
2, 3
e
0.050
0.050
0.050
0.050
0.050
0.050
0.050
Basic
-
L
0.025
0.025
0.025
0.030
0.030
0.030
0.030
±0.009
-
L1
0.041
0.041
0.041
0.056
0.056
0.056
0.056
Basic
-
h
0.013
0.013
0.013
0.020
0.020
0.020
0.020
Reference
-
16
20
24
28
Reference
-
N
SO-8
SO16
(0.150”)
8
14
16
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
15
FN6247.8
August 11, 2008
ISL28190, ISL28290
Mini SO Package Family (MSOP)
0.25 M C A B
D
MINI SO PACKAGE FAMILY
(N/2)+1
N
E
MDP0043
A
E1
MILLIMETERS
PIN #1
I.D.
1
B
(N/2)
e
H
C
SEATING
PLANE
0.10 C
N LEADS
SYMBOL
MSOP8
MSOP10
TOLERANCE
NOTES
A
1.10
1.10
Max.
-
A1
0.10
0.10
±0.05
-
A2
0.86
0.86
±0.09
-
b
0.33
0.23
+0.07/-0.08
-
c
0.18
0.18
±0.05
-
D
3.00
3.00
±0.10
1, 3
E
4.90
4.90
±0.15
-
E1
3.00
3.00
±0.10
2, 3
e
0.65
0.50
Basic
-
L
0.55
0.55
±0.15
-
L1
0.95
0.95
Basic
-
N
8
10
Reference
-
0.08 M C A B
b
Rev. D 2/07
NOTES:
1. Plastic or metal protrusions of 0.15mm maximum per side are not
included.
L1
2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
A
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
c
SEE DETAIL "X"
A2
GAUGE
PLANE
A1
L
0.25
3° ±3°
DETAIL X
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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16
FN6247.8
August 11, 2008